A block copolymer comprising a polymer block (A) mainly comprising a vinyl aromatic monomer unit, and a polymer block (B) mainly comprising a conjugated diene monomer unit, the block copolymer being represented by the following general formula (1) or (2): ##STR00001##
wherein each curved portion represents a saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms which is unsubstituted or optionally has a substituent, X represents a group 1 element, and polymer represents a polymer moiety.

The present invention relates to a hot-melt adhesive composition comprising: i) a copolymer polymerized by metallocene catalysis; ii) from 2% to 50% by weight of a wax of natural origin having a drop melting point ranging from 65 C. to 105 C., relative to the total weight of said composition; iii) a tackifying resin; said hot-melt adhesive composition having a viscosity of less than 3000 mPa.Math.s at 130 C.

To provide an adhesive tape that is difficult to deform, can suppress stickiness on the sides, and can reduce the emission of greenhouse gases while meeting the required characteristics of adhesive tape, such as adhesive strength and holding force, the present invention use an adhesive tape including a base material, which is a laminate with a backside layer formed on one side of a base fabric by lamination processing; and an adhesive layer disposed on the opposite side of the base material from the backside layer, wherein the backside layer includes a thermoplastic resin including polyolefin and the adhesive layer includes natural rubber, a wood-based filler, a plant-derived plasticizer and a tackifier.

The present invention provides a hot melt adhesive, comprising polyester resins with a Tg below 0 C. and frequently combined with polyester resins with a Tg above 50 C. that can be applied at 80 C. or lower, having excellent impact resistance and broad chemical resistance. The hot melt adhesive of the invention is ideally suited for use in the manufacture of handheld and wearable electronic devices.

The present invention provides a water-based hot-melt adhesive for healthcare packaging. The water-based hot-melt adhesive includes 25 to 70 parts by weight of an ethylene vinyl acetate copolymer, 5 to 20 parts by weight of an ethylene acrylic acid copolymer, 6.5 to 55 parts by weight of a water-based paraffin, and 5 to 15 parts by weight of particulate wax, in which a particle size of particulate wax is less than 8 m. A coating layer formed on a medical paper from the water-based hot-melt adhesive of the present invention has great gas-permeability. After the coating layer is sealed with flexible sheet or blister container at the peripheral edges thereof, it has satisfied seal strength and peelability.

Disclosed are a hot melt adhesive for pole piece edge protection, a preparation method thereof and a protection method thereof, the hot melt adhesive includes 30-60% of polyolefin resin, 20-40% of tackifying resin, 5%-25% of wax, 2-10% of mineral oil and 0-20% of functional filler, the polyolefin resin is compounded by a first polyolefin group and a second polyolefin group in a mass ratio of (2-8):1; the first polyolefin group includes modified polypropylene with a density lower than 0.9 g/cm.sup.3 and a melt flow rate of 4-10 g/10 min; the second polyolefin group includes at least one of polyethylene, a copolymer of ethylene and C.sub.4-C.sub.10 -olefin, amorphous poly--olefin, acid or anhydride-modified polyolefin, and a polyolefin elastomer; and the hot melt adhesive has a softening point above 100 C., a melt viscosity below 5000 cps, and surface drying time less than 5 min.

A hot-melt adhesive having reduced thread formation at the time of applying, excellent thermal resistance and thermal stability after bonding. A hot-melt adhesive comprising a copolymer of ethylene and olefins having 3 to 20 carbon atoms (A), a copolymer of ethylene and carboxylate esters having ethylenically unsaturated double bonds (B), a tackifying resin (C) and a wax (D), wherein the copolymer of ethylene and at least one olefin monomer having 3 to 20 carbon atoms (A) comprises a metallocene-type propylene/ethylene copolymer (A1).

The invention relates to a rubber-based composition that can be thermally cured at reduced temperature while retaining performance over a broad cure temperature window comprising at least one solid rubber, at least one diene-based polymer or copolymer containing an olefinic double bond and/or an aromatically substituted olefin, suitable for undergoing curing with a curing system present as quinone dioxime, peroxides and optional multifunctional acrylates, preferably in the absence of elemental sulfur. The cured composition exhibits improved reversion resistance and adhesion strength on aluminum.

A composition contains (A) an ethylene/a-olefin copolymer having a density from 0.855 g/cc to 0.895 g/cc and a melt viscosity, at 177 C., from 5,000 mPa-s to 50,000 mPa-s; (B) a functionalized propylene-based polymer containing from 1 wt % to 10 wt % functional groups, the functionalized propylene-based polymer having a melt viscosity, at 190 C., from greater than 10,000 mPa-s to 50,000 mPa-s and a weight average molecular weight, Mw, greater than 30,000 g/mol; (C) a tackifier; and (D) a wax.

Provided is a hot-melt adhesive composition, comprising: an -olefin (co)polymer (A) that is produced using a single-site catalyst and has a Shore A hardness of 80 or more; an -olefin (co)polymer (B) that is produced using a single-site catalyst and has a Shore A hardness of less than 80; an ethylene-polar group-containing monomer copolymer (C); and a polypropylene-based wax (D), wherein the polypropylene-based wax (D) is comprised in an amount of 60 parts by mass to 300 parts by mass with respect to a total of 100 parts by mass of the -olefin (co)polymer (A), the -olefin (co)polymer (B), and the ethylene-polar group-containing monomer copolymer (C).