Identifying a stable phase of a binary alloy comprising a solute element and a solvent element. In one example, at least two thermodynamic parameters associated with grain growth and phase separation of the binary alloy are determined, and the stable phase of the binary alloy is identified based on the first thermodynamic parameter and the second thermodynamic parameter, wherein the stable phase is one of a stable nanocrystalline phase, a metastable nanocrystalline phase, and a non-nanocrystalline phase. In different aspects, an enthalpy of mixing of the binary alloy may be calculated as a first thermodynamic parameter, and an enthalpy of segregation of the binary alloy may be calculated as a second thermodynamic parameter. In another example, a diagram delineating a plurality of regions respectively representing different stable phases of at least one binary alloy is employed, wherein respective regions of the plurality of regions are delineated by at least one boundary determined as a function of at least two thermodynamic parameters associated with grain growth and phase separation of the at least one binary alloy.

A turbomachine comprising a turbomachine shaft for rotation about an axis and for supporting a turbine wheel at one end of the turbomachine shaft; and a bearing housing having a wall defining a bore in which the turbomachine shaft is received with a substantially annular clearance, the turbomachine shaft being supported for rotation in the bore by at least one journal bearing located within the annular clearance. A surface of the turbomachine shaft which radially underlies the or each journal bearing has a surface roughness (Ra) of less than 0.15 microns and the or each journal bearing comprises a bronze alloy incorporating bismuth in an amount of up to around 6 wt %.

Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).

An n-type thermoelectric conversion material expressed in a chemical formula X.sub.3-xX′.sub.xT.sub.3-yCu.sub.ySb.sub.4 (0≦x<3, 0≦y<3.0, and x+y>0), the X includes one or more element(s) of Zr and Hf, the X′ includes one or more element(s) of Nb and Ta, and the T includes one or more element(s) selected from Ni, Pd, and Pt, while including at least Ni, the n-type thermoelectric conversion material expressed in the chemical formula X.sub.3-xX′.sub.xT.sub.3-yCu.sub.ySb.sub.4 has symmetry of a cubic crystal belonging to a space group I-43d.

An n-type thermoelectric conversion material expressed in a chemical formula X.sub.3-xX′.sub.xT.sub.3-yCu.sub.ySb.sub.4 (0≦x<3, 0≦y<3.0, and x+y>0), the X includes one or more element(s) of Zr and Hf, the X′ includes one or more element(s) of Nb and Ta, and the T includes one or more element(s) selected from Ni, Pd, and Pt, while including at least Ni, the n-type thermoelectric conversion material expressed in the chemical formula X.sub.3-xX′.sub.xT.sub.3-yCu.sub.ySb.sub.4 has symmetry of a cubic crystal belonging to a space group I-43d.

A solder paste including metal powders, constituted by an alloy powder including bismuth and silver, and a tin powder, the alloy powder including bismuth and silver including silver at a ratio of greater than or equal to 0.1 wt % and less than or equal to 11.0 wt % is provided.

A solder paste including metal powders, constituted by an alloy powder including bismuth and silver, and a tin powder, the alloy powder including bismuth and silver including silver at a ratio of greater than or equal to 0.1 wt % and less than or equal to 11.0 wt % is provided.

There is provided a connection structure of a circuit member including: a first circuit member having a first main surface provided with a first electrode; a second circuit member having a second main surface provided with a second electrode; and a joining portion which is interposed between the first main surface and the second main surface, in which the joining portion has a solder portion which electrically connects the first electrode and the second electrode to each other, in which the solder portion contains a bismuth-indium alloy, and in which an amount of bismuth contained in the bismuth-indium alloy exceeds 20% by mass and is equal to or less than 80% by mass.

There is provided a connection structure of a circuit member including: a first circuit member having a first main surface provided with a first electrode; a second circuit member having a second main surface provided with a second electrode; and a joining portion which is interposed between the first main surface and the second main surface, in which the joining portion has a solder portion which electrically connects the first electrode and the second electrode to each other, in which the solder portion contains a bismuth-indium alloy, and in which an amount of bismuth contained in the bismuth-indium alloy exceeds 20% by mass and is equal to or less than 80% by mass.

There is provided a conductive particle including a core particle containing a resin material, and a surface layer that covers a surface of the core particle and contains a solder material, in which a melting point of the solder material is equal to or lower than a softening point of the resin material.