Patent classifications
C09J2475/00
Electronic device, method and apparatus for producing an electronic device, and composition therefor
An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material includes a first polymer, a second polymer, and a conductive carbon black dispersion, and is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate. The adhesive is electrically conductive to maximize the possibility of maintaining electrical connectivity even when there is a break in the metal foil.
Polyurethane Adhesives for Bonding Low Surface Energy Films
The present invention relates to a polyurethane laminating adhesives, methods for producing a multilayer laminate by laminating at least two films with a polyurethane laminating adhesive, and multilayer laminates obtainable by these methods wherein the polyurethane laminating adhesive comprises an NCO-terminated polyurethane prepolymer obtainable by reacting a polyol mixture comprising: 0.1 to 20.0 wt % relative to the total weight of the polyol mixture of at least one polybutadiene polyol; and 5.0 to 99.9 wt % relative to the total weight of the polyol mixture of at least one polyether polyol, wherein the at least one polyether polyol comprises at least one polyether polyol with a number average molecular weight M.sub.n in the range of >1000 g/mol to 10000 g/mol; with at least one polyisocyanate, wherein the at least one polyisocyanate is used in an amount such that the isocyanate groups are present in molar excess relative to the hydroxyl groups of the polyol mixture. Also encompassed are the use of the described adhesives for laminating two or more films, and the multilayer laminates obtainable by the described methods.
FILM, METHOD FOR ITS PRODUCTION, AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT USING THE FILM
To provide a film which is excellent in releasing property with respect to a resin sealed portion and excellent in low migration property and peeling property with respect to a semiconductor chip, a source electrode or a sealing glass and which is suitable as a mold release film for producing a semiconductor element having a part of the surface of a semiconductor chip, source electrode or sealing glass exposed. A film 1 which comprises a substrate 3 and an adhesive layer 5, wherein the storage elastic modulus at 180° C. of the substrate 3 is from 10 to 100 MPa, and the adhesive layer 5 is a reaction cured product of a composition for adhesive layer comprising a specific acrylic polymer and a polyfunctional isocyanate compound, wherein the number of moles M.sub.OH of hydroxy groups and the number of moles M.sub.COOH of carboxy groups, derived from the acrylic polymer, and the number of moles M.sub.NCO of isocyanate groups derived from the polyfunctional isocyanate compound, satisfy a specific relation, and which is suitable as a mold release film for producing a semiconductor element.
RADIATION CURABLE PRIMER ADHESIVE
The present invention involves a 100% solids, radiation curable adhesive formulation for adhesion to EVA. This formulation may have varying compositions, as discussed in detail herein. However primarily the composition may comprise at least a monomer, and a chlorinated additive. Photo initiators may be used to allow for low temperature UV or other radiation curing. Other additives may be used to enhance functional features in various ways. In use, the present invention may be coated on a surface of EVA and then cured, and may be adhered to a substrate using only a layer of adhesive on the substrate, in contrast to the structures of the prior art, which require at least two sided adhesive application, among other complexities.
PRESSURE-SENSITIVE ADHESIVE SHEET FOR SURFACE PROTECTION
An objective is to provide a surface-protective PSA sheet capable of reducing adherend damage and well maintaining appearance, etc. The surface-protective PSA sheet capable of reducing adherend damage and well maintaining appearance, etc., comprises a surface layer, a resin substrate layer and a PSA layer, and has a multilayer structure with the resin substrate layer placed between the surface layer and the PSA layer, wherein the surface layer is a layer obtainable by curing a heat-curable composition comprising the following components: (a) a hydroxyl group-containing (meth)acrylic copolymer having a glass transition temperature of −40° C. to 30° C.; (b) an allophanate polyisocyanate and/or a biuret polyisocyanate; and (c) a polysiloxane comprising a hydroxyl group-containing hydrocarbon group and/or polymer.
PRESSURE-SENSITIVE ADHESIVE SHEET FOR SURFACE PROTECTION
An objective is to provide a surface-protective PSA sheet capable of reducing adherend damage and well maintaining appearance, etc. The surface-protective PSA sheet capable of reducing adherend damage and well maintaining appearance, etc., comprises a surface layer, a resin substrate layer and a PSA layer, and has a multilayer structure with the resin substrate layer placed between the surface layer and the PSA layer, wherein the surface layer is a layer obtainable by curing a heat-curable composition comprising the following components: (a) a hydroxyl group-containing (meth)acrylic copolymer having a glass transition temperature of −40° C. to 30° C.; (b) an allophanate polyisocyanate and/or a biuret polyisocyanate; and (c) a polysiloxane comprising a hydroxyl group-containing hydrocarbon group and/or polymer.
ELECTRICAL STEEL SHEET AND METHOD FOR MANUFACTURING SAME
An embodiment of the present invention provides an electrical steel sheet including: an upper adhesive layer positioned on an upper surface of an electrical steel sheet; and an lower adhesive layer positioned on a lower surface of the electrical steel sheet, wherein the upper adhesive layer has a pencil hardness of F or lower, and the lower adhesive layer has a pencil hardness of H or higher.
SURFACE PROTECTION FILM FOR FLEXIBLE DISPLAY AND METHOD OF PRODUCING THEREOF
The present invention addresses the problem of providing a surface protection film for a flexible display with which films are not adhered to each other. As a solution, provided is the surface protection film for a flexible display that has a protection layer made of polyurethane as an outermost surface thereof, the polyurethane having a tan δ peak temperature of 20° C. or more.
DEVICE AND METHOD FOR APPLYING ADHESIVE TO A SUBSTRATE
A device for applying adhesive to a substrate, having an application roller that is rotatable about an axis, an installation for dispensing adhesive to a circumferential area of the application roller, a dispensing region of the application roller for dispensing adhesive from the application roller, and having a doctor blade, wherein the dispensing region for adhesive in the rotation direction of the application roller is located behind the installation for dispensing the adhesive to the application roller and ahead of the doctor blade. In such a device it is provided that the application roller is rotatable about a vertical axis and the excess adhesive wiped by the doctor blade reaches a collection installation that is located below the doctor blade. In a method for applying adhesive to a substrate, excess adhesive that has not been applied to the substrate is disposed of.
PHOTO-CURABLE ADHESIVE COMPOSITION, PREPARATION AND USE THEREOF
The present invention provides a photo-curable adhesive composition for display panel assembly comprising a) at least one polyurethane acrylate having Tg value from −70 to 20° C.; b) at least one (meth)acrylate monomer; c) at least one chain transfer agent; d) at least two thixotropy agents, wherein first thixotropy agent is selected from the group consisting of hydrophobic fumed silica, hydrophilic fumed silica and mixtures thereof and second thixotropy agent is selected from the group consisting of modified urea, polyhydroxycarboxylic acid esters and mixtures thereof; e) at least one photoinitiator; f) at least one plasticizer; and g) at least one defoamer. The photo-curable adhesive composition according to the present invention can be used in bonding two transparent substrates together or in bonding one transparent substrate and one opaque substrate together. Furthermore, the composition according to the present invention can be used in a process of making an optical assembly.