Patent classifications
C09J2477/00
Method for bonding fabric or sheet-type industrial materials to each other
The present invention relates to a method for bonding shoe textiles or industrial textiles to each other, the method including the steps of: melting an adhesive resin to apply the adhesive resin to the surface of a partial coating roller having a desired pattern engraved thereon, the adhesive resin being any one selected from the group consisting of urethane resin, an EVA resin, a nylon resin, and a polyester resin; transferring the melted adhesive resin applied to the partial coating roller to the textile; and bonding the textile to which the melted adhesive resin is transferred to another textile.
Organic light-emitting display device and method for fabricating the same
Provided is an OLED device that includes an adhesive film having a network and a method for fabricating the same. The OLED device includes: a protective layer covering an organic light-emitting element on a substrate; a metal layer on the protective layer; and an adhesive film between the metal layer and the protective layer to attach the metal layer to the protective layer. The adhesive film includes a first adhesive layer composed of first polymers having a network structure, and a second adhesive layer composed of second polymers having a network structure and moisture absorbent. The network structure of the first polymers is bonded with the network structure of the second polymers at an interface between the first adhesive layer and the second adhesive layer.
BATTERY CELL AND ELECTRIC DEVICE
A battery cell includes an electrode assembly, where the electrode assembly is configured as a wound structure; and an accommodating component, where an installation space for accommodating the electrode assembly is provided in the accommodating component; where the electrode assembly includes a positive electrode plate and a negative electrode plate. The negative electrode plate includes a negative electrode terminating section. The negative electrode terminating section is disposed at an outermost circle of the electrode assembly, an insulating layer is provided on an outer side surface of the negative electrode terminating section, and the insulating layer is adhesively fixed to the accommodating component.
Surface Mounting Using Partially Cured B Staged and Fully Cured C Staged Thermoplastic Polyimide TPI Adhesive Compounds
A process utilizing thermoplastic adhesives for surface mounting or laminating two or more substrate surfaces consisting of a combination of thermoplastic-polyimide (TPI) adhesive layers, one of which is B-staged or partially cured, and the other of which is C-Staged or fully cured, employed both as direct coatings and/or stand alone bondfilms, as well as their advantageous use in joining materials of mismatched Coefficients of Thermal Expansion (CTE).
HEAT-SHRINKABLE TUBE, HEAT-SHRINKABLE CAP, AND METHOD OF WATERPROOFING ELECTRICAL WIRE BUNDLE
A heat-shrinkable tube or heat-shrinkable cap includes an adhesive layer disposed on the inner surface thereof, the adhesive layer including a low-viscosity adhesive layer formed of a resin having a viscosity of 10 Pa.Math.s or less at a shear rate of 1 s.sup.1 at the heat shrinkage temperature and a viscosity of 100 Pa.Math.s or more at a shear rate of 1 s.sup.1 at the maximum continuous use temperature. The heat-shrinkable tube or heat-shrinkable cap is used for waterproofing an exposed portion of electrical wires of an electrical wire bundle such as a wire harness, in which merely by placing the heat-shrinkable tube or heat-shrinkable cap over the exposed portion of electrical wires, waterproofing and water blocking between strands can be achieved, and outflow of the resin during heat shrinking does not occur. A method of waterproofing an electrical wire bundle uses the heat-shrinkable tube or heat-shrinkable cap.
Robust Interface Bonding With B-staged Thermoplastic Polyimide Adhesive
Thermoplastic Polyimide (TPI) polymer adhesive coated laminating films in which the TPI coating is under cured or B-staged as well as the process for preparing the films and the use thereof is disclosed.
ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME
Provided is an OLED device that includes an adhesive film having a network and a method for fabricating the same.
The OLED device includes: a protective layer covering an organic light-emitting element on a substrate; a metal layer on the protective layer; and an adhesive film between the metal layer and the protective layer to attach the metal layer to the protective layer. The adhesive film includes a first adhesive layer composed of first polymers having a network structure, and a second adhesive layer composed of second polymers having a network structure and moisture absorbent. The network structure of the first polymers is bonded with the network structure of the second polymers at an interface between the first adhesive layer and the second adhesive layer.
Robust interface bonding with B-staged thermoplastic polyimide adhesive
Thermoplastic Polyimide (TPI) polymer adhesive coated laminating film in which the TPI coating is under cured or B-staged as well as the process for preparing the film is disclosed.
POLY(AMIC ACID) COMPOSITION AND POLYIMIDE COMPOSITION
There is provided a polyimide composition that is useful for electronic substrate materials, retains high heat resistance and mechanical strength intrinsic to polyimides, and has a lower dielectric constant and dielectric loss tangent. A polyimide composition for use in electronic substrate materials, containing a polyimide produced by polymerization between a diamine component containing 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindan and an acid component containing 3,3,4,4-biphenyltetracarboxylic acid dianhydride.
PLASTIC-METAL HYBRID COMPONENT AND METHOD FOR PRODUCING SAME
The invention relates to a plastic-metal hybrid component and to a corresponding method for producing a plastic-metal hybrid component. The production method has the following steps: (i) providing a fiber composite semifinished product based on polyamide, at least one part of the surface of the semifinished product being made of a polymer composition which contains the following: a) 100 wt. % of a polyamide; and b) 0.5 to 20 wt. % of one or more adhesive additives of the formula (I); (ii) providing a metal main part; (iii) optionally pretreating the surface of the metal main part in order to produce functionalities; (iv) introducing the main metal part and the fiber composite semifinished product into a pressing tool and closing the tool; and (v) bonding the fiber composite semifinished product and the metal main part by means of a compression process under the effect of pressure and temperature.