Methods of synthesizing colloidal ternary Group III-V nanocrystals are provided. Also provided are the colloidal ternary Group III-V nanocrystals made using the methods. In the methods, molten inorganic salts are used as high temperature solvents to carry out cation exchange reactions that convert binary nanocrystals into ternary nanocrystals.

Solder pastes comprise a high temperature solder powder, a low temperature solder powder and flux. The melting temperature of the low temperature solder powder is lower than that of the high temperature solder powder. The high temperature solder powder and the low temperature solder powder are both capable of wetting upon heating.

Solder pastes comprise a high temperature solder powder, a low temperature solder powder and flux. The melting temperature of the low temperature solder powder is lower than that of the high temperature solder powder. The high temperature solder powder and the low temperature solder powder are both capable of wetting upon heating.

A device and method of thixotropic mixing and 3D printing of alloys is provided. The method includes the steps of locating a thixotropic mixer having a discharge nozzle above a substrate; adding a molten alloy to the mixer; locating the nozzle between about 1 mm and about 20 mm from the substrate; and extruding the alloy from the nozzle onto the substrate.

A device and method of thixotropic mixing and 3D printing of alloys is provided. The method includes the steps of locating a thixotropic mixer having a discharge nozzle above a substrate; adding a molten alloy to the mixer; locating the nozzle between about 1 mm and about 20 mm from the substrate; and extruding the alloy from the nozzle onto the substrate.

A deformable yet mechanically resilient microcapsule having electrical properties, a method of making the microcapsules, and a circuit component including the microcapsules. The microcapsule containing a gallium liquid metal alloy core having from about 60 to about 100 wt. % gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties.

A deformable yet mechanically resilient microcapsule having electrical properties, a method of making the microcapsules, and a circuit component including the microcapsules. The microcapsule containing a gallium liquid metal alloy core having from about 60 to about 100 wt. % gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties.

The present invention relates to an RFeB sintered magnet containing: 28% to 33% by mass of a rare-earth element R, 0% to 2.5% by mass of Co (cobalt) (i.e., Co may not be contained), 0.3% to 0.7% by mass of Al (aluminum), 0.9% to 1.2% by mass of B (Boron), and less than 1,500 ppm of O (oxygen), with the balance being Fe, containing an RFeAl phase having an R.sub.6Fe.sub.14-xAl.sub.x structure in a crystal grain boundary, and having a coercivity of 16 kOe or more.

The present invention relates to an RFeB sintered magnet containing: 28% to 33% by mass of a rare-earth element R, 0% to 2.5% by mass of Co (cobalt) (i.e., Co may not be contained), 0.3% to 0.7% by mass of Al (aluminum), 0.9% to 1.2% by mass of B (Boron), and less than 1,500 ppm of O (oxygen), with the balance being Fe, containing an RFeAl phase having an R.sub.6Fe.sub.14-xAl.sub.x structure in a crystal grain boundary, and having a coercivity of 16 kOe or more.

The method of producing composite material with a high complex of mechanical properties, consisting of vanadium alloy inner layer V—3-11 wt % Ti—3-6 wt % Cr and two outer layers of stainless steel of ferritic grade with chromium content of not less than 13 wt %, includes preparation of a composite workpiece consisting of said inner layer and outer layers, hot treatment by pressure and subsequent exposure in furnace. Prepared composite workpiece, thickness of inner layer of which is 1.5-2 times more than total thickness of outer layers of stainless steel, hot working is performed with pressure of the workpiece in the temperature range of 1,050-1,150° C. with degree of reduction from 30 to 40% and with subsequent exposure for 1-3 hours with temperature reduction to 500-700° C., then annealing workpiece by heating to temperature of 850-950° C., holding for 2-4 hours and subsequent cooling in furnace.