An alloy represented by the formula (Mn.sub.xAl.sub.y)C.sub.z, the alloy being aluminum (Al), manganese (Mn), and carbon (C), and optionally unavoidable impurities; wherein x=56.0 to 59.0 y=41.0 to 44.0 x+y=100, and z=1.5 to 2.4. The alloy is highly suitable for forming the and phase in high purity and high microstructural homogeneity. A method for processing an alloy of formula (Mn.sub.xAl.sub.y)C.sub.z, wherein x=52.0 to 59.0, y=41.0 to 48.0, x+y=100, and z=0.1 to 3.0, the process including providing the raw materials of the alloy, melting the raw materials, and forming particles of the alloy by gas atomization of the molten alloy.

A device including a near field transducer, the near field transducer including gold (Au), silver (Ag), copper (Cu), or aluminum (Al), and at least two other secondary atoms, the at least two other secondary atoms selected from: boron (B), bismuth (Bi), indium (In), sulfur (S), silicon (Si), tin (Sn), manganese (Mn), tellurium (Te), holmium (Ho), lutetium (Lu), praseodymium (Pr), scandium (Sc), uranium (U), barium (Ba), chlorine (Cl), cesium (Cs), dysprosium (Dy), europium (Eu), fluorine (F), germanium (Ge), hydrogen (H), iodine (I), rubidium (Rb), selenium (Se), terbium (Tb), nitrogen (N), oxygen (O), carbon (C), antimony (Sb), gadolinium (Gd), samarium (Sm), thallium (Tl), cadmium (Cd), neodymium (Nd), phosphorus (P), lead (Pb), hafnium (Hf), niobium (Nb), erbium (Er), zinc (Zn), magnesium (Mg), palladium (Pd), vanadium (V), zinc (Zn), chromium (Cr), iron (Fe), lithium (Li), nickel (Ni), platinum (Pt), sodium (Na), strontium (Sr), calcium (Ca), yttrium (Y), thorium (Th), beryllium (Be), thulium (Tm), erbium (Er), ytterbium (Yb), promethium (Pm), neodymium (Nd cobalt (Co), cerium (Ce), lanthanum (La), praseodymium (Pr), or combinations thereof.

A device including a near field transducer, the near field transducer including gold (Au), silver (Ag), copper (Cu), or aluminum (Al), and at least two other secondary atoms, the at least two other secondary atoms selected from: boron (B), bismuth (Bi), indium (In), sulfur (S), silicon (Si), tin (Sn), manganese (Mn), tellurium (Te), holmium (Ho), lutetium (Lu), praseodymium (Pr), scandium (Sc), uranium (U), barium (Ba), chlorine (Cl), cesium (Cs), dysprosium (Dy), europium (Eu), fluorine (F), germanium (Ge), hydrogen (H), iodine (I), rubidium (Rb), selenium (Se), terbium (Tb), nitrogen (N), oxygen (O), carbon (C), antimony (Sb), gadolinium (Gd), samarium (Sm), thallium (Tl), cadmium (Cd), neodymium (Nd), phosphorus (P), lead (Pb), hafnium (Hf), niobium (Nb), erbium (Er), zinc (Zn), magnesium (Mg), palladium (Pd), vanadium (V), zinc (Zn), chromium (Cr), iron (Fe), lithium (Li), nickel (Ni), platinum (Pt), sodium (Na), strontium (Sr), calcium (Ca), yttrium (Y), thorium (Th), beryllium (Be), thulium (Tm), erbium (Er), ytterbium (Yb), promethium (Pm), neodymium (Nd cobalt (Co), cerium (Ce), lanthanum (La), praseodymium (Pr), or combinations thereof.

Methods of producing high purity powders of submicron particles of metal oxides are presented. The methods comprise providing or forming an alloy of a first metal with a second metal, optionally heating the alloy, subjecting the alloy to a leaching agent to remove the second metal from the alloy and to oxidize the first metal, thus forming submicron oxide particles of the first metal. Collections of high purity, high surface area, submicron particles are presented as well.

Methods of producing high purity powders of submicron particles of metal oxides are presented. The methods comprise providing or forming an alloy of a first metal with a second metal, optionally heating the alloy, subjecting the alloy to a leaching agent to remove the second metal from the alloy and to oxidize the first metal, thus forming submicron oxide particles of the first metal. Collections of high purity, high surface area, submicron particles are presented as well.

The present disclosure relates to a copper based microcrystalline alloy and a preparation method thereof, and an electronic product. In percentage by weight and based on the total amount of the copper based microcrystalline alloy, the copper based microcrystalline alloy includes: 30-60 wt % of Cu; 25-40 wt % of Mn; 4-6 wt % of Al; 10-17 wt % of Ni; 0.01-10 wt % of Si; and 0.001-0.03% of Be.

Adhesion of a metal surfaces (e.g. titanium and titanium alloys) to an epoxy resin is improved by creating a sol-gel layer at the metal/epoxy resin surface, with the sol-gel comprising a mixture of organometallic compounds to react with or bond to both the metal surfaces and an interfacing epoxy resin.

The present disclosure is directed to flux-cored welding electrodes designed to produce higher toughness steel alloy weld deposits, and to the higher toughness weld deposits themselves. The weld deposits may comprise less than 0.20 (or less than 0.15) weight percent silicon. The flux-cored welding electrodes comprise a flux core and a tubular steel strip. The flux core may comprise, by weight percent of the electrode, 0.25-0.30% zirconium, 0.12-0.18% aluminum, and 0-0.11% silicon. The metallic zirconium, aluminum, and silicon may be added to the flux core in the form of silicon-zirconium metal powder and aluminum-zirconium metal powder.

The present disclosure is directed to flux-cored welding electrodes designed to produce higher toughness steel alloy weld deposits, and to the higher toughness weld deposits themselves. The weld deposits may comprise less than 0.20 (or less than 0.15) weight percent silicon. The flux-cored welding electrodes comprise a flux core and a tubular steel strip. The flux core may comprise, by weight percent of the electrode, 0.25-0.30% zirconium, 0.12-0.18% aluminum, and 0-0.11% silicon. The metallic zirconium, aluminum, and silicon may be added to the flux core in the form of silicon-zirconium metal powder and aluminum-zirconium metal powder.

A manganese carbide (Mn.sub.4C) magnetic material and a production method therefor are provided. According to one embodiment, the saturation magnetization of the Mn.sub.4C magnetic material increases with increasing temperature, and thus the Mn.sub.4C magnetic material is applicable to fields in which thermally induced magnetization reduction is critical.