C23C18/00

Zirconia covering element with selective coloring

The present invention relates to a covering element for a portable object made of a first material, the first material being a ceramic material having a first color, characterized in that the surface of said covering element is at least partially treated so as to exhibit at least one conversion having a different color from the first color.

Low temperature method of forming layered HT-LiCoO.SUB.2

Low temperature techniques for forming layered lithium cobalt oxide (LCO) are provided. In one aspect, a method of synthesizing layered LCO includes: forming a metal catalyst layer (e.g., platinum) on a substrate; depositing LCO onto the metal catalyst layer; and annealing the LCO under conditions sufficient to form the layered LCO on the metal catalyst layer. An adhesion layer can be deposited on the substrate, and the metal catalyst layer can be deposited onto the adhesion layer. In another aspect, a structure is provided including: a substrate; a metal catalyst layer (e.g., platinum) disposed on the substrate; and layered LCO formed on the metal catalyst layer. An adhesion layer can be disposed between the substrate and the metal catalyst layer.

COMPOSITION, POLYMER, AND METHOD OF PRODUCING SUBSTRATE

A method of producing a substrate includes: applying a composition on a metal basal plate to form a coating film; and forming a metal-containing layer on at least a part of the coating film. The composition contains a solvent, and a polymer having a first terminal structure and a second terminal structure in a single molecule. Each of the first terminal structure and the second terminal structure is at least one selected from the group consisting of a structure represented by formula (1) and a structure represented by formula (2). A.sup.1 and A.sup.2 each independently represent a monovalent group having a functional group capable of forming a chemical bond with a metal atom. L.sup.2 represents —S—, —NR—, or —NA.sup.22-, wherein A.sup.22 represents a monovalent group having a functional group capable of forming a chemical bond with a metal atom.

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HIGH STRENGTH VIBRATION DAMPING COMPONENTS
20210180675 · 2021-06-17 ·

A mechanical component that includes a core substrate and a nano-crystalline coating on at least a portion of the core substrate. The core substrate defines a resonance damping cavity. The resonance damping cavity is configured to damp a vibration in the component at a selected frequency.

HIGH STRENGTH VIBRATION DAMPING COMPONENTS
20210180675 · 2021-06-17 ·

A mechanical component that includes a core substrate and a nano-crystalline coating on at least a portion of the core substrate. The core substrate defines a resonance damping cavity. The resonance damping cavity is configured to damp a vibration in the component at a selected frequency.

Interposer, semiconductor package, and method of fabricating interposer

A semiconductor package includes: a plurality of unit redistribution layers vertically stacked, each including: a first polymer layer having a first via hole pattern; a second polymer layer formed on the first polymer layer, and having a redistribution pattern on the first polymer layer and a second via hole pattern in the first via hole pattern; a seed layer covering sidewalls and bottom surfaces of the redistribution pattern and the second via hole pattern; a conductive via plug formed in the second via hole pattern; and a conductive redistribution line formed in the redistribution pattern; a connection terminal disposed on a bottom surface of a lowermost unit redistribution layer and electrically connected to the conductive via plug; a semiconductor device mounted on the unit redistribution layers with a conductive terminal interposed therebetween. Upper surfaces of the second polymer layer, the conductive redistribution line and the conductive via plug are substantially coplanar.

Interposer, semiconductor package, and method of fabricating interposer

A semiconductor package includes: a plurality of unit redistribution layers vertically stacked, each including: a first polymer layer having a first via hole pattern; a second polymer layer formed on the first polymer layer, and having a redistribution pattern on the first polymer layer and a second via hole pattern in the first via hole pattern; a seed layer covering sidewalls and bottom surfaces of the redistribution pattern and the second via hole pattern; a conductive via plug formed in the second via hole pattern; and a conductive redistribution line formed in the redistribution pattern; a connection terminal disposed on a bottom surface of a lowermost unit redistribution layer and electrically connected to the conductive via plug; a semiconductor device mounted on the unit redistribution layers with a conductive terminal interposed therebetween. Upper surfaces of the second polymer layer, the conductive redistribution line and the conductive via plug are substantially coplanar.

Plated steel sheet having multilayer structure and manufacturing method therefor

Provided is a plated steel sheet often used as materials for vehicles, home appliances, construction and the like and, more specifically, to a plated steel sheet having a multilayer structure and a method for manufacturing the same.

Plated steel sheet having multilayer structure and manufacturing method therefor

Provided is a plated steel sheet often used as materials for vehicles, home appliances, construction and the like and, more specifically, to a plated steel sheet having a multilayer structure and a method for manufacturing the same.

METHOD OF CHEMICAL DEPOSITION OF IRIDIUM OXIDE FILM ON RIGID SUBSTRATE

A method of chemical deposition of Iridium oxide film on rigid substrate is provided. The method comprises providing a rigid substrate in a container, adding an iridium precursor and mixing the iridium precursor with water to form an iridium precursor liquid in the container, adding and mixing an oxidant with the iridium precursor liquid in the container; and depositing an iridium oxide film on the rigid substrate in the container. A chelating agent and pH adjustor can be either selectively used for stabilizing the chemical bath deposition and for adjusting pH value of the liquid. For a variety of rigid substrates to be applied, the pH adjustor can adjust the pH value within a range of 413. By employing the proposed fabrication method, it is extraordinarily advantageous of chemical alkaline as well as chemical acid deposition formula with configuration of depositing sodium-doped IrO.sub.x iridium oxide film.