A sealant structure and a method of fabricating a display panel are provided. The sealant structure includes a plurality of adhesive strips, and the adhesive strips overlap end to end to form a closed loop. Ends of at least one of any two adjacent adhesive strips are provided with an overlap region, and a width of the overlap region is less than or equal to one third of a width of the adhesive strip provided with the overlap region.

A display device includes a protective film that includes an adhesive layer. The adhesive layer has a first adhesive strength at a room temperature and has a second adhesive strength equal to or smaller than about 25% of the first adhesive strength in a second state in which a heat or ultraviolet ray is provided.

Provided is an adhesive as follows. The adhesive can bond/secure an adherend to a support with maintaining high adhesiveness during the existence of the need for securing of the adherend to the support, even in a high-temperature environment or in an environment with abrupt temperature change. The adhesive enables debonding of the adherend from the support without breakage of the adherend when the securing becomes unnecessary. The adhesive can be easily removed when remained on the adherend after debonding. The adhesive according to the present invention contains (A) a multivalent vinyl ether compound, (B) a compound including two or more of a constitutional unit represented by Formula (b), and (C) a thermoplastic resin. In the formula, X is selected from hydroxy and carboxy. ##STR00001##

An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance. The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25 C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).

An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance. The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25 C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).

A temporary bonding composition is provided. The temporary bonding composition includes a polyfunctional crosslinker, a polymer and a solvent. The polyfunctional crosslinker includes a compound containing at least two functional groups selected from the group of blocked isocyanate groups, alkenyl ether groups, and alkoxyhydrocarbyl groups. Each of the blocked isocyanate groups is an isocyanate group protected by a blocking agent. The polymer has a functional group reacting to the polyfunctional crosslinker.

A multi-phasic polymer blend for energy activated edge banding adhesion to a substrate is described. While the blend may be used for adhering edge banding to straight substrates, the blend is preferred for adhering edge banding to contoured substrates. The outer, hard, structural layer of the edge banding is formed from a polypropylene component. The polypropylene component at least includes polypropylene and an optional energy adsorber. The inner adhesion layer of the edge banding is formed from a multi-phasic polymer blend that bonds the outer layer of the edge banding to the substrate. The multi-phasic polymer blend at least includes a polyamide component, a polyolefin component, and a modified polypropylene component. Both the outer and inner layers forming the edge banding may be tinted to conform or contrast with the color of the finished substrate.

A multi-phasic polymer blend for energy activated edge banding adhesion to a substrate is described. While the blend may be used for adhering edge banding to straight substrates, the blend is preferred for adhering edge banding to contoured substrates. The outer, hard, structural layer of the edge banding is formed from a polypropylene component. The polypropylene component at least includes polypropylene and an optional energy adsorber. The inner adhesion layer of the edge banding is formed from a multi-phasic polymer blend that bonds the outer layer of the edge banding to the substrate. The multi-phasic polymer blend at least includes a polyamide component, a polyolefin component, and a modified polypropylene component. Both the outer and inner layers forming the edge banding may be tinted to conform or contrast with the color of the finished substrate.

Disclosed is an environment-friendly hot-melt composition for a vehicle interior material, the hot-melt composition including: 65 wt % to 85 wt % of an aromatic polyamide; 10 wt % to 30 wt % of an aliphatic polyamide; 1 wt % to 5 wt % of an olefinic elastomer graft-polymerized with maleic anhydride; and 0.1 wt % to 2 wt % of an antioxidant.

The present disclosure relates to an adhesive printing form attachment layer comprising a support, and a permanently sticky layer suitable for receiving a printing form and fixing a printing form during a printing operation provided on the support, wherein the permanently sticky layer comprises a crosslinked silicone-based material. The present disclosure further relates to a method for preparing an adhesive printing form attachment layer, as well as a printing cylinder comprising it, the use of the an adhesive printing form attachment layer for fixing a flexographic printing plate during a printing operation on a printing cylinder, and a method of operating a printing machine wherein the adhesive printing form attachment layer is used.