One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, a process system includes different materials each contained in separate ampoules. Each material is flowed into a separate portion of a showerhead contained within a process chamber via a heated gas line. From the showerhead, each material is flowed on to a substrate that sits on the surface of a rotating pedestal. Controlling the mass flow rate out of the showerhead and the rotation rate of the pedestal helps result in films with desirable material domain sizes to be deposited on the substrate.

One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, a process system includes different materials each contained in separate ampoules. Each material is flowed into a separate portion of a showerhead contained within a process chamber via a heated gas line. From the showerhead, each material is flowed on to a substrate that sits on the surface of a rotating pedestal. Controlling the mass flow rate out of the showerhead and the rotation rate of the pedestal helps result in films with desirable material domain sizes to be deposited on the substrate.

A system for jetting metal is also disclosed, which includes a nozzle orifice in connection with the inner cavity and configured to eject one or more droplets of liquid metal, a source of printing material located external to the ejector, and an alloying system located between the source of printing material and the ejector. A method for metal jetting is disclosed, which includes introducing a printing material from a feed source into an alloying system. The method for metal jetting also includes depositing an alloying material within the alloying system onto the printing material to produce an alloyed printing material, introducing the alloyed printing material into an ejector defining a cavity which can retain a printing material, melting the alloyed printing material in the cavity of the ejector, ejecting the alloyed printing material from the ejector.

A system for jetting metal is also disclosed, which includes a nozzle orifice in connection with the inner cavity and configured to eject one or more droplets of liquid metal, a source of printing material located external to the ejector, and an alloying system located between the source of printing material and the ejector. A method for metal jetting is disclosed, which includes introducing a printing material from a feed source into an alloying system. The method for metal jetting also includes depositing an alloying material within the alloying system onto the printing material to produce an alloyed printing material, introducing the alloyed printing material into an ejector defining a cavity which can retain a printing material, melting the alloyed printing material in the cavity of the ejector, ejecting the alloyed printing material from the ejector.

A multiple-layer method for forming material within a gap on a surface of a substrate is disclosed. An exemplary method includes forming a layer of first material overlying the substrate and forming a layer of second (e.g., initially flowable) material within a region of the first material to thereby at least partially fill the gap with material in a seamless and/or void less manner.

A method and system for forming material within a gap on a surface of a substrate are disclosed. An exemplary method includes depositing a soluble layer on a surface of the substrate and exposing the soluble layer to a solvent to thereby form solvated material within the gap. Exemplary methods can further include drying the solvated material and/or converting the solvated or dried material to another material.

According to one aspect of a technique of the present disclosure, there is provided a substrate processing apparatus includes: a substrate support; a process chamber; an upstream side gas guide including: a housing connected to a side portion of the process chamber and extending in a direction away from the process chamber; and partition plates arranged in a vertical direction in the housing; a distributor provided with ejection holes arranged in the vertical direction such that a gas is capable of being supplied through the ejection holes between adjacent partition plates, between the housing and an uppermost partition plate or between the housing and a lowermost partition plate; and a process chamber heater provided between the process chamber and the distributor such that a part thereof is located near an adjacent portion of the housing.

Devices and methods for controlling wafer uniformity using a gas baffle plate are disclosed. In one example, a device for plasma-based processes is disclosed. The device includes: a housing defining a process chamber and a baffle plate arranged above a wafer in the process chamber. The baffle plate is configured to control plasma distribution on the wafer. The baffle plate has a shape of an annulus that comprises a first annulus sector and a second annulus sector. The first annulus sector has a first inner radius. The second annulus sector has a second inner radius that is different from the first inner radius.

The present invention relates to coating glass for architectural or automotive use, either monolithic or laminated, having solar control properties. The coating consists of several layers of different metal oxide semiconductors (TiO.sub.2, ZnO, ZrO.sub.2, SnO.sub.2, AlO.sub.x) and a layer of metallic nanoparticles, which when superimposed on a pre-established order give the glass solar control properties. In particular the use of protective layers of n-type semiconductors around the metallic nanoparticles layer. It also relates to the method for obtaining the coating by means of the aerosol-assisted chemical vapor deposition technique, using precursor solutions containing an organic or inorganic salt (acetates, acetylacetonates, halides, nitrates) of the applicable elements and an appropriate solvent (water, alcohol, acetone, acetylacetone, etc.). The synthesis is performed at a temperature between 100 and 600° C. depending on the material to be deposited. A nebulizer converts the precursor solution into an aerosol which is submitted with a gas to the substrate surface, where due to the temperature the thermal decomposition of the precursor occurs and the deposition of each layer of the coating occurs.

Disclosed is an apparatus for venting buildings, specifically attic spaces, such vents being predominantly shape-conform to the components from which a wall or a roof is built (typically tiles, in the context of roofs), the vent typically being fabricated from a metallic, plastic, or ceramic core as well as one or more layers from other materials or compounds which modify the overall characteristics of the vent, such as the surface characteristics. Furthermore disclosed are methods of manufacturing such ventilation apparatuses.