The present invention relates to: a hot-melt adhesive composition comprising a mixture of silylated polymers, a tackifying resin and a catalyst, in specific contents, having self-adhesive properties after crosslinking to moisture; a self-adhesive article comprising a support layer and at least one self-adhesive layer obtained after crosslinking to the moisture in the adhesive composition according to the invention; and the use thereof to bond low-energy substrates, in particular plastic substrates, notably thermoplastic substrates having low surface energy.

An anisotropic conductive film includes an insulating adhesive layer and conductive particles disposed thereon. Arrangement axes of the conductive particles having a particle pitch extend in a widthwise direction of the film, and the axes are sequentially arranged with an axis pitch in a lengthwise direction of the film. The particle pitch, axis pitch of the axes, and an angle of the axes relative the widthwise direction of the film are determined according to external shapes of terminals so 3 to 40 conductive particles are present on each terminal when a terminal arrangement region of an electronic component is superimposed on the film so a lengthwise direction of each terminal is aligned with the widthwise direction of the film. By using the film, stable connection reliability is obtained and an excessive increase in the density of the conductive particles is suppressed even in the connection of fine pitches.

The present disclosure provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film includes a base adhesive film layer, an insulating layer, and a conductive layer. The insulating layer is located on one side surface of the base adhesive film layer. The insulating layer has a grid structure. The grid structure includes grid lines and a plurality of hollow portions defined by the grid lines. The grid lines have a structure corresponding to gaps between cell pieces. The conductive layer includes a plurality of conductive portions. The conductive portions are arranged in the hollow portions in one-to-one correspondence. The volume resistivity of the conductive portions is less than 100 ?.Math.cm.

Fiber-containing composites are described that include woven or non-woven fibers, and a binder that holds the fibers together. The binder may include the reaction product of a starch and a polycarboxylic acid. The starch has a weight average molecular weight that ranges from 1?10.sup.6 Daltons to 10?10.sup.6 Daltons. The fiber-containing composite has an unaged tensile strength of greater than 4.0 and an aged tensile strength greater than 3.0. Also described are methods of making the fiber-containing composites. The methods may include applying a binder composition to fibers to form coated fibers, measuring a moisture content of the coated fibers, and curing the coated fibers in a curing oven to form the fiber-containing composite. The binder composition may include a starch having a weight average molecular weight that ranges from 1?10.sup.6 Daltons to 10?10.sup.6 Daltons, and a polycarboxylic acid.

A curable composition comprising: a hydroxy-functional or ether-functional (meth)acrylate copolymer, an epoxy resin; water; a photocatalyst, and optionally a polyvinyl acetal polymer and/or a film-forming polymer. When cured, provides structural bonding adhesives that are curable under high humidity conditions.

Tiles are adhesively bonded to substrates such as kitchen or bathroom walls by a process in which a tile adhesive is used, the tile adhesive being a one component RTV-1 moisture-curable tile adhesives having properties superior to conventional cementitious and RTU tile adhesives, which contain at least one low viscosity alkoxysilyl-functional polymer, a silicone resin, an aminoalkyl-functional alkoxysilane or partial hydrolysate thereof, and in excess of 60 weight percent mineral filler, of which at least 50 weight percent is a non-reinforcing filler.

The present invention relates to the bonding of low-surface-energy substrates, in particular plastic substrates, especially thermoplastic low-surface-energy substrates.

In particular, the present invention relates to a specific hot melt adhesive composition having self-adhesive properties after moisture crosslinking, as well as a self-adhesive article such as a multilayer system, intended for that purpose.

The invention relates to a cable wrapping tape for wrapping cables in motor vehicles, comprising a tape-shaped carrier and an adhesive coating on at least one side of said carrier, and characterised in that the adhesive coating and/or carrier are provided with an incorporated repellent against, in particular, mammal bites.

A rivetable adhesive for use in a joint between dissimilar materials, comprising a Nquid epoxy resin, an expoxidized polysulfide, a flexibilizer, a solid epoxy CTBN adduct based upon bisphenol A, a prienoxy resin, an impact modifier including methacrylate-butadiene-styrene, a curing agent; and a blowing agent. The adhesive finds particular suitability for use in riveting aluminum panels to steel structures, such as for forming automotive vehicle roof structures.

The gasket of the present invention is mainly comprised of a pressure-sensitive adhesive sheet containing a non-halogenated flame retardant, and at least one surface thereof is a pressure-sensitive adhesive face of the pressure-sensitive adhesive sheet containing a non-halogenated flame retardant. According to the present invention, a highly flame retardant gasket having practically sufficient tight-sealing property, which does not produce a toxic halogen gas during combustion can be realized. In addition, a highly flame retardant gasket having practically sufficient tight-sealing property, which does not produce a toxic halogen gas during combustion, and does not cause corrosion and discoloration of a metal member to be an adherend can be realized.