A thermoelectric material which minimize the content of components that degrade thermoelectric performance and thus can be usefully used in thermoelectric devices including the same.

A thermoelectric material which minimize the content of components that degrade thermoelectric performance and thus can be usefully used in thermoelectric devices including the same.

A thermoelectric material which minimize the content of components that degrade thermoelectric performance and thus can be usefully used in thermoelectric devices including the same.

A thermoelectric material which minimize the content of components that degrade thermoelectric performance and thus can be usefully used in thermoelectric devices including the same.

To provide a sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. A sliding member including an overlay formed of an alloy plating film of Bi and Sb, and the overlay is bonded to a lining formed of a copper alloy via an intermediate layer containing Ag as a main component.

To provide a sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. A sliding member including an overlay formed of an alloy plating film of Bi and Sb, and the overlay is bonded to a lining formed of a copper alloy via an intermediate layer containing Ag as a main component.

A sealing composition which can be handled in a semi-cured state and can obtain a sintered body having excellent joining strength and sealing performance is provided. A sealing composition including a solder powder, coated silver particles including silver core particles and a coating agent arranged on a surface of the silver core particles, and a solvent is provided. Further, a sintering temperature (T2) of the coated silver particles and a boiling point (T3) of the solvent satisfy T2≤T3.

A solder joint, for bonding an electrode of a circuit board to an electrode of an electronic component, that includes: an Sn—Bi-based solder deposited on the electrode of the circuit board; and a solder alloy deposited on the electrode of the electronic component. The Sn—Bi-based solder alloy has a lower melting point than the solder alloy deposited on the electrode of the electronic component. Fine Bi phases in the solder joint each have an area of less than or equal to 0.5 μm.sup.2. Coarse Bi phases in the solder joint each have an area of greater than 0.5 μm.sup.2 and less than or equal to 5 μm.sup.2. A proportion of the fine Bi phases among the fine Bi phases and the coarse Bi phases is greater than or equal to 60%.

A solder joint, for bonding an electrode of a circuit board to an electrode of an electronic component, that includes: an Sn—Bi-based solder deposited on the electrode of the circuit board; and a solder alloy deposited on the electrode of the electronic component. The Sn—Bi-based solder alloy has a lower melting point than the solder alloy deposited on the electrode of the electronic component. Fine Bi phases in the solder joint each have an area of less than or equal to 0.5 μm.sup.2. Coarse Bi phases in the solder joint each have an area of greater than 0.5 μm.sup.2 and less than or equal to 5 μm.sup.2. A proportion of the fine Bi phases among the fine Bi phases and the coarse Bi phases is greater than or equal to 60%.

A thermoelectric conversion material is a polycrystalline material composed of a plurality of crystal grains and has a composition represented by formula (I): Mg.sub.3+mSb.sub.aBi.sub.2−a−cA.sub.c. In the formula (I), A is at least one element selected from the group consisting of Se and Te, the value of m is greater than or equal to 0.01 and less than or equal to 0.5, the value of a is greater than or equal to 0 and less than or equal to 1.0, and the value of c is greater than or equal to 0.001 and less than or equal to 0.06. The thermoelectric conversion material has an Mg-rich region.