Provided is a method for producing a Ni- or Ti-based alloy product, the method capable of reliably locally cooling and effectively cooling. The method includes the steps: heating and holding a hot working material of a Ni- or Ti-based alloy after hot forging or hot ring rolling at a solution treatment temperature to obtain a material held in a heated state, and cooling the material held in a heated state to obtain a solution-treated material. The cooling step includes carrying out local cooling by contacting a cooling member with a part of a surface of the material held in a heated state.

The present disclosure relates to a method of manufacturing an aluminum alloy with excellent mechanical properties by controlling a heat treatment step and a cooling step in a process of manufacturing the aluminum alloy. In detail, there is provided a method of manufacturing an aluminum alloy, including: a heating step of heating an aluminum alloy made of an aluminum alloy composite up to 500 to 560° C.; a solution treatment step of maintaining the heated aluminum alloy for 5 to 7 hours; a cooling step of cooling the solution-treated aluminum alloy for 15 seconds to 1 minute; and an aging step of age-hardening the cooled aluminum alloy for 2.5 to 4 hours at 140 to 180° C.

According to the method of manufacturing an aluminum alloy of the present disclosure and an aluminum alloy manufactured by the method, elongation is secured by reducing the solution treatment time and strength is increased by remaining heat by relatively increasing the drop speed of a pallet between a solution treatment furnace and a cooling container, the distance between the furnace and the container, and the cooling time, thereby being able to provide an aluminum alloy having excellent mechanical properties.

Disclosed are high-strength, highly deformable aluminum alloys and methods of making and processing such alloys. More particularly, disclosed is a heat treatable aluminum alloy exhibiting improved mechanical strength and formability. The processing method includes casting, homogenizing, hot rolling, solutionizing, pre-aging and in some cases pre-straining. In some cases, the processing steps can further include cold rolling and/or heat treating.

An insert fixture has a base, a plurality of mounting brackets, and a plurality of separators. The plurality of separators extends vertically from the base and includes a plurality of grid portions extending the length of the insert fixture and a plurality of divider portions, which connect to the plurality of grid portions to form a plurality of individual component holders around one of the plurality of mounting brackets. Each individual component holder has two separated grid portion sections positioned on either side of the bracket. These grid portions have two divider portions which are also separated and positioned either side of the bracket at an angle relative to the two grid portions. The individual component holder forms a cell around the mounting bracket. The insert fixture may be constructed from a molybdenum alloy, lanthanum oxide and/or titanium zirconium molybdenum.

An insert fixture has a base, a plurality of mounting brackets, and a plurality of separators. The plurality of separators extends vertically from the base and includes a plurality of grid portions extending the length of the insert fixture and a plurality of divider portions, which connect to the plurality of grid portions to form a plurality of individual component holders around one of the plurality of mounting brackets. Each individual component holder has two separated grid portion sections positioned on either side of the bracket. These grid portions have two divider portions which are also separated and positioned either side of the bracket at an angle relative to the two grid portions. The individual component holder forms a cell around the mounting bracket. The insert fixture may be constructed from a molybdenum alloy, lanthanum oxide and/or titanium zirconium molybdenum.

Exemplary methods of cooling a semiconductor component substrate may include heating the semiconductor component substrate to a temperature of greater than or about 500° C. in a chamber. The semiconductor component substrate may be or include aluminum. The methods may include delivering a gas into the chamber. The gas may be characterized by a temperature below or about 100° C. The methods may include cooling the semiconductor component substrate to a temperature below or about 200° C. in a first time period of less than or about 1 minute.

A preparation method of a uniform low stress cone shaped charge liner includes the steps of multi-pass extrusion forming, vibration aging treatment, and cryogenic treatment. The step of multi-pass extrusion forming refers to 4 to 8 passes of extrusion deformation under the actions of a three-dimensional compressive stress and a deformation rate of 5 to 10 mm/s, having a deformation amount of 5 to 50% for each pass. The shaped charge liner prepared by the present invention has high dimensional accuracy, good geometric symmetry, low stress value, and excellent stability in the precise machining process and in use, which may significantly improve the penetration capability and stability of the shaped charge liner of high-explosive anti-tank warheads.

Process for manufacturing a part (20) including a formation of successive metal layers (20.sub.1 . . . 20.sub.n), which are superimposed on each other, each layer being formed by depositing a filler metal (15, 25), the filler metal being subjected to a supply of energy so as to become molten and to constitute, upon solidifying, said layer, the process being characterized in that the filler metal (15, 25) is an aluminum alloy including the following alloy elements (% by weight); Mg: 2.0%-5.0%; Zr: 0.5%-1.0%; Fe: 0.6%-3.0%; optionally Zn: ≤0.5%; optionally Cu: ≤0.5%; other alloy elements, in total ≤4.0%, and individually ≤1.0%; impurities: <0.05% individually, and in total <0.15%; remainder aluminum.

A nickel alloy sputtering target comprises: a nickel alloy containing an element capable of decreasing the Curie temperature of nickel, wherein an area ratio of a Ni phase having a Ni content of 99.0 mass % or more is 13% or less and an average crystal grain diameter is 100 gm or less. It is preferred that an area ratio of a high-purity Ni phase having a Ni content of 99.5 mass % or more be 5% or less.

A medical titanium alloy having high fatigue strength, and a hot processing and heat treatment method therefor and the related device thereof. The medical titanium alloy contains 3.0-6.0% of vanadium, 5.0-7.0% of aluminum, and 4.0-8.0% of copper and titanium in balance. By using the above-mentioned configuration, the present invention enables the medical titanium alloy to possess higher fatigue strength.