Patent classifications
C22C24/00
Lithium metal patterning and electrochemical device using the same
A lithium metal is physically pressed to a silicon wafer having a uniform intaglio or embossed pattern formed thereon in advance, or liquid lithium is applied to the silicon wafer and may then be cooled in order to form a uniform pattern on the surface of the lithium metal.
Lithium metal patterning and electrochemical device using the same
A lithium metal is physically pressed to a silicon wafer having a uniform intaglio or embossed pattern formed thereon in advance, or liquid lithium is applied to the silicon wafer and may then be cooled in order to form a uniform pattern on the surface of the lithium metal.
High temperature thermochemical energy storage materials
Disclosed are high enthalpy thermochemical energy storage materials that exhibit high thermal conductivity and stability at high temperature reaction conditions. Disclosed materials include hydride-based alloys that can undergo high temperature reversible hydrogenation/dehydrogenation reactions without phase change of any metal or metalloid components of the alloy. The materials undergo a reversible exothermic hydrogenation reaction to form a metal hydride and a ternary alloy that includes a high thermal conductivity metal that, in its pure state, would exhibit a phase change at the hydrogenation reaction conditions.
High temperature thermochemical energy storage materials
Disclosed are high enthalpy thermochemical energy storage materials that exhibit high thermal conductivity and stability at high temperature reaction conditions. Disclosed materials include hydride-based alloys that can undergo high temperature reversible hydrogenation/dehydrogenation reactions without phase change of any metal or metalloid components of the alloy. The materials undergo a reversible exothermic hydrogenation reaction to form a metal hydride and a ternary alloy that includes a high thermal conductivity metal that, in its pure state, would exhibit a phase change at the hydrogenation reaction conditions.
Process for producing bonded body and process for producing power module substrate
Disclosed is provided a process for producing a bonded body by bonding a ceramic member made of a ceramic to a Cu member made of Cu or a Cu alloy, the process including: a laminating step of laminating the Cu member on a first surface side of the ceramic member via a brazing material containing Cu and a eutectic element which has a eutectic reaction with Cu, and via an active metal; and a heating step of heating the ceramic member and the Cu member which are laminated together.
Li—Si—Sn alloy, anode material of the alloy, and batteries including same
An alloy includes lithium, silicon and tin. An anode may be formed of an anode material containing the alloy of lithium, silicon and tin. The anode material may include an electrolyte. The anode material may be a pressed powder pellet that is solid at ambient temperature. A battery, for example, a thermal battery, can contain an electrolyte-separator, a cathode, and/or an anode with the alloy of lithium, tin and silicon. The anode formed of the alloy consisting of lithium, tin and silicon can have a melting point from about 500 C. to about 600 C. or higher making it suitable for use in a thermal battery.
Li—Si—Sn alloy, anode material of the alloy, and batteries including same
An alloy includes lithium, silicon and tin. An anode may be formed of an anode material containing the alloy of lithium, silicon and tin. The anode material may include an electrolyte. The anode material may be a pressed powder pellet that is solid at ambient temperature. A battery, for example, a thermal battery, can contain an electrolyte-separator, a cathode, and/or an anode with the alloy of lithium, tin and silicon. The anode formed of the alloy consisting of lithium, tin and silicon can have a melting point from about 500 C. to about 600 C. or higher making it suitable for use in a thermal battery.
Cu—Ga—In—Na target
A sputtering target is composed of an alloy consisting of 5 to 70 at % of at least one element from the group of (Ga, In) and 0.1 to 15 at % of Na, the remainder being Cu and typical impurities. The sputtering target includes at least one intermetallic Na-containing phase.
Cu—Ga—In—Na target
A sputtering target is composed of an alloy consisting of 5 to 70 at % of at least one element from the group of (Ga, In) and 0.1 to 15 at % of Na, the remainder being Cu and typical impurities. The sputtering target includes at least one intermetallic Na-containing phase.
LITHIUM METAL PATTERNING AND ELECTROCHEMICAL DEVICE USING THE SAME
A lithium metal is physically pressed to a silicon wafer having a uniform intaglio or embossed pattern formed thereon in advance, or liquid lithium is applied to the silicon wafer and may then be cooled in order to form a uniform pattern on the surface of the lithium metal.