The invention relates to a substrate (1) for electrical circuits comprising at least one first composite layer (2) which is produced by means of roll cladding and, after said roll cladding, has at least one copper layer (3) and an aluminium layer (4) attached thereon, wherein at least the surface side of the aluminium layer (4) facing away from the copper layer (3) is anodized for the generation of an anodic or insulating layer (5) made of aluminium oxide, and wherein the anodic or insulating layer (5) made of aluminium oxide is connected to a metal layer (7) or at least one second composite layer (2) or at least one paper-ceramic layer (11) via at least one adhesive layer (6, 6).

Provided is a metal film forming apparatus capable of forming a uniform metal film on a surface of a substrate by uniformly pressurizing an electrolyte membrane against the surface of the substrate. The film forming apparatus includes first and second film forming units, a coupling portion that couples the first and second film forming units together, a pressure device including a pressure unit that pressurizes substrates with electrolyte membranes of the respective film forming units via the coupling portion, and a power supply unit adapted to apply a voltage across each anode and each substrate. The film forming units are coupled to the coupling portion via their respective first elastic bodies that elastically deform in the pressurization direction of the pressure unit.

The invention relates to a method and system for preventing corrosion of at least one metallic structure in an electrolyte medium, comprising applying a superimposed time-varying frequency electromagnetic wave to the structure, the method comprising the steps of generating a superimposed time-varying frequency electromagnetic wave (DAC wave) where an AC driving signal with time-varying frequency is riding on a DC output with a predefined DC bias voltage, transmitting the DAC wave current to one or more emitters, emitting the DAC wave via the one or more emitters, placing the one or more emitters at a spaced distance from the metallic structure, subjecting the metallic structure to the DAC wave current, controlling the negative return current of the DAC wave from the metallic structure, such that the DAC wave is distributed across the structure surface and directly excites a target region of the metallic structure, and wherein the excitation induces a flow of ionic current having a DC component travelling in a pulsating and time-varying manner in the target region and effects induced vibration of electrons and molecules in the target region. The method and the system of the invention significantly reduce capital costs and require very low energy, they avoid environmentally unfriendly final products, and are able to result in effective corrosion protection of metallic structures in different surrounding conditions.

A method of inhibiting corrosion of duplex stainless steel by aqueous acidic solution, comprises carrying out a preliminary treatment which is passivation of the steel while exposing the steel to a first aqueous acidic solution containing at least one organic corrosion inhibitor able to adsorb to a steel surface, so as to deposit a passivating and corrosion inhibiting film on the steel surface; and thereafter during a second period of time exposing the steel to a second aqueous acidic solution different from the first aqueous acidic solution and also containing at least one organic corrosion inhibitor able to adsorb to a steel. The second aqueous acidic solution maintains the film on the steel surface, such that weight loss through corrosion in the second period of time is lower than the weight loss which would be observed with the same second aqueous acidic solution but without carrying out the preliminary treatment.

A method of inhibiting corrosion of duplex stainless steel by aqueous acidic solution, comprises carrying out a preliminary treatment which is passivation of the steel while exposing the steel to a first aqueous acidic solution containing at least one organic corrosion inhibitor able to adsorb to a steel surface, so as to deposit a passivating and corrosion inhibiting film on the steel surface; and thereafter during a second period of time exposing the steel to a second aqueous acidic solution different from the first aqueous acidic solution and also containing at least one organic corrosion inhibitor able to adsorb to a steel. The second aqueous acidic solution maintains the film on the steel surface, such that weight loss through corrosion in the second period of time is lower than the weight loss which would be observed with the same second aqueous acidic solution but without carrying out the preliminary treatment.

A cationic electrodeposition paint composition comprising a cationic base-containing resin (A), a blocked polyisocyanate compound (B), and a modified imidazole (C) having a specific structure, wherein the cationic base-containing resin (A) is a cationic base-containing epoxy resin and/or a cationic base-containing acrylic resin.

A manufacturing method of a mold, the mold having at its surface a plurality of recessed portions whose two-dimensional size is not less than 10 nm and less than 500 nm when viewed in a direction normal to the surface, the method including: (a) providing a mold base, (b) partially anodizing an aluminum alloy layer, thereby forming a porous alumina layer which has a plurality of minute recessed portions; and (c) after step (b), bringing the porous alumina layer into contact with a first etching solution, thereby enlarging the plurality of minute recessed portions of the porous alumina layer. Step (a) of providing the mold base includes (a1) providing a metal base, (a2) forming an aluminum alloy layer on the metal base, and (a3) forming a surface protection layer on the aluminum alloy layer. Step (a2) and step (a3) are performed in a same chamber.

An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.

Structures, devices and methods are provided for forming nanowires on a substrate. A first protruding structure is formed on a substrate. The first protruding structure is placed in an electrolytic solution. Anodic oxidation is performed using the substrate as part of an anode electrode. One or more nanowires are formed in the protruding structure. The nanowires are surrounded by a first dielectric material formed during the anodic oxidation.

The present invention concerns a method for preparing a composite material comprising electrically conductive or semiconductive nano-objects of elongate shape and an electrically conductive polymer matrix, said method comprising a step consisting in electrochemically deposing said matrix on said nano-objects using a pulsed galvanostatic technique. The present invention also concerns the composite material thus obtained and uses thereof.