Patent classifications
C22C26/00
Methods of making a polycrystalline diamond structure
Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.
Method of forming polycrystalline compacts including metallic alloy compositions in interstitial spaces between grains of hard material
Polycrystalline compacts include a polycrystalline material comprising a plurality of inter-bonded grains of hard material, and a metallic material disposed in interstitial spaces between the inter-bonded grains of hard material. At least a portion of the metallic material comprises a metal alloy that includes two or more elements. A first element of the two or more elements comprises at least one of cobalt, iron, and nickel. A second element of the two or more elements comprises at least one of dysprosium, yttrium, terbium, gadolinium, germanium, samarium, neodymium, and praseodymium. The metal alloys may comprise eutectic or near-eutectic compositions, and may have relatively low melting points. Cutting elements and earth-boring tools include such polycrystalline compacts. Methods include the formation of such polycrystalline compacts, cutting elements, and earth-boring tools.
Method of forming polycrystalline compacts including metallic alloy compositions in interstitial spaces between grains of hard material
Polycrystalline compacts include a polycrystalline material comprising a plurality of inter-bonded grains of hard material, and a metallic material disposed in interstitial spaces between the inter-bonded grains of hard material. At least a portion of the metallic material comprises a metal alloy that includes two or more elements. A first element of the two or more elements comprises at least one of cobalt, iron, and nickel. A second element of the two or more elements comprises at least one of dysprosium, yttrium, terbium, gadolinium, germanium, samarium, neodymium, and praseodymium. The metal alloys may comprise eutectic or near-eutectic compositions, and may have relatively low melting points. Cutting elements and earth-boring tools include such polycrystalline compacts. Methods include the formation of such polycrystalline compacts, cutting elements, and earth-boring tools.
Thick sintered polycrystalline diamond and sintered jewelry
Methods of forming larger sintered compacts of PCD and other sintered ultrahard materials are disclosed. Improved solvent metal compositions and layering of the un-sintered construct allow for sintering of thicker and larger high quality sintered compacts. Jewelry may also be made from sintered ultrahard materials including diamond, carbides, and boron nitrides. Increased biocompatibility is achieved through use of a sintering metal containing tin. Methods of sintering perform shapes are provided.
Thick sintered polycrystalline diamond and sintered jewelry
Methods of forming larger sintered compacts of PCD and other sintered ultrahard materials are disclosed. Improved solvent metal compositions and layering of the un-sintered construct allow for sintering of thicker and larger high quality sintered compacts. Jewelry may also be made from sintered ultrahard materials including diamond, carbides, and boron nitrides. Increased biocompatibility is achieved through use of a sintering metal containing tin. Methods of sintering perform shapes are provided.
Composite member
A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coating layer includes a metal coating portion, and a grain coating portion. A ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80. The coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm.
Composite member
A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coating layer includes a metal coating portion, and a grain coating portion. A ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80. The coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm.
Composite member
A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coating layer includes a metal coating portion, and a grain coating portion. A ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80. The coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm.
Coating on PDC/TSP cutter for accelerated leaching
A cutting element includes a polycrystalline diamond layer having a cutting face and a diamond layer side surface, a substrate attached to the polycrystalline diamond layer, the substrate having a bottom surface and a substrate side surface, an interface between the diamond layer and the substrate, and a mask covering at least the bottom surface and the substrate side surface of the cutting element.
Coating on PDC/TSP cutter for accelerated leaching
A cutting element includes a polycrystalline diamond layer having a cutting face and a diamond layer side surface, a substrate attached to the polycrystalline diamond layer, the substrate having a bottom surface and a substrate side surface, an interface between the diamond layer and the substrate, and a mask covering at least the bottom surface and the substrate side surface of the cutting element.