Provided are an aluminum alloy having an adjusted microstructure in an aluminum matrix or an aluminum alloy matrix for high elongation percentage or high strength and a method of fabricating the same. The aluminum alloy includes an aluminum-based matrix; and a nonmetal element solidified in the aluminum-based matrix, wherein stacking fault energy of the aluminum alloy is decreased compared to that of pure aluminum.

Provided are an aluminum alloy having an adjusted microstructure in an aluminum matrix or an aluminum alloy matrix for high elongation percentage or high strength and a method of fabricating the same. The aluminum alloy includes an aluminum-based matrix; and a nonmetal element solidified in the aluminum-based matrix, wherein stacking fault energy of the aluminum alloy is decreased compared to that of pure aluminum.

There is provided a silver-coated copper powder, which has excellent storage stability (reliability), and a method for producing the same. A silver-coated copper powder obtained by coating the surface of a copper powder, which is obtained by the atomizing method or the like, with 5 wt % or more (with respect to the silver-coated copper powder) of a silver containing layer of silver or a silver compound, is added to a gold plating solution, which is a potassium gold cyanide solution (to which at least one of tripotassium citrate monohydrate, anhydrous citric acid and L-aspartic acid is preferably added), to cause 0.01 wt % or more (with respect to the silver-coated copper powder) of gold to be supported on the surface of the copper powder coated with the silver containing layer.

There is provided a silver-coated copper powder, which has excellent storage stability (reliability), and a method for producing the same. A silver-coated copper powder obtained by coating the surface of a copper powder, which is obtained by the atomizing method or the like, with 5 wt % or more (with respect to the silver-coated copper powder) of a silver containing layer of silver or a silver compound, is added to a gold plating solution, which is a potassium gold cyanide solution (to which at least one of tripotassium citrate monohydrate, anhydrous citric acid and L-aspartic acid is preferably added), to cause 0.01 wt % or more (with respect to the silver-coated copper powder) of gold to be supported on the surface of the copper powder coated with the silver containing layer.

A method for producing microparticles and/or nanoparticles based on zero-valent metals directly inside a filtering media and/or for creating covering layers based on the zero-valent metals for covering. The filleting media includes the steps of introducing at least one solution containing metal salts in the filtering medium, introducing at least one solution containing inorganic reducing agents into the filtering medium. The steps of introducing the at least one solution containing metal salts and the at least one solution containing inorganic reducing agents inside the filtering medium is carried out in a way separated in time and/or in space to realize, in the filtering medium, a mixture of metal ions with the inorganic reducing agents as well as a chemical reduction of the zero-valent metals to form the microparticles and/or the nanoparticles and/or coverings based on the zero-valent metals inside of the filtering medium.

Disclosed is an electrode including a rhodium alloy, wherein the rhodium alloy includes rhodium and nickel. The alloy includes a greater quantity of rhodium as compared to any other individual element of the alloy.

Contacts that may be highly corrosion resistant, may be readily manufactured, and may conserve precious materials. One example may provide contacts having a layer of a precious-metal alloy to improve corrosion resistance. The precious-metal-alloy layer may be plated with a hard, durable, wear and corrosion resistant plating stack for further corrosion resistance and wear improvement. The resources consumed by a contact may be reduced by forming a bulk or substrate region of the contact using a more readily available material, such as copper or a material that is primarily copper based.

A method for manufacturing a part by alloying a precious metal with boron, wherein: a quantity of precious metal reduced to powder form is provided; a quantity of a nano-structured micrometric boron powder is provided; the precious metal powder is mixed with the nano-structured micrometric boron powder to obtain a mixture; the mixture is compacted by applying a uniaxial pressure; the mixture is subjected to a spark plasma sintering or flash sintering treatment, or to a hot isostatic pressing (HIP) treatment, to obtain an ingot of a precious metal/boron alloy, and the ingot is machined to obtain the part, or the ingot is reduced to powder form by a micronisation treatment and the powder is treated to obtain the part. Additionally, a gold/boron alloy.

A filler for vacuum brazing of TU1 oxygen-free copper is an Au—Cu—Ni filler including the following elemental compositions in a specified proportion: 69% to 90% of Au, 9% to 30% of Cu, and 1% to 5% of Ni. The filler has a melting temperature of 900° C. to 910° C. The filler for vacuum brazing of TU1 oxygen-free copper can be used for brazing X-ray tube anodes, thereby realizing effective vacuum brazing.

An electrically-conductive material containing Ag in an amount of 10 mass % or more and 70 mass % or less, Pd in an amount of 30 mass % or more and 90 mass % or less, Ni in an amount of more than 5 mass % and 45 mass % or less, and inevitable impurities. A ratio of a Ni content (mass %) to a Ag content (mass %) (Ni (mass %)/Ag (mass %)) is 0.1 or more and 5.0 or less, metal structures include a AgPd alloy phase and a PdNi alloy phase, and a volume ratio of the PdNi alloy phase is 18 vol % or more and 80 vol % or less. Ni is added in a high concentration to a AgPd alloy, and the amount of PdNi alloy phases generated as separate phases is controlled to strengthen the entire alloy.