Printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts; embodiments utilize a grid of anodes to achieve high quality parts with features that may be small and detailed. To support grids with thousands or millions of anodes, the printhead may use matrix control with row and column drivers similar to display backplanes. Unlike display backplanes where the design goal is to display images using minimal current, the printhead may be optimized for high current density for fast electrodeposition, and for anode longevity. Current density may exceed 1000 mA per cm-squared, at least an order of magnitude greater than that of display backplanes. Anode longevity may be enhanced by using relatively large anodes compared to the grid pitch of the printhead, by lengthening the conductive paths through anodes, or both. Embodiments may be constructed by adding anode and insulation layers on top of matrix-controlled switching circuits.

Printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts; embodiments utilize a grid of anodes to achieve high quality parts with features that may be small and detailed. To support grids with thousands or millions of anodes, the printhead may use matrix control with row and column drivers similar to display backplanes. Unlike display backplanes where the design goal is to display images using minimal current, the printhead may be optimized for high current density for fast electrodeposition, and for anode longevity. Current density may exceed 1000 mA per cm-squared, at least an order of magnitude greater than that of display backplanes. Anode longevity may be enhanced by using relatively large anodes compared to the grid pitch of the printhead, by lengthening the conductive paths through anodes, or both. Embodiments may be constructed by adding anode and insulation layers on top of matrix-controlled switching circuits.

A cluster of non-collapsed nanowires, a template to produce the same, methods to obtain the template and to obtain the cluster by using the template, and devices having the cluster. The cluster and the template both have an interconnected region and an interconnection-free region.

A large-width cathode roller for producing high-strength ultra-thin copper foil includes titanium side plates and a titanium cylinder sealed by the titanium side plates, and a cathode roller core penetrated through the titanium side plates. Steel-copper explosive clad cylinders and a steel support plate are disposed in/on the side plate, inner ring surfaces of the side plates and the copper plates are connected to a copper sleeve around the cathode roller core, outer ring surfaces of the copper plates and the steel support plates are connected to a copper cylinder, inner ring surfaces of the steel support plates are connected to the cathode roller core; and multiple electrically conductive support rings on the copper cylinder are connected to the copper plates on two sides through the electrically conductive copper bars to form a conducting loop to improve the distribution uniformity of the current on the surface of the cathode roller.

A method of adhering a cover layer to a substrate includes forming an array of nano-structures on a substrate. A flowable material is applied to the substrate, the flowable material substantially enveloping the nano-structures on the substrate. The flowable material is solidified to form a cover layer on the substrate, the cover layer being anchored to the substrate via the nano-structures.

Described herein are electrochemical-additive manufacturing methods and systems using such methods. A method comprises depositing a material onto a deposition electrode by flowing a current between that deposition electrode and each of multiple individually-addressable electrodes, forming an electrode array. These currents are independently controlled based on a target map and using deposition control circuits, each coupled to one individually-addressable electrode. The target map is generated by a system controller based on various characteristics of the system (e.g., the performance of each deposition control circuit and/or individually-addressable electrode, electrolyte composition) and the desired characteristics of the deposited material (e.g., deposition location, uniformity, morphology). Furthermore, when the deposition electrode and the electrode array move relative to each other, the system controller dynamically updates the target map based on their relative positions. This movement can provide a fresh electrolyte between the electrodes and enable deposition at new locations.

A manufacturing method of an interposed substrate is provided. A metal-stacked layer comprising a first metal layer, an etching stop layer and a second metal layer is formed. A patterned conductor layer is formed on the first metal layer, wherein the patterned conductor layer exposes a portion of the first metal layer. A plurality of conductive pillars is formed on the patterned conductor layer, wherein the conductive pillars are separated from each other and stacked on a portion of the patterned conductor layer. An insulating material layer is formed on the metal-stacked layer, wherein the insulating material layer covers the portion of the first metal layer and encapsulates the conductive pillars and the other portion of the patterned conductor layer. The metal-stacked layer is removed to expose a lower surface opposite to an upper surface of the insulating material layer and a bottom surface of the patterned conductor layer.

An object of the present invention is to provide a method for purifying efficiently and easily a .sup.226Ra-containing solution obtained when .sup.225Ac is produced from a .sup.226Ra target, a method for producing a .sup.226Ra target by using the purified .sup.226Ra-containing solution obtained by the above purification method, and a method for producing .sup.225Ac including these above methods. The method for purifying a .sup.226Ra-containing solution according to the present invention is characterized by including an adsorption step (R1) of allowing .sup.226Ra ions to adsorb onto a carrier having a function of selectively adsorbing divalent cations by bringing a .sup.226Ra-containing solution (a) into contact with the carrier under an alkaline condition; and an elution step (R2) of eluting the .sup.226Ra ions from the carrier under an acidic condition.

The production of a porous copper-zinc structure includes providing copper ink, creating a 3D model of the porous copper-zinc structure, 3D printing the copper ink into a porous copper lattice structure using the 3D model, heat treatment of the porous copper lattice structure producing a heat treated porous copper lattice structure, surface modification of the heat treated porous copper lattice structure by nanowires growth on the heat treated porous copper lattice structure producing a heat treated porous copper lattice structure with nanowires, and electrodeposition of zinc onto the heat treated porous copper lattice structure with nanowires to produce the porous copper-zinc structure.

The production of a porous copper-zinc structure includes providing copper ink, creating a 3D model of the porous copper-zinc structure, 3D printing the copper ink into a porous copper lattice structure using the 3D model, heat treatment of the porous copper lattice structure producing a heat treated porous copper lattice structure, surface modification of the heat treated porous copper lattice structure by nanowires growth on the heat treated porous copper lattice structure producing a heat treated porous copper lattice structure with nanowires, and electrodeposition of zinc onto the heat treated porous copper lattice structure with nanowires to produce the porous copper-zinc structure.