The invention relates to an optical element including a resin body having a functional surface covered with a reflective coating capable of reflecting light beams, the reflective coating including a copper layer covering at least the functional surface, a nickel layer covering the copper layer, and a chromium layer covering the nickel layer.

An electrochemical-deposition apparatus includes an electrode array, a photoconductor, an electrically conductive layer, an electromagnetic-radiation emitter, an electric-power source, and a controller. The controller is configured to direct electric power to be supplied from the electric-power source to the electrically conductive layer and direct the electromagnetic-radiation emitter to generate electromagnetic radiation. When the electric power is supplied to the electrically conductive layer and when the electromagnetic radiation is generated, the photoconductor is illuminated at a first radiation level and a first level of electric current is enabled through the photoconductor and the at least one deposition electrode. When the electric power is supplied to the electrically conductive layer and when the electromagnetic radiation is generated, the photoconductor is illuminated at a second radiation level and a second level of electric current is enabled through the photoconductor and the at least one deposition electrode.

In a method of manufacturing a semiconductor device first conductive layers are formed over a substrate. A first photoresist layer is formed over the first conductive layers. The first conductive layers are etched by using the first photoresist layer as an etching mask, to form an island pattern of the first conductive layers separated from a bus bar pattern of the first conductive layers by a ring shape groove. A connection pattern is formed to connect the island pattern and the bus bar pattern. A second photoresist layer is formed over the first conductive layers and the connection pattern. The second photoresist layer includes an opening over the island pattern. Second conductive layers are formed on the island pattern in the opening. The second photoresist layer is removed, and the connection pattern is removed, thereby forming a bump structure.

Provided is a golf shaft, capable of ensuring peeling resistance of a colored layer to endure a bending process and the like. The golf shaft has a metal element tube, and a colored plating layer being a colored layer formed on a surface of the element tube, wherein the colored plating layer has a first strike plating layer on the element tube side, a satin-like plating layer layered on a surface of the first strike plating layer, a second strike plating layer layered on a surface of the stain-like plating layer, and a decorative plating layer layered on a surface of the second strike plating layer and colored according to a color of the colored plating layer.

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

The invention relates to sheet metal packaging products, in particular tinplate or electrolytically chrome-plated sheet steel (ECCS), consisting of a sheet steel substrate (S) with a thickness in the region of 0.1 mm to 0.6 mm and a coating (B), in particular made of tin and/or chromium or chromium and chromium oxide, that is electrolytically deposited on at least one side of the sheet metal substrate. In addition, at least one surface of the sheet metal packaging product provided with the coating (B) has a surface profile with periodically repeating structure elements in at least one direction, wherein an autocorrelation function resulting from the surface profile has a plurality of side lobes with a height of at least 20%, preferably at least 30% of the height of the main lobe. These sheet metal packaging products have improved and novel surface properties.

According to one embodiment, there is provided a method for manufacturing a semiconductor device. The method includes metal electroplating on a surface of a first electrode formed on a first surface of a semiconductor substrate with a plating solution which contains aggregates of a supercritical fluid and a solution of a plating metal ion and an electrolyte. The first surface includes a recess. The surface is along with a shape of the recess. The recess has a first dimension and a second dimension, and assuming that an aspect ratio of the recess is given as a ratio of the second dimension to the first dimension, a median of a particle size distribution of the aggregates is greater than the first dimension.

A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.

An electric contact includes a multilayered coating structure. The multilayered coating structure includes an intermediate layer and a top layer arranged on top of the intermediate layer. The intermediate layer includes Bi.sub.3Ni and the top layer includes a plurality of free bismuth grains.

A method for decorating metallic or non-metallic surfaces treated with Physical Void Deposition, PVD, comprising: an electrochemical activation action of the decoration by means of an electrical circuit with electrodes in electrical contact and for at least one thereof with the mediation of an electrolytic solution towards a surface being treated; an electrically conductive surface facing one of said electrodes to form said surface being treated; at least one masking resistant to the electrochemical activation action of the decoration and interposed between the facing electrode and the surface being treated; and has the electrochemical action of activating the decoration of the treated surface occurs by electrochemical oxidation of the metallic oxide layer normally present on the electrically conductive surface whether it is placed below the PVD coating layer, i.e., performed before such PVD coating, or such electrochemical oxidation action is performed above said vacuum metallic coating, electrically conductive PVD layer; the electrochemical oxidation acts with the surface of the treated metal, its natural oxide, or the PVD coating itself, i.e., on the oxides, carbides, nitrides forming it, without any removal of metallic material but with the aesthetic modification of the treated surface in the shape determined by the aforesaid masking.