Tiles are adhesively bonded to substrates such as kitchen or bathroom walls by a process in which a tile adhesive is used, the tile adhesive being a one component RTV-1 moisture-curable tile adhesives having properties superior to conventional cementitious and RTU tile adhesives, which contain at least one low viscosity alkoxysilyl-functional polymer, a silicone resin, an aminoalkyl-functional alkoxysilane or partial hydrolysate thereof, and in excess of 60 weight percent mineral filler, of which at least 50 weight percent is a non-reinforcing filler.

An encapsulation material is used to fill a gap between a base member and a semiconductor chip to be bonded onto the base member. The encapsulation material has a reaction start temperature of 160° C. or less. A total content of components volatilized from the encapsulation material when the encapsulation material is heated to at least one temperature falling within a range from 100° C. to 170° C. is 0.5% by mass or less of the entire encapsulation material.

A bonding composition joins polymer components by material engagement. The bonding composition includes a solvent and a polymer material, which may be made from similar polymers from which the polymer components are made. There may be a kit for producing a polymer components and a bonding composition. The polymer production includes volatilization of the solvent and optionally melting the polymer materials.

A biodegradable label and a method for making the label. The biodegradable label includes from about 40 to about 99 weight percent of a polymer derived from random monomeric repeating units having a structure of

##STR00001##

wherein R.sup.1 is selected from the group consisting of CH.sub.3 and a C.sub.3 to C.sub.19 alkyl group. The monomeric units having R.sup.1═CH.sub.3 is about 75 to about 99 mol percent of the polymer. A resin adapted for forming the label is also disclosed.

A method for adhesively bonding two substrates by means of a moisture-curable adhesive composition, wherein at least one of the substrates includes at least 40 wt.-% of a mixture, said mixture consisting of: between 15 and 99 wt.-% of at least one thermoplastic polymer; between 1 and 85 wt.-% of at least one elastomer; and wherein the moisture-curable adhesive composition includes: at least one polymer containing silane groups; between 10 and 40 wt.-% of at least one polymeric plasticizer; between 0.1 and 5 wt.-% of at least one amino-functional alkoxysilane; between 0 and 5 wt.-% of at least one C1-C12-alkyl-functional alkoxysilane. The method yields adhesively bonded substrates without the requirements of using migrating plasticizers and pre-treating of the substrates.

The present disclosure provides a gel gasket comprised, in part, of a pressure sensitive adhesive. The gel gasket is flame retardant and has anti-corrosive properties. In at least one embodiment, the gel gasket has a storage modulus of about 1,000 to about 25,000 Pa and the storage modulus is maintained after storage at 66° C./80% RH for at least 2 weeks.

A filler-containing film that holds fillers and a fine solid in an insulating resin layer and a predetermined arrangement of the fillers is repeated as viewed in a plan view has a proportion of 300% or less where the proportion is a repeat pitch of the fillers after thermocompression bonding to that before thermocompression bonding during thermocompression bonding under a predetermined thermocompression bonding condition with the filler-containing film held between smooth surfaces. A method of producing the filler-containing film includes the steps of: forming an insulating resin layer on a release substrate; pushing fillers from a surface on a side opposite to the release substrate of the insulating resin layer; and layering the insulating resin layer containing the fillers pushed and another insulating resin layer. This filler-containing film suppresses disorder of arrangement of fillers during thermocompression bonding of the film to an article.

An adhesive composition, containing an epoxy resin (A), an epoxy resin curing agent (B), a polymer component (C) and an inorganic filler (D), in which the inorganic filler (D) satisfies the condition (1) of (an average particle diameter (d50) is 0.1 to 3.5 μm) and condition (2) of (a ratio of a particle diameter at 90% cumulative distribution frequency (d90) to the average particle diameter (d50) is 5.0 or less), and a proportion of the inorganic filler (D) in a total content of the epoxy resin (A), the epoxy resin curing agent (B), the polymer component (C) and the inorganic filler (D) is 20 to 70% by volume; a film-like adhesive and a production method thereof; and a semiconductor package and a production method thereof.

The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.

The invention provides a joining film having sufficient connection heat resistance and high reliability, for which a joining process of joining a semiconductor element and a substrate is simple and easy, a tape for wafer processing, a method for producing a joined body, and a joined body.

Disclosed is a joining film 13 for joining a semiconductor element 2 and a substrate 40, the joining film having an electroconductive joining layer 13a formed by molding an electroconductive paste containing metal fine particles (P) into a film form; and a tack layer 13b having tackiness and being laminated with the electroconductive joining layer. The tack layer 13b is thermally decomposed by heating at the time of joining, the metal fine particles (P) of the electroconductive joining layer 13a are sintered, and thereby the semiconductor element 2 and the substrate 40 are joined.