C23G3/00

Substrate liquid processing apparatus, substrate liquid processing method and recording medium

A substrate processing apparatus includes a substrate holder configured to horizontally hold and rotate a substrate which has a recess and a base metal layer exposed from a bottom surface of the recess; and a pre-cleaning liquid supply configured to supply a pre-cleaning liquid such as dicarboxylic acid or tricarboxylic acid onto the substrate being held and rotated by the substrate holder, to thereby pre-clean the base metal layer. A temperature of the pre-cleaning liquid on the substrate is equal to or higher than 40° C.

TREATMENT STATION, TREATMENT PLANT, AND METHOD FOR TREATING WORKPIECES

In order to provide a device and a method for treating workpieces (102), in which an optimized workpiece treatment is possible, it is proposed that a treatment station (114) comprise a treatment chamber (136) that can be flooded for workpiece treatment.

RADAR LEVEL GAUGE AND METHOD FOR DETECTING A CLEANING PROCESS USING THE RADAR LEVEL GAUGE
20220107217 · 2022-04-07 ·

Method and system for detecting a cleaning process in a radar level gauge configured to determine a fill level of a product contained in a tank, the radar level gauge comprising a transceiver configured to provide a transmit signal, S.sub.T, to be propagated towards the product by a propagating device, to receive a reflected signal, S.sub.R, resulting from a reflection of the transmit signal at a surface of the product, and to determine a fill level in the tank based on the received reflected signal, wherein the method comprises: at a measurement position above the fill level and a known distance from a reference position near a ceiling of the tank, determining (300) a difference in signal amplitude between at least two different fill level measurements; and if the determined difference in signal amplitude exceeds a predetermined threshold value, determining (302) that a cleaning process is ongoing in the tank.

CLEANING APPARATUS, SURFACE TREATMENT APPARATUS, AND CLEANING METHOD

A cleaning apparatus 200 is provided with: a treatment tank 10, which defines a treatment space 15 by the inner surfaces (11a, 11b) thereof and on the inner surfaces of which a water-repellent coating has been applied; a cleaning liquid supply device with nozzles 24a (cleaning liquid spray nozzles) for spraying, into the treatment space 15, a mist of a cleaning liquid CL for cleaning surface treatment processing liquid PL adhering to the surface of a metal part S and/or processing liquid PL adhering to the inner surface; and a drying device, which comprises an air compressor 23a and is for supplying drying air compressed by the air compressor 23a to the treatment space 15.

Electrodeposition Coating Facility

The amount of wash water to be consumed in an electrodeposition coating facility and the amount of used wash water to be discharged that requires post-treatment are reduced. To achieve this object, an electrodeposition coating facility that includes a degreasing process section A, a post-degreasing rinse section B, a chemical conversion process section C, a post-chemical-conversion rinse section D, an electrodeposition coating section E, and a post-electrodeposition rinse section F is provided with a filtration process apparatus 4 and a wash water recycling line 5. The filtration process apparatus 4 performs a filtration process on wash water W after being used to wash an object to be coated 1 in the post-electrodeposition rinse section F. The wash water recycling line 5 feeds, to the post-chemical-conversion rinse section D, the wash water W after being subjected to the filtration process in the filtration process apparatus 4 as wash water W to be used to wash an object to be coated in the post-chemical-conversion rinse section D.

CLEANING METHOD AND CLEANING APPARATUS
20210260630 · 2021-08-26 ·

There is provided a cleaning method and a cleaning apparatus capable of removing dirt on electrical contacts, the dirt being unable to be removed with deionized water, without adversely affecting a plating solution and a substrate holder which is a member for holding a substrate.

A cleaning method according to the present disclosure is a cleaning method for a substrate holder having electrical contacts for supplying electric power to a substrate by contacting the substrate to plate the substrate, the method including a cleaning step of cleaning the electrical contacts attached to the substrate holder with a citric acid aqueous solution.

Equipment cleaning system and method

A cleaning system and method uses a tank holding a fluid detergent and an equipment assembly formed from a plurality of discrete components joined together. One or more ultrasound transducers remove one or more deposits on the equipment assembly by generating and propagating high frequency ultrasound waves into the fluid detergent while the equipment assembly is in contact with the fluid detergent.

Equipment cleaning system and method

A cleaning system and method uses a tank holding a fluid detergent and an equipment assembly formed from a plurality of discrete components joined together. One or more ultrasound transducers remove one or more deposits on the equipment assembly by generating and propagating high frequency ultrasound waves into the fluid detergent while the equipment assembly is in contact with the fluid detergent.

SUBSTRATE LIQUID PROCESSING APPARATUS, SUBSTRATE LIQUID PROCESSING METHOD AND RECORDING MEDIUM
20210002770 · 2021-01-07 ·

A substrate processing apparatus includes a substrate holder configured to horizontally hold and rotate a substrate which has a recess and a base metal layer exposed from a bottom surface of the recess; and a pre-cleaning liquid supply configured to supply a pre-cleaning liquid such as dicarboxylic acid or tricarboxylic acid onto the substrate being held and rotated by the substrate holder, to thereby pre-clean the base metal layer. A temperature of the pre-cleaning liquid on the substrate is equal to or higher than 40 C.

SUBSTRATE LIQUID PROCESSING APPARATUS, SUBSTRATE LIQUID PROCESSING METHOD AND RECORDING MEDIUM
20210002770 · 2021-01-07 ·

A substrate processing apparatus includes a substrate holder configured to horizontally hold and rotate a substrate which has a recess and a base metal layer exposed from a bottom surface of the recess; and a pre-cleaning liquid supply configured to supply a pre-cleaning liquid such as dicarboxylic acid or tricarboxylic acid onto the substrate being held and rotated by the substrate holder, to thereby pre-clean the base metal layer. A temperature of the pre-cleaning liquid on the substrate is equal to or higher than 40 C.