A composition is described comprising semicrystalline polylactic acid polymer; polyvinyl acetate polymer having a glass transition temperature (Tg) of at least 25° C.; plasticizer; and optionally amorphous polylactic acid polymer. In another embodiment the composition further comprises nucleating agent. Also described are films comprising the composition as well as articles, such as a tape or sheet, comprising the film described herein and a layer of pressure sensitive adhesive disposed on the film.

A composition is described comprising semicrystalline polylactic acid polymer; polyvinyl acetate polymer having a glass transition temperature (Tg) of at least 25° C.; plasticizer; and optionally amorphous polylactic acid polymer. In another embodiment the composition further comprises nucleating agent. Also described are films comprising the composition as well as articles, such as a tape or sheet, comprising the film described herein and a layer of pressure sensitive adhesive disposed on the film.

A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.

A reworkable optically clear adhesive composition, a method for adjoining a light source to a light guide plate by applying a reworkable optically clear adhesive composition to the light guide plate, and a lighting device comprising a light source, a light guide plate and a reworkable optically clear adhesive film are described. The reworkable optically clear adhesive composition has a processing temperature of between about 50° C. and about 80° C. and comprises: from about 15 wt. % to about 40 wt. % hot melt adhesive; from about 20 wt. % to about 60 wt. % optical resin; and from about 10 wt. % to about 40 wt. % UV adhesive, wherein the weight percentage of each component is based on the total weight of the reworkable optically clear adhesive composition.

An electrically conductive adhesive layer includes an adhesive material; a plurality of electrically conductive dendritic first particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 20 micrometers to about 40 micrometers; and a plurality of electrically conductive substantially planar second particles dispersed in the adhesive material and having a cumulative 50% particle diameter D50 in a range from about 40 micrometers to about 70 micrometers. The adhesive layer has an average thickness in a range from about 15 micrometers to about 35 micrometers, an electrical resistance in a thickness direction of less than about 30 milliohms, and a peel strength of at least 0.1 N/mm from a stainless steel surface after a dwell time of about 20 minutes at 22° C.

An adhesive film includes a resin film; and an adhesive layer provided on the resin film. The adhesive layer includes a resin composition including 2 parts by mass or more of an epoxy resin including two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, per 100 parts by mass of an amorphous resin, which is soluble to a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 5 KOHmg/g or more. A flat wiring member includes a conductor and the adhesive film as described above.

An adhesive film includes a resin film; and an adhesive layer provided on the resin film. The adhesive layer includes a resin composition including 2 parts by mass or more of an epoxy resin including two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, per 100 parts by mass of an amorphous resin, which is soluble to a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 5 KOHmg/g or more. A flat wiring member includes a conductor and the adhesive film as described above.

The present invention involves a 100% solids, radiation curable adhesive formulation for adhesion to EVA. This formulation may have varying compositions, as discussed in detail herein. However primarily the composition may comprise at least a monomer, and a chlorinated additive. Photo initiators may be used to allow for low temperature UV or other radiation curing. Other additives may be used to enhance functional features in various ways. In use, the present invention may be coated on a surface of EVA and then cured, and may be adhered to a substrate using only a layer of adhesive on the substrate, in contrast to the structures of the prior art, which require at least two sided adhesive application, among other complexities.

A conductive adhesive and a bonding method of circuit board are provided. The conductive adhesive includes a substrate and an insulating region formed on a surface of the substrate and a conductive region. The insulating region includes a plurality of insulating retaining walls arranged along a same direction and in intervals. The conductive region includes a plurality of conductive adhesive bodies and the conductive adhesive bodies are filled in gaps between the adjacent insulating retaining walls.

A lactic acid based hot-melt adhesive with an amorphous lactic acid oligomer tackifier. A hot-melt adhesive (HMA) includes: a lactic acid and caprolactone copolymer resin, a crystalline lactic acid oligomer wax, and said amorphous lactic acid oligomer tackifier, characterized in that the amorphous lactic acid oligomer tackifier includes an amorphous polymerisation product of a) lactic acid monomer and b) a multifunctional polymerization initiator containing three or more hydroxy and/or amino groups. The use of the amorphous lactic acid oligomer tackifier in a lactic acid-based hot-melt adhesive, to a method for adhering substrates together using a hot-melt adhesive including said amorphous lactic acid oligomer tackifier, and to a specific amorphous lactic acid oligomer tackifier and a method of its preparation.