Fuel cell alloy bipolar plates. The alloys may be used as a coating or bulk material. The alloys and metallic glasses may be particularly suitable for proton-exchange membrane fuel cells because of they may exhibit reduced weights and/or better corrosion resistance. The alloys may include any of the following Al.sub.xCu.sub.yTi.sub.z, Al.sub.xFe.sub.yNi.sub.z, Al.sub.xMn.sub.yNi.sub.z, Al.sub.xNi.sub.yTi.sub.z, Cu.sub.xFe.sub.yTi.sub.z, Cu.sub.xNi.sub.yTi.sub.z, Al.sub.xFe.sub.ySi.sub.z, Al.sub.xMn.sub.ySi.sub.z, Al.sub.xNi.sub.ySi.sub.z, Ni.sub.xSi.sub.yTi.sub.z, and C.sub.xFe.sub.ySi.sub.z. The alloys or metallic glass may be doped with various dopants to improve glass forming ability, mechanical strength, ductility, electrical or thermal conductivities, hydrophobicity, and/or corrosion resistance.

A pure copper sheet of the present invention has a composition including 99.96 mass % or more of Cu, 10.0 mass ppm or less of a total content of Pb, Se, and Te, 3.0 mass ppm or more of a total content of Ag and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 μm or more, an aspect ratio of the crystal grain on the rolled surface is 2.0 or less, and an average crystal grain size of the crystal grains on the rolled surface after a pressure heat treatment performed under conditions of a pressure of 0.6 MPa, a heating temperature of 850° C., and a retention time at the heating temperature of 90 minutes is 500 μm or less.

A pure copper sheet of the present invention has a composition including 99.96 mass % or more of Cu, 10.0 mass ppm or less of a total content of Pb, Se, and Te, 3.0 mass ppm or more of a total content of Ag and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 μm or more, an aspect ratio of the crystal grain on the rolled surface is 2.0 or less, and an average crystal grain size of the crystal grains on the rolled surface after a pressure heat treatment performed under conditions of a pressure of 0.6 MPa, a heating temperature of 850° C., and a retention time at the heating temperature of 90 minutes is 500 μm or less.

The present invention discloses a Nb and Al-containing titanium-copper alloy strip, characterized in that the weight percentage composition of the titanium-copper alloy strip comprises: 2.00-4.50 wt % Ti, 0.005-0.4 wt % Nb, and 0.01-0.5 wt % Al, balance being Cu and unavoidable impurities. Preferably, in the microstructure of the titanium-copper alloy strip, the number of Nb and Al-containing intermetallic compound particles with a particle size of 50-500 nm is not less than 1×10.sup.5/mm.sup.2, and the number of Nb and Al-containing intermetallic compound particles with a particle size greater than 1 μm is not more than 1×10.sup.3/mm.sup.2. Under the condition of ensuring excellent bendability, the titanium-copper alloy strip has excellent stability, especially the stability of mechanical properties at high temperatures. The present invention also relates to a method for producing the titanium-copper alloy strip.

This copper alloy for electronic or electric devices contains 100 mass ppm or greater and 400 mass ppm or less of Mg, 5 mass ppm or greater and 20 mass ppm or less of Ag, and less than 5 mass ppm of P with a balance being Cu and inevitable impurities, in which when a ratio of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to all grain boundary triple junctions is defined as NF.sub.J3 and a ratio of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary constituting the grain boundary triple junction is a random grain boundary, to all grain boundary triple junctions is defined as NF.sub.J2, an expression of 0.22<(NF.sub.J2/(1−NF.sub.J3)).sup.0.5≤0.45 is satisfied.

This copper alloy for electronic or electric devices contains 100 mass ppm or greater and 400 mass ppm or less of Mg, 5 mass ppm or greater and 20 mass ppm or less of Ag, and less than 5 mass ppm of P with a balance being Cu and inevitable impurities, in which when a ratio of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to all grain boundary triple junctions is defined as NF.sub.J3 and a ratio of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary constituting the grain boundary triple junction is a random grain boundary, to all grain boundary triple junctions is defined as NF.sub.J2, an expression of 0.22<(NF.sub.J2/(1−NF.sub.J3)).sup.0.5≤0.45 is satisfied.

A conductive supporting member includes an outer portion that includes a Cu matrix phase and a second phase dispersed in the Cu matrix phase and containing a Cu—Zr compound and that has an alloy composition represented by Cu-xZr (x is atomic % of Zr and 0.5≤x≤16.7 is satisfied) and an inner portion that is present on an inner side of the outer portion, is formed of a metal containing Cu, and has higher conductivity than the outer portion.

A conductive supporting member includes an outer portion that includes a Cu matrix phase and a second phase dispersed in the Cu matrix phase and containing a Cu—Zr compound and that has an alloy composition represented by Cu-xZr (x is atomic % of Zr and 0.5≤x≤16.7 is satisfied) and an inner portion that is present on an inner side of the outer portion, is formed of a metal containing Cu, and has higher conductivity than the outer portion.

A clad material (30) includes a first layer (31) made of stainless steel, a second layer (32) made of Cu or a Cu alloy and roll-bonded to the first layer, and a third layer (33) made of stainless steel and roll-bonded to a side of the second layer opposite to the first layer. The clad material has an overall thickness of 1 mm or less, and in a cross-sectional view along a stacking direction, a minimum thickness of the first layer in the stacking direction and a minimum thickness of the third layer in the stacking direction are 70% or more and less than 100% of an average thickness of the first layer in the stacking direction and an average thickness of the third layer in the stacking direction, respectively.

A dual phase magnetic component, along with methods of its formation, is provided. The dual phase magnetic component may include an intermixed first region and second region formed from a single material, with the first region having a magnetic area and a diffused metal therein, and with the second region having a non-magnetic area. The second region generally has greater than 0.1 weight % of nitrogen.