Patent classifications
C22B15/00
ALLOY POWDER, METHOD FOR MANUFACTURING SAME, AND METHOD FOR RECOVERING VALUABLE METAL
Provided are: an alloy powder in which nickel and cobalt can be easily dissolved in an acid and stably leached with an acid; a manufacturing method with which an alloy powder that enables stable acid leaching can be obtained at low cost; and a method for recovering a valuable metal using the manufacturing method. An alloy powder according to the present invention includes copper (Cu), nickel (Ni), and cobalt (Co) as constituents, has a 50% cumulative diameter (D50) of 30 .Math.m to 85 .Math.m in the volume particle size distribution, and has an oxygen content of 0.01 mass% to 1.00 mass%.
ALLOY POWDER, METHOD FOR MANUFACTURING SAME, AND METHOD FOR RECOVERING VALUABLE METAL
Provided are: an alloy powder in which nickel and cobalt can be easily dissolved in an acid and stably leached with an acid; a manufacturing method with which an alloy powder that enables stable acid leaching can be obtained at low cost; and a method for recovering a valuable metal using the manufacturing method. An alloy powder according to the present invention includes copper (Cu), nickel (Ni), and cobalt (Co) as constituents, has a 50% cumulative diameter (D50) of 30 .Math.m to 85 .Math.m in the volume particle size distribution, and has an oxygen content of 0.01 mass% to 1.00 mass%.
EXTRACTION OF BASE METALS USING CARBONACEOUS MATTER AND A THIOCARBONYL FUNCTIONAL GROUP REAGENT
The present disclosure relates to the use of carbonaceous matter and a reagent comprising a thiocarbonyl functional group, for example, in a method for extracting a base metal such as copper from a material comprising the base metal. Such methods can comprise contacting the material under acidic conditions with the carbonaceous matter and the reagent comprising the thiocarbonyl functional group; and optionally recovering the base metal.
METHOD FOR RECOVERING GOLD AND COPPER FROM ELECTRONIC COMPONENTS
A method for recovering gold from electronic components includes a first macro-step of dissolving gold and copper from the electronic components using an aqueous solution comprising HNO.sub.3 concentrated in a percentage varying from 28% to 38% and concentrated HCl in a percentage varying from 15% to 25%. A second macro-step includes adding KOH to the obtained solution to bring it to a pH between 0.5 and 0.9. A third macro-step includes adding to the solution obtained in the second macro-step an amount of ascorbic acid dissolved in water equal to the amount of gold hypothetically present in a sample of the first macro-step, multiplied by a factor ranging between 1.5 and 3, causing precipitation of gold, which is separated from the solution and made available in powder form in a fourth macro-step.
3-dimensional nor string arrays in segmented stacks
A memory structure formed above a semiconductor substrate includes two or more modules each formed on top of each other separated by a layer of global interconnect conductors. Each memory module may include a 3-dimensional array of memory transistors organized as NOR array strings. Each 3-dimensional array of memory transistors is provided vertical local word lines as gate electrodes to the memory transistors. These vertical local word lines are connected by the layers of global interconnect conductors below and above the 3-dimensional array of memory transistors to circuitry formed in the semiconductor substrate.
3-dimensional nor string arrays in segmented stacks
A memory structure formed above a semiconductor substrate includes two or more modules each formed on top of each other separated by a layer of global interconnect conductors. Each memory module may include a 3-dimensional array of memory transistors organized as NOR array strings. Each 3-dimensional array of memory transistors is provided vertical local word lines as gate electrodes to the memory transistors. These vertical local word lines are connected by the layers of global interconnect conductors below and above the 3-dimensional array of memory transistors to circuitry formed in the semiconductor substrate.
RECOVERY OF PRECIOUS AND CHALCOPHILE METALS
A process for recovery of one or more elements, selected from precious metals and chalcophile metals, as herein defined, from materials containing precious and/or chalcophile metal/s, said process including: (i) contacting the material with an alkaline solution containing a lixiviant comprising an amino acid, or derivative thereof, and an alkali stable transition metal complex in order to form a leachate containing the precious metal and/or chalcophile metal; and (ii) recovering the precious metal and/or chalcophile metal from the leachate.
RECOVERY OF PRECIOUS AND CHALCOPHILE METALS
A process for recovery of one or more elements, selected from precious metals and chalcophile metals, as herein defined, from materials containing precious and/or chalcophile metal/s, said process including: (i) contacting the material with an alkaline solution containing a lixiviant comprising an amino acid, or derivative thereof, and an alkali stable transition metal complex in order to form a leachate containing the precious metal and/or chalcophile metal; and (ii) recovering the precious metal and/or chalcophile metal from the leachate.
Method for the recovery of metals from electronic waste
A method for obtaining metals of the 8th to 14th groups, in particular raw copper, comprises the following steps: i) providing and melting down a mixed feed comprising electronic waste in a smelting reactor, so that a first melt with a first metallic phase and a first slag phase is formed; ii) separating out the first slag phase from the smelting reactor; iii) refining the remaining first metallic phase by means of an oxygen-containing gas, possibly with the addition of copper-containing residual materials, so that a second, copper-enriched slag phase is formed; iv) possibly separating off the second slag phase and repeating the step; v) separating off the refined first metallic phase from the smelting reactor; and vi) adding a further mixed feed comprising electronic waste to the remaining second, copper-enriched slag phase and repeating process steps i) to vi).
METHOD FOR RECOVERING VALUABLE METAL
Provided is a method that allows for efficient removal of an impurity metal, and further, the recovery of a valuable metal with high efficiency. The method for recovering a valuable metal (Cu, Ni, and Co) includes the steps of: preparing a charge comprising at least a valuable metal as a raw material; heating and melting the raw material to form an alloy and a slag; and separating the slag to recover the alloy containing the valuable metal, wherein the heating and melting of the raw material comprises charging the raw material into a furnace of an electric furnace equipped with an electrode therein, and further melting the raw material by means of Joule heat generated by applying an electric current to the electrode, or heat generation of an arc itself, and thereby separating the raw material into a molten alloy and a molten slag present over the alloy.