Provided is a curable composition containing a reactive mixture of components including an polyethersulfone having a chemical group reactive with an epoxide, a cycloaliphatic polyepoxide resin, a polyepoxide having a functionality greater than two, a liquid diepoxide resin, a first curative containing 9,9-bis(aminophenyl)fluorene or a derivative therefrom and having a curing onset temperature of from 150° C. to 200° C. The components can further comprise a second curative having a curing onset temperature of from 60° C. to 180° C. When thermally curing this composition, the second epoxy curative starts to cure before the first epoxy curative, thereby inhibiting vertical flow of the adhesive during the curing process.

Embodiments provide adhesives for apparel products. The apparel product includes a major component and a minor component. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component of the apparel product forms a secondary portion and is configured to be coupled to the major component. An adhesive is disposed at least partially between a portion of the major component and a portion of the minor component. The adhesive includes a material having a thioester bond.

An ignition-suppressing tape for sealing cut edges of polymer panels, the tape having a backing strip and a sealant strip that is disposed on a portion of a surface of the backing strip, and a pressure sensitive adhesive is disposed on other portions of the same surface of the backing strip.

Embodiments provide methods of disassembling apparel products. The methods include exposing an adhesive of the apparel product to a composition having an acidic or basic pH. The adhesive is disposed at least partially between a major component and a minor component of the apparel product. The adhesive includes a material having a disulfide bond. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

Embodiments provide methods for disassembling an apparel product. The methods include exposing an adhesive of the apparel product to a composition having an acidic or basic pH. The adhesive is disposed at least partially between a major component and a minor component of the apparel product. The adhesive includes a material having a thioester bond. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

An electrically conductive material includes an anionic polymer having a polymer backbone that is bonded to a plurality of terminal catechol moieties and a plurality of terminal sulfonate moieties. It also includes a cationic polymer including poly(3,4-ethylenedioxythiophene).

An ignition-suppressing tape for sealing cut edges of polymer panels, the tape having a backing strip and a sealant strip that is disposed on a portion of a surface of the backing strip, and a pressure sensitive adhesive is disposed on other portions of the same surface of the backing strip.

The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.

Provided are articles, along with related methods, capable of providing an effective adhesive bond to a substrate containing polyetherketoneketone. The multilayered article includes a substrate comprising polyetherketoneketone, an adhesion promoter disposed on the substrate, the adhesion promoter comprising at least one of organotitanate, polyamide, surface-treated nanosilica, ammosilane or epoxy silane, and an adhesive bonded to the adhesion promoter. The adhesive contains at least one of an acrylic polymer, a polysulfide, a polythioether, an epoxy resin, or a silicone resin.

Disclosed is an acrylic adhesive, including an acrylic polymer obtained by polymerizing a mixture of about 120 parts by weight to about 250 parts by weight of acrylic monomers with about 0.1 parts by weight to about 1 parts by weight of an azo initiator, about 0.5 parts by weight to about 1 parts by weight of a filler, about 1.5 parts by weight to about 2.5 parts by weight of a crosslinking agent, and about 0.5 parts by weight to 1 parts by weight of an anti-static agent.