The disclosed adhesive medical article has a backing layer having a first major surface and a second major surface opposite to the first major surface. The backing layer has a central portion and an outer circumferential portion. The article further has a pressure sensitive adhesive pattern coating applied onto at least part of the first major surface of the backing layer in such a way as to form a plurality of adhesive coated and adhesive uncoated areas of the backing layer. The adhesive uncoated areas comprise a central collection portion and at least one longitudinal extension radiating from the central collection portion towards the outer circumferential portion of the backing layer.

Medical tapes include an optically transparent tape backing and an optically transparent adhesive layer, typically a pressure sensitive adhesive, disposed on the backing The tape is optically transparent and has a moisture vapor transmission rate (MVTR) of at least 250 g/m.sup.2 /24 hrs/37° C./100-10% RH using the inverted cup method. The tape remains optically transparent when over-taped, such that a multi-layer tape stack of at least 2 layers of tape are formed.

Provided is a foam sheet that can raise an electrostatic capacitance at the time of compression, and hence can improve sensitivity when used for an electrostatic capacitance sensor. The foam sheet includes: a foam layer; and a pressure-sensitive adhesive layer arranged on at least one side of the foam layer, wherein the foam sheet has a dielectric constant increase amount Q-P at 10% compression of 0.2 (F/m) or more, where P (F/m) represents a dielectric constant of the foam sheet immediately after the foam sheet has been left at rest under conditions of a temperature of 23° C. and a humidity of 50% for 2 hours, and Q (F/m) represents a dielectric constant of the foam sheet at a time when the foam sheet is compressed by 10% immediately after being left at rest under the conditions of a temperature of 23° C. and a humidity of 50% for 2 hours.

A temporary adhesive material for substrate processing adhesion to support the substrate opposite to a surface, the material including: a first temporary adhesive layer; and a second temporary adhesive layer distinct from the first layer, where at least one of the first layer and the second layer has a minimum viscosity of 1 Pa.Math.s or higher and 10,000 Pa.Math.s or lower within 130° C. to 250° C., where: the temporary adhesive material contains 10 parts by mass or more and 100 parts by mass or less of a siloxane bond-containing polymer having a weight-average of 3,000 or more and 700,000 or less as measured by GPC based on a total mass of 100 parts. A temporary material for substrate processing that facilitates the adhesion and separation, allows a quick layer formation, has dimensional resistance to thermal processes, and can raise the productivity of substrates; and manufacturing a laminate using the same.

Provided are adhesive articles that include a silicone adhesive and a substrate, with a primer layer interposed between the silicone adhesive and the substrate. The primer layer includes a polymer having a polyorganosiloxane pendant group P represented by the formula (I) where each R.sup.1 is independently an alkyl, haloalkyl, arylalkyl, alkenyl, aryl, or aryl substituted with an alkyl, alkoxy, or halo; R2 is an alkyl or an alkenyl group; R3 is an alkylene or an arylalkylene group; and n is an integer in the range of 1 to 20. The primer layer typically improves the adhesion between the silicone adhesive and a wide variety of substrates.

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The present disclosure relates to an adhesive film, which includes: a photothermal conversion layer including a light absorbing agent and a pyrolytic resin; a first adhesive layer disposed on the photothermal conversion layer; a base film layer disposed on the first adhesive layer; and a second adhesive layer disposed on the base film layer, and the first adhesive layer and the second adhesive layer include a silicon-based adhesive. The adhesive film according to the present disclosure can simplify a process of processing a substrate, and can prevent a damage of the substrate and a circuit or an element formed on the substrate.

Provided is a flame retardant and heat insulating material having high flame retardancy and a high heat insulating property. Also provided is a flame retardant heat insulator including such flame retardant and heat insulating material having high flame retardancy and a high heat insulating property. A flame retardant and heat insulating material according to one embodiment is formed from a resin composition (A), wherein the resin composition (A) contains: a binder resin; a low-melting point inorganic substance; a high-melting point inorganic substance; and voids. A flame retardant and heat insulating material according to one embodiment is formed from a resin composition (B), wherein the resin composition (B) contains: a binder resin that produces a high-melting point inorganic substance when heated; a low-melting point inorganic substance; and voids and/or a void-forming agent.

The present invention has been made in an effort to provide an adhesive coating composition capable of adhering (fastening) a non-oriented electrical steel sheet without using a conventional fastening method such as welding, clamping, or interlocking, a non-oriented electrical steel sheet stack to which the same is applied, and a manufacturing method thereof. According to an exemplary embodiment of the present invention, an adhesive coating composition includes: 40 to 99 wt % of a first component containing a water-soluble resin; and 1 to 60 wt % of a second component containing a composite metal phosphate.

The present disclosure relates to a stretchable adhesive film comprising a substrate layer comprising an elastomer; and a first adhesive layer provided on one surface of the substrate layer, wherein the stretchable adhesive film satisfies Equation 1, and a display device comprising the same.

A resin composition for temporary fixing of a support for substrate conveyance to an organic substrate, the resin composition containing a thermoplastic resin, a thermosetting resin, and an inorganic filler. When the resin composition is formed into a film that is then heated for 30 minutes at 130° C. and for 2 hours at 170° C., the film obtains an elastic modulus of 350 to 550 MPa at 25° C.