A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.

Provided is a flexible heat radiating sheet with high thermal conductivity. The heat radiating sheet includes a resin material and a heat radiating member that extends in the planar direction and has a required thickness. The heat radiating member is bent such that in portions of a thin plate member between adjacent slit rows, projecting portions and recess portions are alternately repeated in the X-axis direction, and a projecting portion and a recess portion that are adjacent in the Y-axis direction are located facing each other. The heat radiating member is entirely buried in the resin material excluding apexes of the projecting portions and the recess portions.

The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

Provided is an adhesive as follows. The adhesive can bond/secure an adherend to a support with maintaining high adhesiveness during the existence of the need for securing of the adherend to the support, even in a high-temperature environment or in an environment with abrupt temperature change. The adhesive enables debonding of the adherend from the support without breakage of the adherend when the securing becomes unnecessary. The adhesive can be easily removed when remained on the adherend after debonding. The adhesive according to the present invention contains (A) a multivalent vinyl ether compound, (B) a compound including two or more of a constitutional unit represented by Formula (b), and (C) a thermoplastic resin. In the formula, X is selected from hydroxy and carboxy.

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A heat-shrinkable tube or heat-shrinkable cap includes an adhesive layer disposed on the inner surface thereof, the adhesive layer including a low-viscosity adhesive layer formed of a resin having a viscosity of 10 Pa.Math.s or less at a shear rate of 1 s.sup.1 at the heat shrinkage temperature and a viscosity of 100 Pa.Math.s or more at a shear rate of 1 s.sup.1 at the maximum continuous use temperature. The heat-shrinkable tube or heat-shrinkable cap is used for waterproofing an exposed portion of electrical wires of an electrical wire bundle such as a wire harness, in which merely by placing the heat-shrinkable tube or heat-shrinkable cap over the exposed portion of electrical wires, waterproofing and water blocking between strands can be achieved, and outflow of the resin during heat shrinking does not occur. A method of waterproofing an electrical wire bundle uses the heat-shrinkable tube or heat-shrinkable cap.

A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.

A process utilizing thermoplastic adhesives for surface mounting or laminating two or more substrate surfaces consisting of a combination of thermoplastic-polyimide (TPI) adhesive layers, one of which is B-staged or partially cured, and the other of which is C-Staged or fully cured, employed both as direct coatings and/or stand alone bondfilms, as well as their advantageous use in joining materials of mismatched Coefficients of Thermal Expansion (CTE).

Disclosed is a nanosilica-containing thermoplastic hot-melt film having excellent bonding strength, which may be inserted between fabrics to adhere them to each other and may be distributed uniformly on the surfaces of both the fabrics without excessively penetrating into one of the fabrics after melting by heat and pressure during no-sew pressing even if the yarn density of the fabrics is high or low or even if the hole diameter of the fabrics is large or small, thereby increasing the bonding strength between the fabrics.

A temporary bonding composition is provided. The temporary bonding composition includes a polyfunctional crosslinker, a polymer and a solvent. The polyfunctional crosslinker includes a compound containing at least two functional groups selected from the group consisting of blocked isocyanate groups, alkenyl ether groups, and alkoxyhydrocarbyl groups. Each of the blocked isocyanate groups is an isocyanate group blocked by a blocking agent. The polymer has a functional group reacting with the polyfunctional crosslinker.

The invention concerns a linerless self-adhesive material obtained starting from a self-adhesive material with a liner, by means of a process that comprises the delamination of the liner from a self-adhesive layer, activation of the liner or self-adhesive layer, transferral of the liner over the self-adhesive layer and re-lamination of the two components so as to produce the linerless self-adhesive material. The liner or the self-adhesive layer is coated with a thermo-adhesive that allows for permanent lamination of the liner located on the self-adhesive layer.