C25D3/00

Metal coating film formation device and method

Provided is a metal coating film formation device capable of forming a film using a simple device configuration and in a short time, and capable of performing the formation of a film of metal coating continuously for a long period. A film formation device 1A is provided with an anode 11, a solid electrolyte film 13 disposed between the anode 11 and the base material B, and a power supply unit 16 that applies a voltage between the anode 11 and the base material B. The anode 11 is a non-porous anode comprising the same metal as the metal of the metal coating. Between the anode 11 and the solid electrolyte film 13, a porous material 14 is disposed in contact with the anode 11 and the solid electrolyte film 13. The porous material 14 includes a plurality of pores providing communication between the anode 11 and the solid electrolyte film 13 and being supplied with a metal solution L.

Metal coating film formation device and method

Provided is a metal coating film formation device capable of forming a film using a simple device configuration and in a short time, and capable of performing the formation of a film of metal coating continuously for a long period. A film formation device 1A is provided with an anode 11, a solid electrolyte film 13 disposed between the anode 11 and the base material B, and a power supply unit 16 that applies a voltage between the anode 11 and the base material B. The anode 11 is a non-porous anode comprising the same metal as the metal of the metal coating. Between the anode 11 and the solid electrolyte film 13, a porous material 14 is disposed in contact with the anode 11 and the solid electrolyte film 13. The porous material 14 includes a plurality of pores providing communication between the anode 11 and the solid electrolyte film 13 and being supplied with a metal solution L.

FILM FORMING METHOD FOR METAL FILM AND FILM FORMING APPARATUS THEREFOR

In a film forming method, in a state where a metal solution is sealed in a first accommodation chamber of a housing with a solid electrolyte membrane and a fluid is sealed in a second accommodation chamber of a placing table with a thin film, a substrate is placed on the placing table and the placing table and the housing are moved relative to each other to cause the substrate to be interposed between the solid electrolyte membrane and the thin film, the solid electrolyte membrane and the thin film are pressed against the substrate interposed therebetween to cause the solid electrolyte membrane and the thin film to conform to a surface and a rear surface of the substrate, thereby forming a metal film.

Method and chemistry for selenium electrodeposition

Techniques for electrodepositing selenium (Se)-containing films are provided. In one aspect, a method of preparing a Se electroplating solution is provided. The method includes the following steps. The solution is formed from a mixture of selenium oxide; an acid selected from the group consisting of alkane sulfonic acid, alkene sulfonic acid, aryl sulfonic acid, heterocyclic sulfonic acid, aromatic sulfonic acid and perchloric acid; and a solvent. A pH of the solution is then adjusted to from about 2.0 to about 3.0. The pH of the solution can be adjusted to from about 2.0 to about 3.0 by adding a base (e.g., sodium hydroxide) to the solution. A Se electroplating solution, an electroplating method and a method for fabricating a photovoltaic device are also provided.

Electrodeposition coating for medical devices
09821090 · 2017-11-21 · ·

The present disclosure relates generally to coating medical devices. In particular, the present disclosure provides materials and methods for coating a portion of a balloon catheter with a pharmaceutical agent using electrodeposition techniques. Although angioplasty and stenting can be effective methods for treating vascular occlusions, restenosis remains a pervasiveness problem. Therefore, coating portions of a balloon catheter with a pharmaceutical agent that inhibits restenosis can reduce the likelihood of restenosis.

Electrodeposition coating for medical devices
09821090 · 2017-11-21 · ·

The present disclosure relates generally to coating medical devices. In particular, the present disclosure provides materials and methods for coating a portion of a balloon catheter with a pharmaceutical agent using electrodeposition techniques. Although angioplasty and stenting can be effective methods for treating vascular occlusions, restenosis remains a pervasiveness problem. Therefore, coating portions of a balloon catheter with a pharmaceutical agent that inhibits restenosis can reduce the likelihood of restenosis.

Method and apparatus for electrolytically depositing a deposition metal on a workpiece

For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one anode 40, 41 and a metal deposition electrolyte AE are arranged and which has a device for electric current generation 60 and at least one current feeding device 31 with in each case at least one electrical contact element 34, 35 for making electrical contact with the workpiece; (b) bringing the at least one electrical contact element 34, 35 into contact with the workpiece; and (c) feeding electric current to the workpiece via the at least one electrical contact element 34, 35 in order that the deposition metal deposits on the workpiece. Before method step (b), in a further method step (d), deposition metal is deposited on the at least one electrical contact element 34, 35.

METHOD FOR FORMING SILVER FILM
20220033987 · 2022-02-03 ·

It is an object of the present disclosure to provide a method that allows uniformly forming a silver film by a solid electrolyte deposition. One aspect of this embodiment is a method for forming a silver film. The method includes disposing an anode, a substrate as a cathode, and a separator such that the separator is positioned between the anode and the substrate and the separator is in contact with a surface of the substrate, the separator including an electrolytic solution that contains silver ions, and applying a voltage between the anode and the substrate to form a silver film on the substrate. The separator is a porous membrane without ion exchange functional group. The electrolytic solution contains organic sulfonic acid ions. The substrate contains a crystalline metal, and a silver film is formed on the crystalline metal.

Composition for metal electroplating comprising leveling agent

A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide, said polyaminoamide comprising the structural unit represented by formula I ##STR00001##
or derivatives of the polyaminoamide of formula I obtainable by complete or partial protonation, N-functionalization or N-quaternization with a non-aromatic reactant,
wherein D.sup.6 is, for each repeating unit 1 to s independently, a divalent group selected from a saturated or unsaturated C.sub.1-C.sub.20 organic radical, D.sup.7 is, for each repeating unit 1 to s independently, a divalent group selected from straight chain or branched C.sub.2-C.sub.20 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR.sup.10, R.sup.1 is, for each repeating unit 1 to s independently, selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R.sup.2, may form a divalent group D.sup.8, and R.sup.2 is, for each repeating unit 1 to s independently, selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R.sup.1, may form a divalent group D.sup.8, and D.sup.8 is selected from straight chain or branched C.sub.1-C.sub.18 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR.sup.10, s is an integer from 1 to 250, R.sup.10 is selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl.

Pulse plating of lithium material in electrochemical devices

The present invention is directed to battery system and operation thereof. In an embodiment, lithium material is plated onto the anode region of a lithium secondary battery cell by a pulsed current. The pulse current may have both positive and negative polarity. One of the polarities causes lithium material to plate onto the anode region, and the opposite polarity causes lithium dendrites to be removed. There are other embodiments as well.