A multi-layer film adhesive for reducing squeeze out in a bonded joint is provided. The multi-layer film adhesive has a first adhesive layer having a first chemical property. The multi-layer film adhesive further has a second adhesive layer having a second chemical property, wherein the second chemical property is different from the first chemical property. The multi-layer film adhesive further has a third adhesive layer having a third chemical property, wherein the third chemical property is different from the first and second chemical properties. The first adhesive layer, the second adhesive layer, and the third adhesive layer form the multi-layer film adhesive.

There is provided a multi-layer adhesive for reducing squeeze out. The multi-layer adhesive comprises a first adhesive layer having a first adhesive property and a second adhesive layer having a second adhesive property. The second adhesive property is different from the first adhesive property. The first adhesive layer and the second adhesive layer form a film adhesive. In another embodiment, there is provided a structure comprising a first component and a second component bonded with the multi-layer adhesive.

A maleimide film that utilizes maleimide resin, which shows high heat history resistance and is highly reliable, and an adhesive film with dicing tape including the maleimide film laminated on to a dicing tape. Specifically, it is a maleimide adhesive film, which includes a maleimide resin and a radical initiator with a one-hour half-life temperature of 140 C. or higher. Preferably, it is a maleimide adhesive film, wherein the maleimide resin is of a specific structure. Further, an adhesive film with dicing tape, which included such a maleimide adhesive film laminated on to a dicing tape, is provided.

A method for sealing a container having an opening by contacting the opening with a mixture including a phenethylamine and a first polymer, adding a fluid to be contained to the container, and then adding a second mixture, comprising a second polymer, whereupon an interaction between the first and second polymer mixtures result in a seal being formed over the opening, thereby containing the fluid. The first polymer is typically a water-swellable polymer and the second polymer is typically a hydrophilic polymer that will form an interpenetrating network with the swellable polymer.

The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A),a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A),a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.