It is preferable that metallic sodium to be loaded to an engine valve used for an internal combustion engine such as automobile engine have high purity. However, conventionally, an organic solvent remaining in micropores on a surface of the metallic sodium have been hardly attracted attention. Provided is a method for purifying metallic sodium including steps of placing metallic sodium containing organic solvent in the micropores thereof in a melting tank which is sealed, and heating the melting tank under reduced pressure to vaporize and remove the organic solvent coating the metallic sodium.

It is preferable that metallic sodium to be loaded to an engine valve used for an internal combustion engine such as automobile engine have high purity. However, conventionally, an organic solvent remaining in micropores on a surface of the metallic sodium have been hardly attracted attention. Provided is a method for purifying metallic sodium including steps of placing metallic sodium containing organic solvent in the micropores thereof in a melting tank which is sealed, and heating the melting tank under reduced pressure to vaporize and remove the organic solvent coating the metallic sodium.

The present invention is intended to provide a roll-bonded laminate, in which an ultrathin metal layer is laminated on another metal without generation of wrinkles, cracks and the like. A roll-bonded laminate formed by lamination of at least three layers, which comprises a peelable carrier layer 10, an ultrathin metal layer 20 and a metallic foil 30, wherein the thickness of the ultrathin metal layer 20 is 0.5 ?m or more and 20 ?m or less.

The present invention is intended to provide a roll-bonded laminate, in which an ultrathin metal layer is laminated on another metal without generation of wrinkles, cracks and the like. A roll-bonded laminate formed by lamination of at least three layers, which comprises a peelable carrier layer 10, an ultrathin metal layer 20 and a metallic foil 30, wherein the thickness of the ultrathin metal layer 20 is 0.5 ?m or more and 20 ?m or less.

The hollow reactor housing contains a catalytic plate positioned within the reactor housing. The plate is constructed of alloys of at least two of Grafen, other carbon alloys, steel, platinum, and titanium. Lids tightly close both ends of the housing. The plate has at least two electrodes attached thereto that protrude through one of the lids. The housing includes deionized water. An electronic high-power pulse generator is connected to the two electrodes feeding pulses in the frequency region of nanometer to the catalytic plate.

The hollow reactor housing contains a catalytic plate positioned within the reactor housing. The plate is constructed of alloys of at least two of Grafen, other carbon alloys, steel, platinum, and titanium. Lids tightly close both ends of the housing. The plate has at least two electrodes attached thereto that protrude through one of the lids. The housing includes deionized water. An electronic high-power pulse generator is connected to the two electrodes feeding pulses in the frequency region of nanometer to the catalytic plate.

An assembly and a method of joining a first part with a second part at an attachment area that includes a localized area on the first part. The localized area is cleaned and activated by a plasma jet. An organosilicon composition is applied by plasma-enhanced chemical vapor deposition to the localized area. An adhesive is applied to the localized area and the second part is mechanically fastened to the first part in the localized area.

An assembly and a method of joining a first part with a second part at an attachment area that includes a localized area on the first part. The localized area is cleaned and activated by a plasma jet. An organosilicon composition is applied by plasma-enhanced chemical vapor deposition to the localized area. An adhesive is applied to the localized area and the second part is mechanically fastened to the first part in the localized area.

Atomic layer etching (ALE) processes are disclosed. In some embodiments, the methods comprise at least one etch cycle in which the substrate is alternately and sequentially exposed to a first vapor phase non-metal halide reactant and a second vapor phase halide reactant. In some embodiments both the first and second reactants are chloride reactants. In some embodiments the first reactant is fluorinating gas and the second reactant is a chlorinating gas. In some embodiments a thermal ALE cycle is used in which the substrate is not contacted with a plasma reactant.

Atomic layer etching (ALE) processes are disclosed. In some embodiments, the methods comprise at least one etch cycle in which the substrate is alternately and sequentially exposed to a first vapor phase non-metal halide reactant and a second vapor phase halide reactant. In some embodiments both the first and second reactants are chloride reactants. In some embodiments the first reactant is fluorinating gas and the second reactant is a chlorinating gas. In some embodiments a thermal ALE cycle is used in which the substrate is not contacted with a plasma reactant.