Some implementations of the disclosure are directed to liquid metal composites that can be used as thermal interface materials. In one implementation, a liquid metal composite configured to be applied as a thermal interface material between electronic components, includes: 90 wt % to 99.9 wt % of a liquid metal or liquid metal alloy; and 0.1 wt % to 10 wt % of at least one organic additive comprising an organic compound to prevent oxidation of the liquid metal or liquid metal alloy during application of the liquid metal composite on a surface of an electronic component.

Some implementations of the disclosure are directed to liquid metal composites that can be used as thermal interface materials. In one implementation, a liquid metal composite configured to be applied as a thermal interface material between electronic components, includes: 90 wt % to 99.9 wt % of a liquid metal or liquid metal alloy; and 0.1 wt % to 10 wt % of at least one organic additive comprising an organic compound to prevent oxidation of the liquid metal or liquid metal alloy during application of the liquid metal composite on a surface of an electronic component.

Identifying a stable phase of a binary alloy comprising a solute element and a solvent element. In one example, at least two thermodynamic parameters associated with grain growth and phase separation of the binary alloy are determined, and the stable phase of the binary alloy is identified based on the first thermodynamic parameter and the second thermodynamic parameter, wherein the stable phase is one of a stable nanocrystalline phase, a metastable nanocrystalline phase, and a non-nanocrystalline phase. In different aspects, an enthalpy of mixing of the binary alloy may be calculated as a first thermodynamic parameter, and an enthalpy of segregation of the binary alloy may be calculated as a second thermodynamic parameter. In another example, a diagram delineating a plurality of regions respectively representing different stable phases of at least one binary alloy is employed, wherein respective regions of the plurality of regions are delineated by at least one boundary determined as a function of at least two thermodynamic parameters associated with grain growth and phase separation of the at least one binary alloy.

Identifying a stable phase of a binary alloy comprising a solute element and a solvent element. In one example, at least two thermodynamic parameters associated with grain growth and phase separation of the binary alloy are determined, and the stable phase of the binary alloy is identified based on the first thermodynamic parameter and the second thermodynamic parameter, wherein the stable phase is one of a stable nanocrystalline phase, a metastable nanocrystalline phase, and a non-nanocrystalline phase. In different aspects, an enthalpy of mixing of the binary alloy may be calculated as a first thermodynamic parameter, and an enthalpy of segregation of the binary alloy may be calculated as a second thermodynamic parameter. In another example, a diagram delineating a plurality of regions respectively representing different stable phases of at least one binary alloy is employed, wherein respective regions of the plurality of regions are delineated by at least one boundary determined as a function of at least two thermodynamic parameters associated with grain growth and phase separation of the at least one binary alloy.

The invention relates to a method for producing precise components, preferably machining tools or cold forming tools, cold extrusion punches and dies, by laser melting or laser sintering or laser deposit welding or FDM or binder jetting of a powder material, which consists of a mixture of at least two powder elements, the powder mixture being formed by the primary component iron powder and additional powder alloying elements, which are present in elemental, pre-alloyed or partially pre-alloyed form, the powder elements each being added separately or in arbitrary combination in the following quantities according to the standard DIN EN 10027-2 no. 1.33XX or DIN EN 10027-2 no. 1.27XX, in particular according to the standard DIN EN 10027-2 no. 1.3343 with the short name HS6-5-2C or DIN EN 10027-2 no. 1.2709, a powder alloy being created from said powder elements over the course of the laser sintering process, wherein the following powder elements, present in elemental, alloyed or pre-alloyed form, are each additionally added to the alloy separately or in arbitrary combination: tungsten in the range of between 35, 10 and 0.7 mass%, preferably 10 mass%, titanium in the range of between 0.2, 3.2 to 10.7 mass%, preferably 3.2 mass%, carbon in the range of between 0.08, 1.23 up to 4.1 mass%, preferably 1.23 mass%, O in the range of between 0.00 up to 0.02 mass%, N in the range of between 0.00 up to 0.02 mass%, undefined residual substances at less than 0.1 mass%.

An Al—Sc alloy sputtering target. The target comprising from 1.0 at % to 65 at % scandium and from 35 at % to 99 at % aluminum and having a microstructure including a first aluminum matrix phase and a second phase dispersed uniformly therethrough. The second phase comprises one or more compounds corresponding to the formula Sc.sub.xAl.sub.y, where x is from 1 to 2 and y is from 0 to 3.

Indium-tin-silver alloys suitable for use as a lead free solder are described herein. The alloys may comprise primarily indium or comprise primarily tin. The alloys may further include copper, nickel, and iron or copper, antimony, and zinc. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component. Methods of forming the alloys are also described herein.

Indium-tin-silver alloys suitable for use as a lead free solder are described herein. The alloys may comprise primarily indium or comprise primarily tin. The alloys may further include copper, nickel, and iron or copper, antimony, and zinc. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component. Methods of forming the alloys are also described herein.

Undercooled liquid metallic core-shell particles, whose core is stable against solidification at ambient conditions, i.e. under near ambient temperature and pressure conditions, are used to join or repair metallic non-particulate components. The undercooled-shell particles in the form of nano-size or micro-size particles comprise an undercooled stable liquid metallic core encapsulated inside an outer shell, which can comprise an oxide or other stabilizer shell typically formed in-situ on the undercooled liquid metallic core. The shell is ruptured to release the liquid phase core material to join or repair a component(s).

Undercooled liquid metallic core-shell particles, whose core is stable against solidification at ambient conditions, i.e. under near ambient temperature and pressure conditions, are used to join or repair metallic non-particulate components. The undercooled-shell particles in the form of nano-size or micro-size particles comprise an undercooled stable liquid metallic core encapsulated inside an outer shell, which can comprise an oxide or other stabilizer shell typically formed in-situ on the undercooled liquid metallic core. The shell is ruptured to release the liquid phase core material to join or repair a component(s).