Compositions are provided that include a coating and porous polymeric particles disposed in the coating. Adhesive articles are also provided including a substrate and a composition disposed on a first major surface of the substrate. The composition includes an adhesive and porous polymeric particles disposed in the adhesive. Further, a method of coating a substrate is provided including providing a composition, providing a substrate having a surface, and applying the composition on the surface of the substrate. The compositions and adhesive articles can be applied to wet substrates or dry substrates.

Compositions are provided that include a coating and porous polymeric particles disposed in the coating. Adhesive articles are also provided including a substrate and a composition disposed on a first major surface of the substrate. The composition includes an adhesive and porous polymeric particles disposed in the adhesive. Further, a method of coating a substrate is provided including providing a composition, providing a substrate having a surface, and applying the composition on the surface of the substrate. The compositions and adhesive articles can be applied to wet substrates or dry substrates.

Provided is a curable silicone composition and uses thereof. The composition which has hot-melt properties, strongly adheres to poorly adhesive substrates, and is particularly superior in flexibility and toughness at high temperatures from room temperature to approximately 150° C. in cured products such as overmolding, in addition to providing a cured product that does not easily warp or become damaged even when integrally molded with a lead frame or the like. The composition comprises: (A) organopolysiloxane resin microparticles where 20 mol % or more of all siloxane units is siloxane units represented by RSiO.sub.3/2 where R is a monovalent hydrocarbon group; (B) a silatrane derivative or a carbasilatrane derivative; (C) a curing agent; and (D) a functional inorganic filler. The content of component (D) is 50% or more by volume relative to the overall composition. The composition is solid at 25° C. and has hot-melt properties at a temperature of 200° C. or lower.

Provided is a curable silicone composition and uses thereof. The composition has hot-melt properties, strongly adheres to difficult-to-adhere to base materials, is particularly superior in flexibility and toughness at high temperatures from room temperature to about 150° C. in cured products such as overmolding, and provides a cured product that does not easily warp or become damaged even when integrally molded with a lead frame or the like. The composition comprises: (A1) an organopolysiloxane resin having no hot-melt properties as a whole molecule and contains 20 mol % or more of a siloxane unit represented by SiO.sub.4/2, (A2) a liquid chain organopolysiloxane having at least two curing-reactive functional groups in the molecule, (B) a silatrane derivative or carbasilatrane derivative, (C) a curing agent, and (D) a functional inorganic filler. The content of component (D) is at least 10% by volume. The composition has hot-melt properties at a temperature of 200° C. or lower.

Provided are a silicone-based adhesive protection film and an optical member comprising same, the silicone-based adhesive protective film being formed of a composition comprising an alkenyl group-containing organic polysiloxane mixture and a crosslinker, wherein the alkenyl group-containing organic polysiloxane mixture contains a mixture of component (i) and component (ii) and the crosslinker contains polysiloxane having SiH groups at both ends of the molecule. The silicone-based adhesive protection film has an elongation rate of 80% or more.

A tape assembly for masking an object to be painted and method of use is provided. The tape assembly is defined by a tape body having an anterior side, a posterior side, a body first edge, and an opposing body second edge. The tape body includes a first portion including a first substrate having a first adhesive layer on a posterior side of the first substrate, a second portion including a second substrate having a second adhesive layer on an anterior side of the second substrate, and a third portion including a third substrate having a third adhesive layer on a posterior side of the third substrate. The first and third portions partially overlap with the second portion in opposing first and second overlapping regions, respectively.

A method for manufacturing an electronic device includes at least a preparing step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is reduced by external stimuli, and an unevenness-absorbing resin layer (C) provided between the base material layer and the adhesive resin layer (A) or between the base material layer and the adhesive resin layer (B), an electronic component attached to the adhesive resin layer (A) of the adhesive film and having an uneven structure, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; and a sealing step of sealing the electronic component with a sealing material.

Provided is a curable silicone composition and applications thereof. The curable silicone composition has superior hot-melt properties and moldability, where the flexibility, toughness, and stress relief properties of a cured product obtained therefrom are not impaired even if a large amount of functional inorganic filler is blended in. The curable silicone composition comprises an organopolysiloxane resin component with a weight average molecular weight in a range of 2,000 to 15,000 and that contains a siloxane unit represented by SiO.sub.4/2 making up at least 20 mol % or more of the total siloxane units, and one or more functional fillers. The silicone resin component comprises a curing reactive functional group containing a carbon-carbon double bond, and of that curing reactive functional group, 0.05 to 1.50 mol vinyl (CH2═CH—) group is contained per 100 g of the silicone component. The curable silicone composition generally has hot-melt properties as a whole.

Provided is a thermally conductive thin-film cured product constituted by a cured product of a handleable silicone composition, the cured product having good transferability to a member and good post-debonding handling properties, and exhibiting good bond strength to a heat-generating element, even at elevated temperatures. The thermally conductive thin-film cured product is obtained by curing a silicone composition containing: (a) 100 parts by mass of an organopolysiloxane comprising two or more alkenyl groups per molecule; 200-2,000 parts by mass, inclusive, of a thermally conductive filler; (c) an amount of an organohydrodiene polysiloxane comprising two or more hydrogen atoms directly bonded to a silicon atom per molecule such that Si—H/alkenyl groups is 0.5-50.0, inclusive; (d) an amount of a platinum group metal compound equal to 0.1-1,000 ppm (mass), inclusive, with respect to component (a) in terms of the mass of the platinum group metal element; (e) a reaction regulator, as required; (f) 50-300 parts by mass, inclusive, of a silicone resin; and (g) 0.1-20 parts by mass, inclusive, of an adhesive component selected from (g-1) or (g-2).

The invention provides a composite capable of achieving both excellent followability to an adherend and excellent adhesion. The composite has a support and a plurality of structures fixed to at least one surface of the support, and the structure has a shaft member consisting of a flexible material extending from a proximal end fixed to the support, and an adhesive part arranged at a distal end of the shaft member.