A composition which includes: a polythiol compound; a compound having a carbon-carbon double bond at a terminal of a molecule thereof; a photo radical generator; and a thermal radical generator, a ratio (Ene/SH) of a total molar number (Ene) of the carbon-carbon double bond contained in terminals of a molecule of the compound having a carbon-carbon double bond at a terminal of a molecule thereof to a total molar number (SH) of thiol groups contained in the polythiol compound being higher than 0.20 but equal to or less than 0.70.

To provide an adhesive sheet, the sheet increasing manufacturing efficiency of products including an adhesive agent layer, while using the adhesive agent layer to which an electro-conductive organic polymer compound is added. An adhesive sheet for use in applying a wiring board to a surface onto which the wiring board is to be applied, the adhesive sheet is constituted by an adhesive agent layer including an electro-conductive organic polymer compound and an adhesive material; a first releasing sheet provided on front surface of the adhesive agent layer; and a second releasing sheet provided on a back surface corresponding to a back surface of the front surface in the adhesive agent layer.

A primer compound is provided that can be used as an adhesion promoter on various substrates, particularly metal-containing substrates. Articles containing a metal-containing substrate and a primer layer, which includes the primer compound, positioned adjacent to the substrate are also provided. The articles often include an adhesive layer with the primer layer positioned between the metal-containing substrate and the adhesive layer. The primer compound has a diketone group that can form chelates with various metals through coordination chemistry plus a thiol group that can react with components in the adhesive layer.

A method of bonding substrates that are underwater comprising applying, underwater, a cyanoacrylate composition to at least one substrate and allowing the composition to cure underwater.

A method for manufacturing a semiconductor device is disclosed. The method for manufacturing a semiconductor device includes a first laminated body manufacturing step of manufacturing a first laminated body including, in this order, a semiconductor wafer, a resin layer containing a resin in which the molecular weight is reduced by irradiation with light, and a base material layer; a second laminated body manufacturing step of manufacturing a second laminated body by performing backside grinding on the semiconductor wafer of the first laminated body; and a third laminated body manufacturing step of manufacturing a third laminated body including a semiconductor wafer subjected to backside grinding and the resin layer by removing the base material layer of the second laminated body.

Provided is a sealing method that uses a photo-curable sealant sheet. The sealing method provided comprises, in the following order, a step of obtaining a photo-curable sealant sheet, a step of subjecting the sealant sheet to photoirradiation, and a step of applying the sealant sheet to a target object.