In certain aspects, a coated steel substrate comprises a single or multiple-layer electroplated aluminum coating over a steel substrate. The multiple-layer electroplated aluminum coating comprises one or more porous layers and one or more compact layers. The one or more porous layers comprise a material selected from a group consisting of aluminum and aluminum alloys. The one or more compact layers comprise a material selected from a group consisting of aluminum and aluminum alloys. In certain aspects, a method of depositing a multiple-layer aluminum coating over a steel substrate includes electroplating one or more porous aluminum layers over the steel substrate. The one or more porous aluminum layers comprise a material selected from a group consisting of aluminum and aluminum alloys. One or more compact aluminum layers are electroplated over the steel substrate. The one or more compact aluminum layers comprise a material selected from a group consisting of aluminum and aluminum alloys.

According to one embodiment, there is provided a method for manufacturing a semiconductor device. The method includes metal electroplating on a surface of a first electrode formed on a first surface of a semiconductor substrate with a plating solution which contains aggregates of a supercritical fluid and a solution of a plating metal ion and an electrolyte. The first surface includes a recess. The surface is along with a shape of the recess. The recess has a first dimension and a second dimension, and assuming that an aspect ratio of the recess is given as a ratio of the second dimension to the first dimension, a median of a particle size distribution of the aggregates is greater than the first dimension.

The present application provides a method for improving a pit defect formed after a copper electroplating process, comprising: forming a dielectric layer on a wafer; etching the dielectric layer to form a trench; forming a seed barrier layer on the surface of the trench; pre-cleaning the wafer to increase the wetness of the trench on the wafer; filling the trench with copper by means of electroplating; polishing the upper surface of the trench to planarize the upper surface of the trench. The wetness of the wafer surface can be increased by pre-cleaning a via. An excessively dry wafer surface leads to a poor wetness effect when the wafer enters water, a bubble is difficult to be discharged, a void is easy to be generated in electroplating. By the pre-cleaning step, the problem of a poor wetness effect occurring when the wafer enters water can be effectively improved.

Silver electroplating compositions deposit rough, matt silver having needle-like grain structures. The rough, matt, silver deposits enable good adhesion with dielectric materials, even in environments of high relative humidity.

A method of manufacturing a bright surface product comprises a step of performing electroless plating to form a first metal film on a base coat layer formed on a substrate, a step of performing electrolytic plating to form a second metal film thereon so that the bonding strength between each film of a multi-layered metal film comprising the first metal film and the second film is higher than the bonding strength between the base coat layer and the first metal layer, a step of integrally and discontinuously segmentalizing the multi-layered metal film with cracks to form an island-like metal film comprising a collection of fine multi-layered metal regions with island-like structures; and a step of forming a translucent top coat layer to cover the fine multi-layered metal regions of the island-like metal film and enter into the cracks to make contact with the base coat layer.

A manufacturing method of copper foil and circuit board assembly for high frequency transmission are provided. Firstly, a raw copper foil having a predetermined surface is produced by an electrolyzing process. Subsequently, a roughened layer including a plurality of copper particles is formed on the predetermined surface by an arsenic-free electrolytic roughening treatment and an arsenic-free electrolytic surface protection treatment. Thereafter, a surface treatment layer is formed on the roughened layer, and the roughened layer is made of a material which includes at least one kind of non-copper metal elements and the concentration of the non-copper metal elements is smaller than 400 ppm. By controlling the concentration of the non-copper elements, the resistance of the copper foil can be reduced.

A Ni-plated steel sheet according to an aspect of the present invention includes: a base steel sheet; an Fe—Ni diffusion alloy region disposed on the base steel sheet; and a Ni plating region disposed on the Fe—Ni diffusion alloy region, in which an average equivalent circle diameter of crystal grains made of Ni (fcc) in the Ni plating region measured in a cross section perpendicular to a rolled surface of the base steel sheet is 0.2 to 4.0 μm.

Provided is a technique that allows measuring a film thickness of a substrate in a plating process.

A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, a rotation mechanism 30, a plurality of contact members 50, a coil 60, a current sensor 65, and a film thickness measuring device 70. The plurality of contact members 50 are disposed in a substrate holder and arranged in a circumferential direction of the substrate holder. The plurality of contact members 50 contact an outer peripheral edge of a lower surface of a substrate to supply electricity to the substrate in the plating process. The coil 60 generates a current by an electromagnetic induction due to a magnetic field generated by a current flowing into the contact member, the contact member being rotate together with the substrate holder in the plating process. The current sensor 65 detects the current generated in the coil. The film thickness measuring device 70 measures a film thickness of the substrate based on the current detected by the current sensor in the plating process.

A method for plating a work piece includes forming a work piece, where the work piece includes first and second segments that are electrically isolated. The first segment is connected in a first circuit and the second segment is connected in a second circuit. The first circuit may include a first power source and the second circuit may include a second power source. The work piece and the first and second segments may be disposed in a common solution, and current may be applied in the first circuit and the second circuit to create first and second metal surfaces. The first and second metal surfaces may be made from the same base metal. The first and second metal surfaces may be created simultaneously, with the work piece and the first and second segments disposed in a common solution.

A piston ring includes a base body having an inner circumferential surface, first and second flank surfaces and an outer circumferential surface, wherein a first hard chromium layer with a crack network is applied to the outer circumferential surface and has a crack density of 10-250 cracks per mm and solid particles having an average particle size of 0.01-10 μm embedded in cracks of the first hard chromium layer, a second hard chromium layer having a crack network applied to the first hard chromium layer and having a crack density of the crack network of 10-250 cracks per mm, no solid particles being embedded in the cracks thereof, where the cracks have an average width of 1-15 μm, the cracks are electrolytically expanded and the surface proportion of the cracks are 3-25% based on a total surface of the second hard chromium layer.