The disclosed process is capable of depositing thin layers of a wide variety of metals onto powders of magnesium, aluminum, and their alloys. A material is provided that comprises particles containing a reactive metal coated with a noble metal that has a less-negative standard reduction potential than the reactive metal. The coating has a thickness from 1 nanometer to 100 microns, for example. A method of forming an immersion deposit on a reactive metal comprises: combining a reactive metal, an ionic liquid, and a noble metal salt; depositing the noble metal on the reactive metal by a surface-displacement reaction, thereby generating the immersion deposit on the reactive metal; and removing the ionic liquid from the immersion deposit. The material may be present in an article or object (e.g., a sintered part) containing from 0.25 wt % to 100 wt % of a coated reactive metal as disclosed herein.

A composition of a copper alloy for a laser cladding valve sheet is disclosed. The copper alloy includes a matrix structure and a hard phase, which includes 12 to 24 wt % of Ni, 2 to 4 wt % of Si, 8 to 30 wt % of Fe, more than 5 wt % and less than 10 wt % of Mo, 2 to 10 wt % of Al, and the balance Cu. The interfacial delamination may be suppressed in a fatigue environment by micronizing the hard phase and the distribution thereof, thereby improving fatigue resistance and wear resistance.

An electronic device includes a metal member and a connected member. A metal connecting layer is provided between a lower-side surface of the metal member and an upper-side surface of the connected member, to connect the metal member and the connected member to each other. The metal connecting layer includes at least one of metal films, each of which is made of gold or gold alloy. A thickness of the metal connecting layer in an opposing area between the metal member and the connected member is smaller than a flatness of each of the lower-side surface and the upper-side surface. A rust-preventing film is formed on a side wall of the metal member in such a way that the rust-preventing film extends from an outer periphery of the metal connecting layer to a position away from the outer periphery by a predetermined distance.

An electronic device includes a metal member and a connected member. A metal connecting layer is provided between a lower-side surface of the metal member and an upper-side surface of the connected member, to connect the metal member and the connected member to each other. The metal connecting layer includes at least one of metal films, each of which is made of gold or gold alloy. A thickness of the metal connecting layer in an opposing area between the metal member and the connected member is smaller than a flatness of each of the lower-side surface and the upper-side surface. A rust-preventing film is formed on a side wall of the metal member in such a way that the rust-preventing film extends from an outer periphery of the metal connecting layer to a position away from the outer periphery by a predetermined distance.

This pure copper plate or sheet contains 99.96% by mass or greater of Cu, in which when an average crystal grain size of crystal grains in a rolled surface is represented by X μm and an amount of Ag is represented by Y mass ppm, an expression of 1×10.sup.−8≤X.sup.−3Y.sup.−1≤1×10.sup.−5 is satisfied, and when a ratio of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to all grain boundary triple junctions is defined as NF.sub.JE and a ratio of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary constituting the grain boundary triple junction is a random grain boundary, to all grain boundary triple junctions is defined as NF.sub.J2, an expression of 0.30<(NF.sub.J2/(1−NF.sub.J3)).sup.0.5≤0.48 is satisfied.

This pure copper plate or sheet contains 99.96% by mass or greater of Cu, in which when an average crystal grain size of crystal grains in a rolled surface is represented by X μm and an amount of Ag is represented by Y mass ppm, an expression of 1×10.sup.−8≤X.sup.−3Y.sup.−1≤1×10.sup.−5 is satisfied, and when a ratio of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to all grain boundary triple junctions is defined as NF.sub.JE and a ratio of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary constituting the grain boundary triple junction is a random grain boundary, to all grain boundary triple junctions is defined as NF.sub.J2, an expression of 0.30<(NF.sub.J2/(1−NF.sub.J3)).sup.0.5≤0.48 is satisfied.

A copper alloy has a composition including 70 mass ppm or more and 400 mass ppm or less of Mg; 5 mass ppm or more and 20 mass ppm or less of Ag; less than 3.0 mass ppm of P; and a Cu balance containing inevitable impurities. In the copper alloy, the electrical conductivity is 90% IACS or more, and a length L.sub.LB of a low-angle grain boundary and a subgrain boundary and a length L.sub.HB of a high-angle grain boundary have a relationship of L.sub.LB/(L.sub.LB+L.sub.HB)>20%.

A copper alloy has a composition including 70 mass ppm or more and 400 mass ppm or less of Mg; 5 mass ppm or more and 20 mass ppm or less of Ag; less than 3.0 mass ppm of P; and a Cu balance containing inevitable impurities. In the copper alloy, the electrical conductivity is 90% IACS or more, and a length L.sub.LB of a low-angle grain boundary and a subgrain boundary and a length L.sub.HB of a high-angle grain boundary have a relationship of L.sub.LB/(L.sub.LB+L.sub.HB)>20%.

Fuel cell alloy bipolar plates. The alloys may be used as a coating or bulk material. The alloys and metallic glasses may be particularly suitable for proton-exchange membrane fuel cells because of they may exhibit reduced weights and/or better corrosion resistance. The alloys may include any of the following Al.sub.xCu.sub.yTi.sub.z, Al.sub.xFe.sub.yNi.sub.z, Al.sub.xMn.sub.yNi.sub.z, Al.sub.xNi.sub.yTi.sub.z, Cu.sub.xFe.sub.yTi.sub.z, Cu.sub.xNi.sub.yTi.sub.z, Al.sub.xFe.sub.ySi.sub.z, Al.sub.xMn.sub.ySi.sub.z, Al.sub.xNi.sub.ySi.sub.z, Ni.sub.xSi.sub.yTi.sub.z, and C.sub.xFe.sub.ySi.sub.z. The alloys or metallic glass may be doped with various dopants to improve glass forming ability, mechanical strength, ductility, electrical or thermal conductivities, hydrophobicity, and/or corrosion resistance.

Fuel cell alloy bipolar plates. The alloys may be used as a coating or bulk material. The alloys and metallic glasses may be particularly suitable for proton-exchange membrane fuel cells because of they may exhibit reduced weights and/or better corrosion resistance. The alloys may include any of the following Al.sub.xCu.sub.yTi.sub.z, Al.sub.xFe.sub.yNi.sub.z, Al.sub.xMn.sub.yNi.sub.z, Al.sub.xNi.sub.yTi.sub.z, Cu.sub.xFe.sub.yTi.sub.z, Cu.sub.xNi.sub.yTi.sub.z, Al.sub.xFe.sub.ySi.sub.z, Al.sub.xMn.sub.ySi.sub.z, Al.sub.xNi.sub.ySi.sub.z, Ni.sub.xSi.sub.yTi.sub.z, and C.sub.xFe.sub.ySi.sub.z. The alloys or metallic glass may be doped with various dopants to improve glass forming ability, mechanical strength, ductility, electrical or thermal conductivities, hydrophobicity, and/or corrosion resistance.