A method is provided for forming an adhered membrane roof system. The method comprises applying a bond adhesive to a substrate on a roof to form an adhesive layer and applying a membrane directly to the adhesive layer. The bond adhesive includes a polymer having a silicon-containing hydrolyzable terminal group.

A bond adhesive composition comprising a polymer having a silicon-containing hydrolyzable terminal group and a hydrocarbon resin, where the composition is substantially devoid of phenolic resin.

An anisotropic conductive film with a structure wherein an electrically insulating adhesive base layer and cover layer are stacked, and electrically conductive particles are disposed at lattice points with a planar lattice pattern in the vicinity of the interface of the layers. In the anisotropic conductive film, a proportion of lattice points at which no electrically conductive particles are disposed with respect to all lattice points with the planar lattice pattern assumed in any reference region is 25% or less, and some of the electrically conductive particles disposed at lattice points with planar lattice pattern are disposed to be shifted in longitudinal direction of anisotropic conductive film with respect to corresponding lattice points, and a shift amount defined as a distance between a plane projection center of the electrically conductive particles disposed to be shifted and the corresponding lattice point is less than 50% the electrically conductive particles' average diameter.

A barrier adhesive comprising an adhesive base composed of at least one reactive resin having at least one activatable group, at least one elastomer, optionally at least one adhesive resin, wherein the adhesive base has a water vapour permeation rate after the activation of the reactive resin of less than 100 g/m.sup.2d, preferably of less than 50 g/m.sup.2d, especially less than 15 g/m.sup.2d, further comprising a transparent molecularly dispersed getter material and optionally a solvent, in which the getter material is at least one cyclic azasilane, has very long lag times and can be used over an area for encapsulation of organic electronic structures, since the sensitive structures are not damaged.

In some embodiments, a formliner comprises a body comprising a defining a plurality of cavities arranged in a repeating pattern. A sealant is provided in each cavity. The sealant comprises a gel mixture of wax and vegetable oil. In some embodiments, the wax comprises carnauba wax and/or beeswax.

Disclosed herein is a semiconductor device including: a support; a double-layered adhesive resin layer formed on the support, an insulating layer and a redistribution layer formed on the adhesive resin layer; a chip layer, and a mold resin layer, wherein the adhesive resin layer includes a resin layer A containing a resin decomposable by light irradiation and a resin layer B containing a non-silicone-based thermoplastic resin, the resin layer A and the resin layer B being provided in this order from the support side, the resin decomposable by light irradiation is a resin containing a fused ring in its main chain, and the non-silicone-based thermoplastic resin has a glass transition temperature of 200 C. or higher.

A bond adhesive composition comprising a polymer having a silicon-containing hydrolyzable terminal group and a hydrocarbon resin, where the composition is substantially devoid of phenolic resin.

In some embodiments, a formliner comprises a body comprising a defining a plurality of cavities arranged in a repeating pattern. A sealant is provided in each cavity. The sealant comprises a gel mixture of wax and vegetable oil. In some embodiments, the wax comprises carnauba wax and/or beeswax.

An object of the present invention is to provide a polymer that has excellent heat resistance and dielectric properties and can be dissolved in an organic solvent at a high concentration, a resin composition containing the same, and a molded body thereof. The polymer of the present invention has a repeating unit derived from a polymerizable compound of the following formula (I) (In the formula, X.sup.1 and X.sup.2 each independently represent a C3 to C6 branched alkyl group, a C3 to C6 cyclic alkyl group, a C3 to C6 branched alkoxy group, or a C3 to C6 cyclic alkoxy group, n represents 0 or 1, Z.sup.1 and Z.sup.2 each independently represent a single bond or a C1 to C3 alkylene group, each R independently represents an organic group or a halogeno group, m1 and m2 each independently represent any integer of 0 to 4, and Y represents a polymerizable functional group).

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The present invention provides a low tack bubble free advertisement film, comprising an advertisement film layer, a dot glue layer and a release layer; a adhesion promoter layer is disposed between the back face of the advertisement film layer and the dot glue layer; the dot glue layer consists of over four independent, separable glue dots; and the area of the dot glue layer is 30-80% of the adhesion promoter layer. The present invention can provide a special advertisement film in the field of advertising consumables. The advertisement film has many advantages, such as low tack, totally bubble free, removable, and can be pasted for a long time. The present invention provides a convenient, efficient, feasible solution for advertising consumables.