A thermosetting adhesive sheet capable of reducing semiconductor wafer warping and chipping and a method for manufacturing a semiconductor device includes a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing an epoxy compound and a curing agent, a total value obtained by multiplying the reciprocal of epoxy equivalent of the epoxy compound by content of the epoxy compound in the resin component being 1.15E−04 or more, and blending amount of the filler being 50 pts. mass or more with respect to 100 pts. mass of the resin component; the thermosetting adhesive sheet is applied to a ground surface of a semiconductor and cured before dicing.

A thermosetting adhesive sheet capable of reducing semiconductor wafer warping and chipping and a method for manufacturing a semiconductor device includes a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing an epoxy compound and a curing agent, a total value obtained by multiplying the reciprocal of epoxy equivalent of the epoxy compound by content of the epoxy compound in the resin component being 1.15E−04 or more, and blending amount of the filler being 50 pts. mass or more with respect to 100 pts. mass of the resin component; the thermosetting adhesive sheet is applied to a ground surface of a semiconductor and cured before dicing.

An adherable element is disclosed, comprising a decorative element having a support surface, and a pressure activated adhesive system pre-coated on the support surface of the decorative element for adhering the decorative element to a surface, the adhesive remaining uncured until activated by application of a threshold pressure. The adhesive comprises a matrix comprising a hardener and a plurality of microcapsules filled with an adhesive resin, the microcapsules being configured to rupture on application of the threshold pressure, thereby exposing the resin to the matrix and allowing the resin to react with the hardener to form an adhesive bond between the decorative element and the surface. The matrix may further comprise a rheology additive such that the matrix has a higher viscosity than the hardener at room temperature. Methods of making an adherable element, and decorative articles comprising the adherable element are also disclosed.

A conductive paste for an electrolytic capacitor used for connecting a cathode part and a cathode lead terminal of the electrolytic capacitor. The conductive paste includes a thermosetting resin, and conductive particles, and the conductive particles include flaky metal particles and acicular conductive particles. The content of the conductive particles in the conductive paste is, for example, 50 mass % or more and 70 mass % or less, and the mass ratio of the flaky metal particles to the total of the flaky metal particles and the acicular conductive particles is, for example, 60% or more and 80% or less.

A vehicular camera includes an imager printed circuit board and a lens having a plurality of optical elements. The lens is held in optical alignment with an imager at the imager printed circuit board via a dual cure one-part, filled adhesive that in its uncured state has an epoxy resin. The adhesive is both UV-curable and thermal-curable. A flexible electrical ribbon cable electrically connects circuitry of the imager printed circuit board with additional circuitry of the vehicular camera. Image data captured by the imager is provided to the additional circuitry of the vehicular camera via the flexible electrical ribbon cable. The additional circuitry includes at least a processor for processing image data captured by the imager and provided to the additional circuitry via the flexible electrical ribbon cable. The vehicular camera, when installed and used in a vehicle, captures image data for use by a vision system of the vehicle.

An adhesive for an endoscope, the adhesive including (A) an epoxy resin including at least one epoxy resin of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a phenol novolac epoxy resin, (B) a curing component including at least one of a phosphorus-containing compound, a polythiol compound, a dicyandiamide compound, a phenol compound, or a polyether-polyamine compound, and (C) an inorganic amphoteric ion exchanger; and a cured product of the adhesive. An endoscope including the cured product fixed, and a method for producing the endoscope.

Provided are: a structure adhesive composition which exhibits favorable thread breakage and improves shower resistance, and prevents stringiness when stitch-coating is performed; a method for producing a vehicle structure using the same; and a vehicle structure. A structure adhesive composition exhibiting favorable thread breakage, the structure adhesive composition being a structure adhesive composition containing no liquid rubber component, the structure adhesive composition contains: (A) an epoxy resin in which rubber particles are dispersed as primary particles; and (B) an epoxy resin latent curing agent; a compounded proportion of the rubber particles in the structure adhesive composition is from 10 to 45 mass %; and a viscosity at 50° C. of the structure adhesive composition is from 190 to 380 (Pa.Math.s) when a shearing speed is 5 (sec.sup.−1) and is from 1 to 30 (Pa.Math.s) when the shearing speed is 200 (sec.sup.−1).

In an additive for an epoxy adhesive and an epoxy adhesive composition for construction including same, the additive for an epoxy adhesive is formed by atomic transfer radical polymerization (ATRP) of a polyacrylate of which one terminal is halogenated, as an arm-polymer, and a diacrylate-based compound or a dimethacrylate-based compound, as a cross-linker, and comprises a star polymer of a star-shape having a core/shell structure including a core formed by the polymerization of the cross-linker and a shell formed by a portion of the arm-polymer.

The instant disclosure describes vehicle centric logistics management systems and methods that leverage the unique positions of shipping vehicles to improve supply chain performance. In some example, vehicles are equipped with improved wireless sensing technologies that facilitate the ability to manage inventories in realtime. In addition, the pervasive presence of shipping vehicles across supply chains enables vehicle centric collection and analysis of local data to improve realtime decision-making.

A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.