A moisture curable composition, and a method of application and a substrate including the same are disclosed herein. In some embodiments, a curable composition includes a component (A) comprising an organic polymer containing reactive silicon groups represented by the general formula (1), a component (B) comprising an organic polymer having a viscosity lower than 10,000 cP at 23 C. containing reactive silicon groups represented by the general formula (2), and a component (C) comprising a polyolefin polymer. The moisture curable composition has universal adhesiveness to an adhesion-resistant substrate, such as PVC, EPDM, and TPO. The substrates can be smooth-back or fleece-back substrates.

A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition.

Provided is an adhesive layer-equipped transparent surface material that can easily be bonded to another surface material (a display panel, etc.) and that, when bonded to another surface material, is less likely to have voids left at the interface between the adhesive layer and another surface material. An adhesive layer-equipped transparent surface material 1 comprises an adhesive layer 14 formed on at least one surface of a protective plate 10 (a transparent surface material), wherein the adhesive layer 14 has a layer portion 18 spreading over the surface of the protective plate 10 and a barrier portion 20 surrounding the periphery of the layer portion 18; and the layer portion 18 has a shear modulus at 35 C. of from 0.5 to 100 kPa.

The purpose of the present invention is to provide a thermally conductive moisture-curable resin composition which develops excellent thermal conductivity and peelability after curing. The thermally conductive moisture-curable resin composition contains the following components (A) to (C): component (A): an organic polymer containing two or more hydrolyzable silyl groups; component (B): a thermally conductive filler; and component (C): a silicone compound having a polar group and/or a polar chain at a terminal or a side chain.

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates.

Flexible films comprise an adhesive layer and a fibrous supporting layer and the thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates where they can reduce the formation of galvanic corrosion.

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates.

A room temperature curable sealant/adhesive composition is disclosed. The room temperature curable sealant/adhesive composition comprises: (A) one or more organopolysiloxanes; (B) a hydrophilic material; (C) a cross-linker; (D) a titanate or zirconate catalyst; and (E) one or more optional ingredients. A silicone elastomer formed therefrom and related methods are also disclosed.

A purpose of the present disclosure is to provide a multilayer wiring substrate capable of reducing transmission loss of electrical signals when using a fluororesin substrate, by using an adhesive layer capable of suppressing misalignment between layers and having excellent peel strength. Provided is a multilayer wiring substrate 1 including: a fluororesin substrate 30 having a conductor pattern 20 formed on at least one surface thereof; and an adhesive layer 10 for bonding the fluororesin substrate 30, wherein the adhesive layer 10 contains a cured product of a thermosetting resin, and has a breaking elongation rate of 20% or more and 300% or less.

Provided is an adhesive layer-equipped transparent surface material that can easily be bonded to another surface material (a display panel, etc.) and that, when bonded to another surface material, is less likely to have voids left at the interface between the adhesive layer and another surface material. An adhesive layer-equipped transparent surface material 1 comprises an adhesive layer 14 formed on at least one surface of a protective plate 10 (a transparent surface material), wherein the adhesive layer 14 has a layer portion 18 spreading over the surface of the protective plate 10 and a barrier portion 20 surrounding the periphery of the layer portion 18; and the layer portion 18 has a shear modulus at 35 C. of from 0.5 to 100 kPa.