The present invention relates to a method for producing a component of a γ-TiAl alloy, in which, in a first step, a forging blank made of a γ-TiAl alloy is built up from a powder material by an additive method, and subsequently, in a second step, the forging blank is reshaped into a semi-finished product, wherein the degree of reshaping over the entire forging blank is high enough that, in a third step, the structure is recrystallized during a heat treatment. In addition, the invention relates to a component produced therefrom.

The present invention relates to a method for producing a component of a γ-TiAl alloy, in which, in a first step, a forging blank made of a γ-TiAl alloy is built up from a powder material by an additive method, and subsequently, in a second step, the forging blank is reshaped into a semi-finished product, wherein the degree of reshaping over the entire forging blank is high enough that, in a third step, the structure is recrystallized during a heat treatment. In addition, the invention relates to a component produced therefrom.

A TiAl alloy member for hot forging includes a substrate made of TiAl alloy, and an Al layer formed on a surface of the substrate, the Al layer containing Al as a main constituent and containing Ti.

A TiAl alloy member for hot forging includes a substrate made of TiAl alloy, and an Al layer formed on a surface of the substrate, the Al layer containing Al as a main constituent and containing Ti.

Embodiments disclosed herein include semiconductor devices and methods of forming such semiconductor devices. In an embodiment, a semiconductor device comprises a semiconductor channel, a source region adjacent to the semiconductor channel, and a drain region adjacent to the semiconductor channel. In an embodiment, the source region and the drain region each comprise a trench, a conformal silicide lining the trench, and a binary metallic alloy filling the trench.

Embodiments disclosed herein include semiconductor devices and methods of forming such semiconductor devices. In an embodiment, a semiconductor device comprises a semiconductor channel, a source region adjacent to the semiconductor channel, and a drain region adjacent to the semiconductor channel. In an embodiment, the source region and the drain region each comprise a trench, a conformal silicide lining the trench, and a binary metallic alloy filling the trench.

Fuel cell alloy bipolar plates. The alloys may be used as a coating or bulk material. The alloys and metallic glasses may be particularly suitable for proton-exchange membrane fuel cells because of they may exhibit reduced weights and/or better corrosion resistance. The alloys may include any of the following Al.sub.xCu.sub.yTi.sub.z, Al.sub.xFe.sub.yNi.sub.z, Al.sub.xMn.sub.yNi.sub.z, Al.sub.xNi.sub.yTi.sub.z, Cu.sub.xFe.sub.yTi.sub.z, Cu.sub.xNi.sub.yTi.sub.z, Al.sub.xFe.sub.ySi.sub.z, Al.sub.xMn.sub.ySi.sub.z, Al.sub.xNi.sub.ySi.sub.z, Ni.sub.xSi.sub.yTi.sub.z, and C.sub.xFe.sub.ySi.sub.z. The alloys or metallic glass may be doped with various dopants to improve glass forming ability, mechanical strength, ductility, electrical or thermal conductivities, hydrophobicity, and/or corrosion resistance.

Fuel cell alloy bipolar plates. The alloys may be used as a coating or bulk material. The alloys and metallic glasses may be particularly suitable for proton-exchange membrane fuel cells because of they may exhibit reduced weights and/or better corrosion resistance. The alloys may include any of the following Al.sub.xCu.sub.yTi.sub.z, Al.sub.xFe.sub.yNi.sub.z, Al.sub.xMn.sub.yNi.sub.z, Al.sub.xNi.sub.yTi.sub.z, Cu.sub.xFe.sub.yTi.sub.z, Cu.sub.xNi.sub.yTi.sub.z, Al.sub.xFe.sub.ySi.sub.z, Al.sub.xMn.sub.ySi.sub.z, Al.sub.xNi.sub.ySi.sub.z, Ni.sub.xSi.sub.yTi.sub.z, and C.sub.xFe.sub.ySi.sub.z. The alloys or metallic glass may be doped with various dopants to improve glass forming ability, mechanical strength, ductility, electrical or thermal conductivities, hydrophobicity, and/or corrosion resistance.

Disclosed is a high corrosion-resistance strip steel, comprising a carbon steel base layer and a corrosion-resistance cladding layer roll-bonded with the carbon steel base layer, the corrosion-resistance cladding layer being austenitic stainless steel or pure titanium, the thickness of the corrosion-resistance cladding layer being 0.5% to 5% of the total thickness of the strip steel. In addition, further disclosed is a manufacturing method for the described high corrosion-resistance strip steel, comprising the steps of: (1) obtaining a base layer material and a cladding layer material; (2) assembling billets (3) pre-heating: pre-heating the billets at a temperature of 1150° C. to 1250° C., so that elements of the corrosion-resistance cladding layer and elements of the carbon steel base layer diffuse at the interface to form a stable transition layer, and then slowly cooling to room temperature; (4) secondary heating and rolling; and (5) water-cooling and then winding. The high corrosion-resistance strip steel finally provides, by means of rational component design, thickness design, and process design, the obtained steel plate or steel strip with a high corrosion-resistance surface and good interlayer bonding performance, and the steel plate or steel strip has good mechanical properties and processability.

Provided is a method for producing a Ni- or Ti-based alloy product, the method capable of locally increasing the cooling rate and effectively cooling. The method includes the steps: preliminarily processing a hot working material of a Ni- or Ti-based alloy after hot working into a predetermined shape; heating and holding the material at a solution treatment temperature to obtain a material held in a heated state; and cooling the material held in a heated state to obtain a solution-treated material. The cooling step includes placing a flow path-forming member having a space for forming a flow path for a fluid on a surface of the material held in a heated state to form a fluid flow path defined by the surface of the material held in a heated state and an inner surface of the space of the flow path-forming member; and allowing a fluid to flow in the fluid flow path so that the fluid in the flow path locally cools a part of the surface of the material held in a heated state.