Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.

The invention pertains to a non-reactive hot-melt adhesive comprising 10-90 wt. %, calculated on the weight of the adhesive, of amorphous thermoplastic resin which is compatible with polylactic acid, wherein the amorphous thermoplastic resin is a random copolymer of lactic acid and further reactive monomer, 10-90 wt. %, calculated on the weight of the adhesive, of a polylactic acid polymer unit (PLAU) selected from poly-L-lactic acid (PLLAU) and poly-D-lactic acid (PDLAU), the unit having a number average molecular weight of at least 0.75 kg/mol.

Optically clear curable adhesive films that are heat conformable prior to setting include a reactive composition. The curable films are flexible and free-standing, and have a complex viscosity of greater than 100,000 poise (10,000 Pascal seconds) at 25° C. and less than 100 poise (10 Pascal seconds) at 85° C., prior to setting. The set film has an adhesive shear strength of greater than 100 Newtons per square centimeter (N/cm.sup.2) to a glass substrate when measured according to the Shear Adhesion Test Method. The reactive composition includes an ethylenically unsaturated polyester-containing oligomeric composition that is the reaction product of a saturated, amorphous co-polyester polyol and a compound with a terminal polyol-reactive group and a terminal ethylenically unsaturated group, a (meth)acrylate functional material, and at least one initiator.

Adhesives including a polyester at 20 to 50 weight percent, a first tackifier at 30 to 60 weight percent, and a first olefin-styrene block copolymer at 5 to 30 weight percent are described. The polyester has a glass transition temperature between −40° C. and −10° C., and the adhesive has a heat activation temperature between 20° C. and 100° C. Damping films including at least one layer of the adhesive and including a foamed layer are described. The foamed layer includes a second olefin-styrene block copolymer at 30 to 80 weight percent and a second tackifier at 15 to 60 weight percent.

A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 μm, a thickness of the dielectric welding film ranging from 10 to 2,000 μm. The method uses the dielectric welding film.

Disclosed is an adhesive tape having an adhesive layer on one side or both sides of a base 1, wherein the adhesive layer when having the adhesive layer on one side of the base 1, or at least one adhesive layer of two adhesive layers when having the adhesive layers on both sides of the base 1 has a first adhesive layer 2 in contact with the base 1 and a second adhesive region 3 in contact with the first adhesive layer 2 and which is situated on the surface side of the adhesive tape, and the storage elastic modulus G′ of the first adhesive layer 2 is higher than the storage elastic modulus G′ of the second adhesive region 3. This adhesive tape provides easy position adjustment and easy air removal at the time of sticking, and has excellent waterproofness after sticking.

Provided is a sealing material for multi-layered glasses, including: a polysulfide resin (A) and a polyester resin (B) which is represented by Formula (1-1): ##STR00001##
or Formula (1-2): ##STR00002##
wherein A represents a dibasic acid residue, G represents a diol residue, X.sub.1 and X.sub.2 represent a hydrogen atom or a group represented by Formula (2-1): ##STR00003## wherein R represents an aromatic group or an aliphatic group, and X.sub.3 and X.sub.4 represent an aromatic group or an aliphatic group, n and m each represent the average number of repetitions of a repeating unit in parentheses and are each a numerical value larger than 0, and some or all A's are aromatic dibasic acid residues, and which has an aromatic dibasic acid residue content of 20 to 70% based on chemical formula weights calculated from the chemical formulae represented by [ ].sub.N and [ ].sub.M and also has a number average molecular weight of 400 to 5,000.

Methods of bonding hardware to glass and other substrates are provided that do not require use of primers, mixing, fixturing, or autoclaving. These methods include the steps of disposing an adhesive layer on a bonding surface of either the hardware or the vehicular glass, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing the hardware so as to be bonded to the vehicular glass by the adhesive layer; and allowing the adhesive layer to cure.

Provided is an adhesive as follows. The adhesive can bond/secure an adherend to a support with maintaining high adhesiveness during the existence of the need for securing of the adherend to the support, even in a high-temperature environment or in an environment with abrupt temperature change. The adhesive enables debonding of the adherend from the support without breakage of the adherend when the securing becomes unnecessary. The adhesive can be easily removed when remained on the adherend after debonding. The adhesive according to the present invention contains (A) a multivalent vinyl ether compound, (B) a compound including two or more of a constitutional unit represented by Formula (b), and (C) a thermoplastic resin. In the formula, X is selected from hydroxy and carboxy. ##STR00001##

An exemplary embodiment of the present invention provides: an adhesive coating composition enabling adherence (coupling) of an electrical steel sheet without using conventional coupling methods such as welding, clamping, and interlocking; an electrical steel sheet laminate to which the same is applied; and a method for manufacturing the same.

An adhesive coating composition for an electrical steel sheet, according to an exemplary embodiment of the present invention, includes, on the basis of 100 wt % of total solids: 15 to 70 wt % of a first composition containing an organic resin and an organic/inorganic composite in which inorganic nanoparticles are substituted for an organic resin; 20 to 80 wt % of a second composition containing a metal phosphate and phosphoric acid; and 1 to 10 wt % of a coupling agent.

The coupling agent may contain one or more of a silane-based coupling agent, a titanate-based coupling agent, and an aluminate-based coupling agent.