A lead-free solder alloy includes bismuth (Bi), content of which is equal to or greater than 56 wt % and equal to or less than 57.5 wt %, indium (In), content of which is equal to or greater than 0.05 wt % and equal to or less than 1.0 wt %, and the balance of tin (Sn) and another unavoidable impurity. The lead-free solder alloy of the disclosure may enable bonding with improved ductility and thermal shock reliability while not having a large melting point change compared to an Sn-58Bi alloy.

A lead-free solder alloy includes bismuth (Bi), content of which is equal to or greater than 56 wt % and equal to or less than 57.5 wt %, indium (In), content of which is equal to or greater than 0.05 wt % and equal to or less than 1.0 wt %, and the balance of tin (Sn) and another unavoidable impurity. The lead-free solder alloy of the disclosure may enable bonding with improved ductility and thermal shock reliability while not having a large melting point change compared to an Sn-58Bi alloy.

Systems and methods discussed herein relate to Zintl-type thermoelectric materials, including a p-type thermoelectric material according to the formula AM.sub.yX.sub.y, and includes at least one of calcium (Ca), europium (Eu), ytterbium (Yb), and strontium (Sr), and has a ZT of the above about 0.60 above 675K. The n-type thermoelectric component includes magnesium (Mg), tellurium (Te), antimony (Sb), and bismuth (Bi) according to the formula Mg.sub.3.2Sb.sub.1.3Bi.sub.0.5-xTe.sub.x that has an average ZT above 0.8 from 400K to 800K. The p-type and n-type materials discussed herein may be used alone, in combination with other materials, or in combination with each other in various configurations.

Systems and methods discussed herein relate to Zintl-type thermoelectric materials, including a p-type thermoelectric material according to the formula AM.sub.yX.sub.y, and includes at least one of calcium (Ca), europium (Eu), ytterbium (Yb), and strontium (Sr), and has a ZT of the above about 0.60 above 675K. The n-type thermoelectric component includes magnesium (Mg), tellurium (Te), antimony (Sb), and bismuth (Bi) according to the formula Mg.sub.3.2Sb.sub.1.3Bi.sub.0.5-xTe.sub.x that has an average ZT above 0.8 from 400K to 800K. The p-type and n-type materials discussed herein may be used alone, in combination with other materials, or in combination with each other in various configurations.

Disclosed are conductive composites comprising a polymer, a conductor selected from metals and metal alloys, and a thickening agent.

Disclosed are conductive composites comprising a polymer, a conductor selected from metals and metal alloys, and a thickening agent.

This thermoelectric conversion module is formed by electrically connecting, by a conductive member, one end of an n-type thermoelectric conversion element having a negative Seebeck coefficient and having a half-Heusler structure to one end of a p-type thermoelectric conversion element containing an oxide having a positive Seebeck coefficient at a temperature of 25° C. or higher. The conductive member is connected to the n-type thermoelectric conversion element and the p-type thermoelectric conversion element through a connection layer containing a conductive metal comprising silver, and the connection layer is characterized by further containing an oxide to reduce the bond resistance between the n-type thermoelectric conversion element and/or the p-type thermoelectric conversion element.

A wellbore is plugged using a bismuth alloy. The wellbore is arranged so that a liquid bismuth alloy sets with an excess pressure of the plug relative to the borehole fluid pressure along a desired seal height distance.

A wellbore is plugged using a bismuth alloy. The wellbore is arranged so that a liquid bismuth alloy sets with an excess pressure of the plug relative to the borehole fluid pressure along a desired seal height distance.

Identifying a stable phase of a binary alloy comprising a solute element and a solvent element. In one example, at least two thermodynamic parameters associated with grain growth and phase separation of the binary alloy are determined, and the stable phase of the binary alloy is identified based on the first thermodynamic parameter and the second thermodynamic parameter, wherein the stable phase is one of a stable nanocrystalline phase, a metastable nanocrystalline phase, and a non-nanocrystalline phase. In different aspects, an enthalpy of mixing of the binary alloy may be calculated as a first thermodynamic parameter, and an enthalpy of segregation of the binary alloy may be calculated as a second thermodynamic parameter. In another example, a diagram delineating a plurality of regions respectively representing different stable phases of at least one binary alloy is employed, wherein respective regions of the plurality of regions are delineated by at least one boundary determined as a function of at least two thermodynamic parameters associated with grain growth and phase separation of the at least one binary alloy.