The present disclosure generally relates to adhesive compositions and articles including at least one of polydiorganosiloxane polyoxamide copolymer and/or silicone polyurea block copolymer and a silicate tackifying resin. Some embodiments of the adhesive composition include at least one of a polydiorganosiloxane polyoxamide copolymer and a silicate tackifying resin in an amount of between about 0.1 wt % and about 20 wt %; or a silicone polyurea block copolymer and a silicate tackifying resin in an amount of between about 0.1 wt % and about 30 wt %.

This disclosure provides a sealant, a liquid crystal panel, a liquid crystal display, and a production method. The sealant of this disclosure comprises a graphene-polymer composite and a sealant matrix, wherein the graphene-polymer composite comprises graphene filled in a polymer, wherein in the graphene-polymer composite, the graphene has a filling ratio of 10% to 50% by weight; wherein the graphene-polymer composite is dispersed in the sealant matrix uniformly, and with respect to total weight of the graphene-polymer composite and the sealant matrix, the sealant matrix has a weight fraction of 70% to 97%, and the graphene-polymer composite has a weight fraction of 3% to 30%.

The invention relates to a plastic-metal hybrid component and to a corresponding method for producing a plastic-metal hybrid component. The production method has the following steps: (i) providing a fiber composite semifinished product based on polyamide, at least one part of the surface of the semifinished product being made of a polymer composition which contains the following: a) 100 wt. % of a polyamide; and b) 0.5 to 20 wt. % of one or more adhesive additives of the formula (I); (ii) providing a metal main part; (iii) optionally pretreating the surface of the metal main part in order to produce functionalities; (iv) introducing the main metal part and the fiber composite semifinished product into a pressing tool and closing the tool; and (v) bonding the fiber composite semifinished product and the metal main part by means of a compression process under the effect of pressure and temperature.

There is provided a polyimide composition that is useful for electronic substrate materials, retains high heat resistance and mechanical strength intrinsic to polyimides, and has a lower dielectric constant and dielectric loss tangent. A polyimide composition for use in electronic substrate materials, containing a polyimide produced by polymerization between a diamine component containing 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindan and an acid component containing 3,3,4,4-biphenyltetracarboxylic acid dianhydride.

An adhesive composition including predominantly one or two polyamide(s) having units chosen from: at least one unit denoted A with a mean number of carbon atoms per nitrogen atom, denoted CA, ranging from 4 to 8.5, advantageously from 4 to 7; at least one unit denoted B with a mean number of carbon atoms per nitrogen atom, denoted CB, ranging from 7 to 10, advantageously from 7.5 to 9.5; at least one unit denoted C with a mean number of carbon atoms per nitrogen atom, denoted CC, ranging from 9 to 18, advantageously from 10 to 18, and to the use thereof.

A printing process is used to print a pattern of hot melt adhesive onto a release paper. The adhesive pattern can be transferred from the release paper and used to bond two substrates together. The adhesive pattern preferably includes a repeating pattern of discrete features, with each feature having a minimum dimension in a range up to about 5 to 10 mm.

[Object] The present invention provides a curable resin composition useful for imparting high durability and adhesion to a substrate such as a metal. [Solution] A curable resin composition is prepared by combining a polyamide-based resin (A) having an amino group, a blocked polyisocyanate (B), and an epoxy compound (C). The polyamide-based resin (A) contains a polyamide-based resin (A1) having a melting point of 170? C. or higher and a polyamide-based resin (A2) having a melting point of 150? C. or lower. The mass ratio of the polyamide-based resin (A1) and the polyamide-based resin (A2) is, in the form of the former/the latter, from 65/35 to 35/65.

Disclosed herein are improved methods for bonding textiles using an adhesive composition.

The present disclosure is drawn to re-workable adhesives for electronic devices. In one example, a re-workable adhesive for an electronic device can include a hot-melt adhesive present in an amount from about 60 wt % to about 90 wt % with respect to the total weight of the re-workable adhesive. The hot-melt adhesive can have a reduced bond strength at an elevated temperature. The re-workable adhesive can also include a pressure-sensitive adhesive present in an amount from about 10 wt % to about 40 wt % with respect to the total weight of the re-workable adhesive, wherein the pressure-sensitive adhesive has a higher bond strength compared to the hot-melt adhesive when at the elevated temperature.

A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition.