There is provided a conductive particle including a core particle containing a resin material, and a surface layer that covers a surface of the core particle and contains a solder material, in which a melting point of the solder material is equal to or lower than a softening point of the resin material.

There is provided a conductive particle including a core particle containing a resin material, and a surface layer that covers a surface of the core particle and contains a solder material, in which a melting point of the solder material is equal to or lower than a softening point of the resin material.

A lead-free solder contains 93.0 mass % or more and 98.95 mass % or less of indium, 1.0 mass % or more and 4.0 mass % or less of tin, and an addition metal. The addition metal contains at least one of silver, antimony, copper, or nickel. The addition metal is neither indium nor tin. The total of mass percentage of the addition metal is 0.05 mass % or more and 6.0 mass % or less. The sum of the total mass percentage of the addition metal, the mass percentage of indium, and the mass percentage of tin is 100 mass % or less.

A lead-free solder contains 93.0 mass % or more and 98.95 mass % or less of indium, 1.0 mass % or more and 4.0 mass % or less of tin, and an addition metal. The addition metal contains at least one of silver, antimony, copper, or nickel. The addition metal is neither indium nor tin. The total of mass percentage of the addition metal is 0.05 mass % or more and 6.0 mass % or less. The sum of the total mass percentage of the addition metal, the mass percentage of indium, and the mass percentage of tin is 100 mass % or less.

An aluminum alloy material is provided. The aluminum alloy material has excellent bonding durability and is not susceptible to decrease in the bonding strength even if exposed to a high-temperature humid environment. A bonded body, a member for automobiles, and a method for producing the aluminum alloy material are also provided. In the method for producing the aluminum alloy material, the etching amount is controlled to be less than 700 nm when a first film composed of an oxide film is formed on the surface of an aluminum alloy base; and after the formation of the first film by a treatment using an aqueous solution containing a silicate salt, which is the final stage of the substantial film formation, a second film having a siloxane bond is formed by performing a silane coupling treatment.

A step of, while an RLM alloy powder (where RL is Nd and/or Pr; M is one or more elements selected from among Cu, Fe, Ga, Co, Ni and Al) and an RH oxide powder (where RH is Dy and/or Tb) are present on the surface of a sintered R-T-B based magnet, performing a heat treatment at a sintering temperature of the sintered R-T-B based magnet or lower is included. The RLM alloy contains RL in an amount of 50 at % or more, and the melting point of the RLM alloy is equal to or less than the temperature of the heat treatment. The heat treatment is performed while the RLM alloy powder and the RH oxide powder are present on the surface of the sintered R-T-B based magnet at a mass ratio of RLM alloy:RH oxide=9.6:0.4 to 5:5.

An R-TM-B hot-pressed and deformed magnet (here, R represents a rare earth metal selected from the group consisting of Nd, Dy, Pr, Tb, Ho, Sm, Sc, Y, La, Ce, Pm, Eu, Gd, Er, Tm, Yb, Lu, and a combination thereof, and TM represents a transition metal) of the present invention comprises flat type anisotropic magnetized crystal grains and a nonmagnetic alloy distributed in a boundary surface between the crystal grains, and thus the magnet of the present invention has an excellent magnetic shielding effect as compared with an existing permanent magnet since the crystal gains can be completely enclosed in the nonmagnetic alloy, so that a hot-pressed and deformed magnet with enhanced coercive force can be manufactured through a more economical process.

The present disclosure relates to a welding composition for joining high manganese steel base metals to low carbon steel base metals, as well as systems and methods for the same. The composition includes: carbon in a range of about 0.1 wt % to about 0.4 wt %; manganese in a range of about 15 wt % to about 25 wt %; chromium in a range of about 2.0 wt % to about 8.0 wt %; molybdenum in an amount of ≦ about 2.0 wt %; nickel in an amount of ≦ about 10 wt %; silicon in an amount of ≦ about 0.7 wt %; sulfur in an amount of ≦ about 100 ppm; phosphorus in an amount of ≦ about 200 ppm; and a balance comprising iron. In an embodiment, the composition has an austenitic microstructure.

A powder metal compact is disclosed. The powder metal compact includes a cellular nanomatrix comprising a nanomatrix material. The powder metal compact also includes a plurality of dispersed particles comprising a particle core material that comprises an Mg—Zr, Mg—Zn—Zr, Mg—Al—Zn—Mn, Mg—Zn—Cu—Mn or Mg—W alloy, or a combination thereof, dispersed in the cellular nanomatrix.

A sputtering target containing 20 at % to 40 at % of Te, 5 at % to 20 at % of Cu, 5 at % to 15 at % of Zr, and remainder being Al, wherein a structure of the sputtering target is comprise of an Al phase, a Cu phase, a CuTeZr phase, a CuTe phase and a Zr phase. The present invention aims to provide an Al—Te—Cu—Zr-based alloy sputtering target capable of effectively suppressing the degradation of properties caused by compositional deviation, as well as a method of manufacturing the same.