In the production of an internal-tin-processed Nb.sub.3Sn superconducting wire, the present invention provides a Nb.sub.3Sn superconducting wire that is abundant in functionality, such as, the promotion of formation of a Nb.sub.3Sn layer, the mechanical strength of the superconducting filament (and an increase in interface resistance), the higher critical temperature (magnetic field), and the grain size reduction, and a method for producing it. A method for producing a Nb.sub.3Sn superconducting wire according to an embodiment of the present invention includes a step of providing a bar 10 that has a Sn insertion hole 12 provided in a central portion of the bar 10 and a plurality of Nb insertion holes 14 provided discretely along an outer peripheral surface of the Sn insertion hole 12, and that has an alloy composition being Cu-xZn-yM (x: 0.1 to 40 mass %, M=Ge, Ga, Mg, or Al, provided that, for Mg, x: 0 to 40 mass %), a step of mounting an alloy bar with an alloy composition of Sn-zQ (Q=Ti, Zr, or Hf) into the Sn insertion hole 12 and inserting Nb cores into the Nb insertion holes 14, a step of subjecting the bar 10 to diameter reduction processing to fabricate a Cu-xZn-yM/Nb/Sn-zQ composite multicore wire with a prescribed outer diameter, and a step of subjecting the composite multicore wire to Nb.sub.3Sn phase generation heat treatment.

A manufacturing method of an integrated circuit (IC) packaging structure includes the following steps. One or a plurality of dies is disposed on a packaging substrate. An encapsulation material is formed on the packaging substrate. The encapsulation material is configured to encapsulate the one or the plurality of the dies on the packaging substrate. At least one trench is formed in the encapsulation material. A heat dissipation structure is formed on the encapsulation material, and at least a part of the heat dissipation structure is formed in the at least one trench. The step of forming the heat dissipation structure includes the following steps. A first slurry is formed in the at least one trench, and a first curing process is performed to the first slurry for forming a first portion of the heat dissipation structure.

An electronic wire and a cable which are excellent in bending resistance even when a diameter is small. The electronic wire has a conductor and a resin insulating layer coated on the conductor. The conductor is a double twisted wire in which twisted wires formed by twisting a plurality of wires are twisted, a diameter of the wire is 0.05 mm or more and 0.2 mm or less, a cross-sectional area of the conductor is 1.0 mm.sup.2 or more and 3.0 mm.sup.2 or less, a breaking elongation of the conductor is 10% or more and 17% or less, a tensile strength of the conductor is 200 MPa or more and 400 MPa or less, and the insulating layer is disposed to be in close contact with the conductor and has a solid structure.

A preparation method for a W—Cu composite plate with a Cu phase in finger-shaped gradient distribution is provided. The method includes adding WO.sub.X powder obtained with ammonium metatungstate as a raw material into W powder through a combustion synthesis method, adding a binder and a pore-forming agent to prepare a slurry, then performing tape casting, soaking in water and sintering to obtain a W framework with pores in finger-shaped distribution, and then infiltrating Cu to obtain a target product. The Cu phase in the W—Cu composite material prepared by the present method is distributed in a finger-shaped gradient manner from an infiltration surface to the interior of a specimen, the Cu phase and the W phase are mutually pinned, and the W—Cu interface has good bonding strength. The present method has the characteristics of adjustable material component performance, simple process, low cost, suitability for large-scale production and the like.

The present invention relates to an electrolytic copper foil for a secondary battery, having excellent flexural resistance, and a method for producing the electrolytic copper foil. The electrolytic copper foil for a secondary battery has excellent flexural resistance even without the use of many additives in a copper electrolyte when producing a copper foil. The electrolytic copper foil for a secondary battery according to the present invention is an electrolytic copper foil for a secondary battery, which is produced from a plating solution, containing total organic carbon (TOC), cobalt and arsenic, by using a drum and is coated with a negative electrode active material, wherein the ratio between the TOC, cobalt and arsenic contained in the electrolytic copper foil follows the following formula 1:
TOC/(cobalt+arsenic)=1.30-1.55.  [Formula 1]

The present invention relates to an electrolytic copper foil for a secondary battery, having excellent flexural resistance, and a method for producing the electrolytic copper foil. The electrolytic copper foil for a secondary battery has excellent flexural resistance even without the use of many additives in a copper electrolyte when producing a copper foil. The electrolytic copper foil for a secondary battery according to the present invention is an electrolytic copper foil for a secondary battery, which is produced from a plating solution, containing total organic carbon (TOC), cobalt and arsenic, by using a drum and is coated with a negative electrode active material, wherein the ratio between the TOC, cobalt and arsenic contained in the electrolytic copper foil follows the following formula 1:
TOC/(cobalt+arsenic)=1.30-1.55.  [Formula 1]

Provided is a metal matrix nanocomposite comprising: (a) a metal or metal alloy as a matrix material; and (b) multiple graphene sheets that are dispersed in said matrix material, wherein said multiple graphene sheets are substantially aligned to be parallel to one another and are in an amount from 0.1% to 95% by volume based on the total nanocomposite volume; wherein the multiple graphene sheets contain single-layer or few-layer graphene sheets selected from pristine graphene, graphene oxide, reduced graphene oxide, graphene fluoride, graphene chloride, graphene bromide, graphene iodide, hydrogenated graphene, nitrogenated graphene, doped graphene, chemically functionalized graphene, or a combination thereof and wherein the chemically functionalized graphene is not graphene oxide. The metal matrix exhibits a combination of exceptional tensile strength, modulus, thermal conductivity, and/or electrical conductivity.

Provided is a metal matrix nanocomposite comprising: (a) a metal or metal alloy as a matrix material; and (b) multiple graphene sheets that are dispersed in said matrix material, wherein said multiple graphene sheets are substantially aligned to be parallel to one another and are in an amount from 0.1% to 95% by volume based on the total nanocomposite volume; wherein the multiple graphene sheets contain single-layer or few-layer graphene sheets selected from pristine graphene, graphene oxide, reduced graphene oxide, graphene fluoride, graphene chloride, graphene bromide, graphene iodide, hydrogenated graphene, nitrogenated graphene, doped graphene, chemically functionalized graphene, or a combination thereof and wherein the chemically functionalized graphene is not graphene oxide. The metal matrix exhibits a combination of exceptional tensile strength, modulus, thermal conductivity, and/or electrical conductivity.

An embodiment relates to an ultrasonic additive manufacturing process, comprising joining a foil comprising a bulk metallic glass to a substrate; and forming a cladded composite comprising the foil and the substrate; wherein a thickness of the cladded composite is greater than a critical casting thickness of the bulk metallic glass, wherein the cladded composite comprises a cladding layer of the bulk metallic glass on the substrate and the bulk metallic glass comprises approximately 0% crystallinity, approximately 0% porosity, less than 50 MPa thermal stress, approximately 0% distortion, approximately 0 inch heat affected zone, approximately 0% dilution, and a strength of about 2,000-3,500 MPa.

An embodiment relates to an ultrasonic additive manufacturing process, comprising joining a foil comprising a bulk metallic glass to a substrate; and forming a cladded composite comprising the foil and the substrate; wherein a thickness of the cladded composite is greater than a critical casting thickness of the bulk metallic glass, wherein the cladded composite comprises a cladding layer of the bulk metallic glass on the substrate and the bulk metallic glass comprises approximately 0% crystallinity, approximately 0% porosity, less than 50 MPa thermal stress, approximately 0% distortion, approximately 0 inch heat affected zone, approximately 0% dilution, and a strength of about 2,000-3,500 MPa.