Patent classifications
C22C28/00
High Entropy Alloy Having Composite Microstructure and Method of Manufacturing the Same
A metallic alloy, more particularly, a high-entropy alloy with a composite structure exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.
R-T-B based permanent magnet
The present invention provides an R-T-B based permanent magnet having excellent magnetic properties and corrosion resistance even when Co content is small. The R-T-B based permanent magnet in which R is a rare earth element including one or more selected from Nd and Pr and one or more selected from Dy and Tb, T is a combination of Fe and Co, and B is boron. The R-T-B based permanent magnet further includes Zr. A total content of Nd, Pr, Dy, and Tb is 30.00 mass % to 32.20 mass %, Co content is 0.30 mass % to 1.30 mass %, Zr content is 0.21 mass % to 0.85 mass %, and B content is 0.90 mass % to 1.02 mass % with respect to 100 mass % of the R-T-B based permanent magnet.
R-T-B based permanent magnet
The present invention provides an R-T-B based permanent magnet having excellent magnetic properties and corrosion resistance even when Co content is small. The R-T-B based permanent magnet in which R is a rare earth element including one or more selected from Nd and Pr and one or more selected from Dy and Tb, T is a combination of Fe and Co, and B is boron. The R-T-B based permanent magnet further includes Zr. A total content of Nd, Pr, Dy, and Tb is 30.00 mass % to 32.20 mass %, Co content is 0.30 mass % to 1.30 mass %, Zr content is 0.21 mass % to 0.85 mass %, and B content is 0.90 mass % to 1.02 mass % with respect to 100 mass % of the R-T-B based permanent magnet.
METHOD OF MANUFACTURING ALUMINUM ALLOY ARTICLES
A method for making an article is disclosed. The method involves inputting a digital model of an article into an additive manufacturing apparatus comprising an energy source. The additive manufacturing apparatus applies energy from the energy source to successively applied incremental quantities of a powder to fuse the powder to form the article corresponding to the digital model. The powder includes an aluminum alloy having 2.00-10.00 wt. % cerium, 0.50-2.50 wt. % titanium, 0-3.00 wt. % nickel, 0-0.75 wt. % nitrogen, 0-0.05 wt. % other alloying elements, and the balance of aluminum, based on the total weight of the aluminum alloy.
METHOD OF MANUFACTURING ALUMINUM ALLOY ARTICLES
A method for making an article is disclosed. The method involves inputting a digital model of an article into an additive manufacturing apparatus comprising an energy source. The additive manufacturing apparatus applies energy from the energy source to successively applied incremental quantities of a powder to fuse the powder to form the article corresponding to the digital model. The powder includes an aluminum alloy having 2.00-10.00 wt. % cerium, 0.50-2.50 wt. % titanium, 0-3.00 wt. % nickel, 0-0.75 wt. % nitrogen, 0-0.05 wt. % other alloying elements, and the balance of aluminum, based on the total weight of the aluminum alloy.
ALUMINUM ALLOY ARTICLES
An aluminum alloy comprising greater than 2.00 and less than 4.00 wt. % cerium, 0.25-3.00 wt. % silicon, 0.25-0.75 wt. % magnesium, 0-0.75 wt. % iron, 0-0.05 wt. % other alloying elements, and the balance of aluminum, based on the total weight of the aluminum alloy aluminum alloy.
ALUMINUM ALLOY ARTICLES
An aluminum alloy comprising greater than 2.00 and less than 4.00 wt. % cerium, 0.25-3.00 wt. % silicon, 0.25-0.75 wt. % magnesium, 0-0.75 wt. % iron, 0-0.05 wt. % other alloying elements, and the balance of aluminum, based on the total weight of the aluminum alloy aluminum alloy.
Cu-Ga SPUTTERING TARGET AND PRODUCTION METHOD FOR Cu-Ga SPUTTERING TARGET
A Cu—Ga sputtering target made of a composition containing: as metal components excluding fluorine, 5 atomic % or more and 60 atomic % or less of Ga and 0.01 atomic % or more and 5 atomic % or less of K; and the Cu balance containing inevitable impurities is provided. In the Cu—Ga sputtering target, the Cu—Ga sputtering target has a region containing Cu, Ga, K, and F, in an atomic mapping image by a wavelength separation X-ray detector.
Cu-Ga SPUTTERING TARGET AND PRODUCTION METHOD FOR Cu-Ga SPUTTERING TARGET
A Cu—Ga sputtering target made of a composition containing: as metal components excluding fluorine, 5 atomic % or more and 60 atomic % or less of Ga and 0.01 atomic % or more and 5 atomic % or less of K; and the Cu balance containing inevitable impurities is provided. In the Cu—Ga sputtering target, the Cu—Ga sputtering target has a region containing Cu, Ga, K, and F, in an atomic mapping image by a wavelength separation X-ray detector.
Method of Producing Sintered Magnet
A method of producing a sintered magnet is disclosed herein. In some embodiments, a method of producing a sintered magnet comprises, sintering a R—Fe—B based magnetic powder to produce a sintered magnet; wherein the R is Nd, Pr, Dy, Ce or Tb, and infiltrating a eutectic alloy into the sintered magnet, wherein the eutectic alloy contains Pr, Al, Cu and Ga, and wherein infiltration the eutectic alloy includes applying the eutectic alloy to the sintered magnet and heat-treating the sintered magnet to which the eutectic alloy is applied.