Semi-crystalline polyester polyols and their use in reactive hot-melt adhesives are disclosed. The polyols comprise recurring units of a C.sub.2-C.sub.10 aliphatic diol, a C.sub.8-C.sub.24 aliphatic dicarboxylic acid, and 1 to 20 wt. % of an aromatic dicarboxylic acid source, a polycarbonate, or a combination thereof. The polyols have a hydroxyl number within the range of 14 to 112 mg KOH/g. Reactive hot-melt adhesives from the polyols and composite structures produced using the adhesives are also disclosed. A minor proportion of aromatic dicarboxylic acid, polycarbonate content in the polyester polyol surprisingly improves the properties of reactive hot-melt adhesives when compared with a commercial hot-melt adhesive or an adhesive formulated using an all-aliphatic polyester polyol. The adhesives are useful for bonding a wide variety of substrates, including paper, wood, glass, ceramics, plastics, and metals.

A laminate debonding method includes producing a laminate by joining a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate which allows passage of infrared laser light, by the mediation of a first adhesive layer provided on the first substrate and a second adhesive layer provided on the second substrate, wherein the first adhesive layer is obtained by curing an adhesive (A) containing a component which is cured through hydrosilylation, and the second adhesive layer is obtained by use of an adhesive (B) formed of a polymer adhesive having an aromatic ring in at least one of a main chain and a side chain and which allows passage of infrared laser light; and irradiating the laminate with infrared laser light from a second substrate side for debonding the second substrate at the interface between the first and second adhesive layers.

The present application provides a separator, a secondary battery, a battery module, a battery pack, and a power consumption apparatus. The separator may include a porous base film and a bonding layer coated on one or both faces of the porous base film. The bonding layer may be composed of ethylene carbonate and an optional nucleating agent.

A laminate debonding method includes producing a laminate by joining a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate which allows passage of infrared laser light, by the mediation of a first adhesive layer provided on the first substrate and a second adhesive layer provided on the second substrate, wherein the first adhesive layer is obtained by curing an adhesive (A) containing a component which is cured through hydrosilylation, and the second adhesive layer is obtained by use of an adhesive (B) formed of a polymer adhesive having an aromatic ring in at least one of a main chain and a side chain and which allows passage of infrared laser light; and irradiating the laminate with infrared laser light from a second substrate side for debonding the second substrate at the interface between the first and second adhesive layers.

An adhesive film having high formability, a thermoformed article, and a method for manufacturing the adhesive film are provided. The adhesive film contains a base material film including: a polycarbonate; a primer layer provided on at least one surface of the base material film; and an adhesive layer provided on the primer layer on the surface opposite to the base material film, wherein the primer layer is formed of a primer layer composition comprising an oligomer diol.

The invention relates to a multilayer structure (MS) comprising (SI) at least one first polymer layer (SI) comprising 95% by weight, preferably 98% by weight, particularly preferably 99% by weight, based on the total weight of the polymer layer (SI), of a polymer (PI) selected from the group consisting of a polycarbonate, a co-polycarbonate or mixtures thereof having a Vicat softening temperature149 C., preferably 160 C., further preferably 170 C.; more preferably 180 C., determined according to ISO 360:2004 (50N; 50/h); (S2) at least one further polymer layer (S2) having a Vicat softening temperature<149 C., preferably 140 C., more preferably 130 C., determined according to ISO 306:2004 (50N; 50/h), preferably in a range from 120 C. to 148 C.; (S3) optionally at least one third polymer layer (S3) having a Vicat softening temperature149 C., preferably 160 C., further preferably 170 C.; more preferably 180 C., determined according to ISO 306:2004 (50N; 50 h). The invention further relates to a process for producing a multilayer structure (MS) and to a security document comprising such a multilayer structure according to the invention.