Patent classifications
C09J2475/00
METHOD OF GLUING A WOOD PRODUCT AND A GLUED WOOD PRODUCT
The present invention relates to a method of producing a glued wood product for use in construction, comprising the steps of: providing at least two wooden pieces each piece comprising at least one joining face; creating a groove in at least one of said joining faces where the groove is arranged between a pair of peripheral edges; applying adhesive onto at least one of the joining faces of at least a first of said two wooden pieces; arranging said first wooden piece so that the joining face which comprises the applied adhesive meets a corresponding joining face of said second wooden piece, wherein at least one of said two joining faces comprises said groove; pressing the two joining faces towards each other so that the adhesive is compressed between said two wooden pieces, and maintaining said pressing for a sufficient time to bond the wooden pieces to each other; wherein the applied pressing force is strong enough to force the wood tissue to collapse at a contact area until the pressure force is transmitted primarily through the adhesive, wherein said contact area is defined by the surface area whereat the two joining faces of said wooden pieces contact each other upon being pressed together.
Polyurethane hot-melt adhesive, laminated body using same, and method for producing laminated body
Disclosed is a polyurethane hot-melt adhesive including: a thermoplastic polyurethane that is a reactant of a raw material including a polymer polyol, a polyisocyanate, and a chain extender, wherein X−Y≥15, where X represents a temperature (° C.) at which the polyurethane hot-melt adhesive has a melt viscosity of 2.0×10.sup.3 Pa.Math.s, and Y represents a temperature at which the polyurethane hot-melt adhesive has a melt viscosity of 1.0×10.sup.5 Pa.Math.s, and the polyurethane hot-melt adhesive has a 100% modulus of 2.5 MPa or more.
SEALANT MATERIAL
A sealant material for sealing joints between male and female mating parts comprising: (a) an elongate flexible thread suitable for wrapping around at least one of the parts, and (b) a joint sealing composition comprising an anaerobically curable composition in solid form,
the flexible thread being coated with the anaerobically curable composition. This provides a reactive composition on the thread for sealing joints.
Two-component polyurethane sealant for application at low temperature
A two-component composition is described which comprises A) an isocyanate component comprising an isocyanate-terminated urethane prepolymer, B) a water component comprising water, and at least one latent amine hardener in component A). The two-component composition of the invention is suitable as a sealant, in particular as a joint sealant. Particular advantages are that primerless application is possible with good adhesion, even at low temperatures, such as 4.4° C. or below. The substrate to be sealed are preferably concrete substrates.
ADHESIVE AGENT, LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND PACKAGING MATERIAL
Provided are a two-component curable adhesive which can be aged at room temperature and has favorable adhesiveness to various base materials, a laminate in which the adhesiveness between a base material and an adhesive is excellent even when aged at room temperature, and a packaging material including the laminate. The two-component curable adhesive includes a polyisocyanate composition (X) including a polyisocyanate compound (A) and a polyol composition (Y) including a polyol (B), in which a viscosity of the polyol composition at 50° C. is 20 mPa.Math.s or more and 180 mPa.Math.s or less.
Conductive resin composition, conductive adhesive, and semiconductor device
A low temperature rapid curing type low elastic conductive adhesive is provided which is useful as a conductive adhesive for component mounting in a field of FHE. The conductive resin composition contains (A) at least two types of urethane acrylate oligomers, (B) a radical polymerizable monomer, (C) a free radical generation curing agent, and (D) conductive particle. In the conductive resin composition, the component (A) preferably contains a high molecular weight urethane acrylate oligomer having a weight average molecular weight of 10,000 or more (A1), and a low molecular weight urethane acrylate oligomer having a weight average molecular weight of 9,999 or less (A2).
Conductive resin composition, conductive adhesive, and semiconductor device
A low temperature rapid curing type low elastic conductive adhesive is provided which is useful as a conductive adhesive for component mounting in a field of FHE. The conductive resin composition contains (A) at least two types of urethane acrylate oligomers, (B) a radical polymerizable monomer, (C) a free radical generation curing agent, and (D) conductive particle. In the conductive resin composition, the component (A) preferably contains a high molecular weight urethane acrylate oligomer having a weight average molecular weight of 10,000 or more (A1), and a low molecular weight urethane acrylate oligomer having a weight average molecular weight of 9,999 or less (A2).
CURABLE COMPOSITIONS USEFUL FOR OBTAINING NON-SENSITIZING CURED PRODUCTS
Non-sensitizing pressure sensitive adhesives which are useful in medical applications and other uses where an adhesive is in contact with skin are obtained by energy-curing compositions containing one or more acrylate-functionalized compounds and possibly other components which are selected such that the cured adhesive passes an in vitro cytotoxicity test in accordance with ISO 10993-5 (2009).
METHOD OF MAKING ZIPPER POUCH
Provided is a process for preparing a zipper pouch, wherein the process comprises: A) forming a first laminate by a process comprising i) bringing together a polyisocyanate component and a polyol component to form an adhesive composition, ii) applying a layer of the adhesive composition to a layer of polyethylene terephthalate, iii) then contacting the layer of the adhesive composition with a layer of polyethylene having thickness of 80 micrometer or more; B) contacting a polymeric zipper construction to the first laminate at temperature of 200 C or higher. Also provided is a zipper pouch made by that process.
MOISTURE-CURABLE POLYURETHANE HOTMELT ADHESIVE HAVING HIGH INITIAL STRENGTH
Described herein is a moisture-curing polyurethane hot-melt adhesive including at least 80% by weight, based on a total weight of the moisture-curing polyurethane hot-melt adhesive, of isocyanate-terminated prepolymer obtainable by mixing diisocyanate (a) with compounds having at least two isocyanate-reactive groups (b) and reacting the mixture to form the isocyanate-terminated prepolymer, where the compounds having at least two isocyanate-reactive groups (b) include at least one polylactide (b1) obtainable by reacting lactide with a linear difunctional starter molecule having 2 to 20 carbon atoms and the isocyanate content of the isocyanate-terminated prepolymer is 1 to 5% by weight. Also described herein is a process for producing such a moisture-curing polyurethane hot-melt adhesive and a method of using the moisture-curing polyurethane hot-melt adhesive in bonding of substrates.