In some embodiments, a formliner comprises a body comprising a defining a plurality of cavities arranged in a repeating pattern. A sealant is provided in each cavity. The sealant comprises a gel mixture of wax and vegetable oil. In some embodiments, the wax comprises carnauba wax and/or beeswax.

The present invention pertains to a stabilized hot melt adhesive containing a) one or more hot melt adhesive materials and b) a stabilizer composition. The one or more hot melt adhesive materials a) include a polyolefin, a styrene-isoprene-styrene block co-polymer, a styrene-butadiene-styrene block co-polymer, a polyacrylate, an acryl-copolymer, an ethylene vinyl acetate, a polyamide, a polyester, a polyurethane, a polyimide, a silane terminated polyolefin, a silane terminated poly-ether, and a silane terminated polyurethane. The stabilizer composition includes two or three of a component (A) which is a specific sterically hindered amine, a component (B) which is a polymeric sterically hindered amine, and a component (C) which is a specific sterically hindered phenol.

A hot melt adhesive composition comprises a polymer blend based on a first polymer component having a low melting point and is selected from a polypropylene homopolymer and a copolymer of propylene and ethylene and mixtures thereof; a second polymer component comprising an amorphous polyolefin; and about 30% to about 75% by weight of a tackifying resin. The composition optionally further contains a plasticizer, an antioxidant, a wax, a filler, a colorant, a UV absorber, another polymer, or combinations thereof. The hot melt composition has a viscosity equal to or less than about 80,000 cP at 180 C. and is useful for a variety of industrial applications including bonding together the substrates used in disposable hygiene products, such as nonwoven layers, elastic attachments, and thermoplastic films (polyolefin, polylactic acid, etc.). The hot melt adhesive composition may be dually functional, serving as an elastic component adhesive and a construction adhesive.

The present invention relates to a two-component composition comprising: a composition A comprising: at least one reducing agent; at least one (meth)acrylate monomer; a composition B comprising: at least one oxidising agent; andoptionally at least one (meth)acrylate monomer; the composition being characterised in that: it comprises at least one radical photoinitiator in composition A and/or B; it comprises at least one polymerisation inhibitor in an amount less than or equal to 0.3% by weight relative to the total weight of the composition.

Objective of the invention is to provide a hot-melt adhesive excellent in thermal resistance, good in adhesiveness over a wide range from low temperature to high temperature, and also excellent in thermal stability. Means for solving the problem is a hot-melt adhesive comprising an olefin copolymer (A), a tackifying resin (B) and a wax (C), wherein the olefin copolymer (A) comprises a metallocene-type ethylene/-olefin copolymer (A1) having a melting point of 100 to 140 C.

Use of a hot-melt adhesive for adhesive bonding of at least a first packaging and a second packaging, the hot-melt adhesive comprising: (a) 50-85 parts per weight of a basis polymer, wherein the basis polymer is consisting of a metallocene catalyzed polyolefin polymer, preferably ethene-1-octene-copolymer; (b) 10-25 parts per weight of a modifying polymer, the modifying polymer comprising a styrene block copolymer; (c) 5-25 parts per weight of a reinforcing wax, preferably a polyethylene wax or a wax produced by the Fischer-Tropsch synthesis route, the wax component preferably comprising paraffinic oil, naphthenic oil, polybutene, dibasic ester, polyol or mixtures thereof; and (d) 0.05-1.5 parts per weight of a stabilizer component comprising a sterically hindered phenolic antioxidant and/or a hindered amine light stabilizer and a pack comprising the hot-melt adhesive.

The powder adhesive comprises a thermoplastic resin and particles of an aromatic compound, wherein the particles of an aromatic compound are particles of a compound that has an aromatic ring and an azo bond bonded to the aromatic ring, or are particles of a compound comprising a heteroaromatic ring comprising nitrogen atom; the thermoplastic resin comprises an ester group; and, designating Es (mmol/g) as an ester group concentration in the thermoplastic resin, M (mass %) as a content of the aromatic compound particles in the powder adhesive, and N (mmol/g) as a nitrogen atom concentration in the aromatic compound particles, Es is from 1.0 mmol/g to 4.5 mmol/g, M is from 1.010.sup.4 mass % to 1.010.sup.0 mass %, and N is from 5.0 mmol/g to 15.0 mmol/g.

A hot melt adhesive composition includes less than 35% by weight polymer where the polymer includes an ethylene/alpha-olefin copolymer, or a combination of an ethylene/alpha-olefin copolymer and a propylene polymer, a wax, and a tackifying agent, and the composition exhibits a. viscosity of no greater than 2000 centipoise at 107 C.

A hot melt adhesive composition comprises from 22% to 60% by weight of at least one styrene block copolymer (A) (designated SBC (A)) and from 0.1% to 5% by weight of at least one wax having a congealing point higher than or equal to 60 C. and a needle penetration at 25 C. lower than or equal to 2 dmm. SBC (A) comprises at least one linear styrene block copolymer (A1); and optionally at least one styrene diblock copolymer (A2). The styrene block copolymer (A) has a styrene content higher than or equal to 38% by weight based on the total weight of SBC (A); and a diblock content ranging from 0% to 10% by weight based on the total weight of SBC (A). The hot melt adhesive composition has a viscosity at 120 C. higher than or equal to 30,000 mPa.Math.s, and a viscosity at 177 C. lower than or equal to 5,000 mPa.Math.s.

The present invention relates to a pressure-sensitive adhesive composition containing at least one polymer, at least one liquid resin comprising an oligoester composition as described herein and at least one further plasticizer, wherein the at least one further plasticizer comprises an isobutene/butene copolymer. The invention also relates to the use of the pressure-sensitive adhesive composition according to the invention, to a method for preparing the pressure-sensitive adhesive composition, and to a method for bonding at least two substrates. Finally, the invention relates to an article comprising the pressure-sensitive adhesive composition according to the invention.