Methods and apparatus for forming porous silicon layers are provided. In some embodiments, an anodizing bath includes: a housing having a first volume to hold a chemical solution; a cathode disposed within the first volume at a first side of the housing; an anode disposed within the first volume at a second side of the housing, opposite the first side, wherein a face of each of the cathode and the anode have a given surface area; a substrate holder configured to retain a plurality of substrates along a perimeter thereof within the first volume in a plurality of substrate holding positions, a plurality of vent openings fluidly coupled to the first volume to release process gases, wherein a top of each of the plurality of vent openings are disposed above a chemical solution fill level in the first volume.

The invention discloses an anodization sealing process for an aluminum or aluminum alloy element for vehicles, including the steps for rinsing with pure water, electrolysis, rinsing once again, electrical deposition sealing, rinsing with pure water several times and baking. The aluminum or aluminum alloy element for vehicles obtained thus has improved alkali resistance and erosion resistance.

An anodic-oxidation equipment for forming a porous layer on a substrate to be treated, including: an electrolytic bath filled with an electrolytic solution; an anode and a cathode disposed in the electrolytic solution; and a power supply for applying current between the anode and the cathode in the electrolytic solution, wherein the anode is the substrate to be treated, and the cathode is a silicon substrate having a surface on which a nitride film is formed. This provides a cathode material in anodic-oxidation for forming porous silicon by an electrochemical reaction in an HF solution, the cathode material having a resistance to electrochemical reaction in an HF solution and no metallic contamination, etc., and furthermore, being less expensive than a conventional cathode material. Furthermore, high-quality porous silicon is provided at a lower cost than has been conventional.

A method of forming a downhole tool comprises contacting at least one downhole structure comprising at least one metal material with a molten electrolyte comprising anhydrous sodium tetraborate. Electrical current is applied to at least a portion of the at least one downhole structure to form at least one borided downhole structure comprising at least one metal boride material. Other methods of forming a downhole tool, and a downhole tool are also described.

The present subject matter relates to techniques of electrolytic oxidation for composite materials. In an example, a method includes immersing a composite material into an electrolytic solution for electrolytic oxidation, wherein the composite material comprises a metal alloy substrate and a second substrate. The method further includes providing a predetermined voltage to the electrolytic solution after every predefined time interval, wherein the voltage triggers electrolytic oxidation of the metal alloy substrate.

An oxidation apparatus of planar metal surfaces, comprises: a tank within which the planar metal surface being treated is laid; an electrical power supply circuit with the two heads of the electrical power supply of the circuit placed in contact with electrodes with high electrical conductivity; a first planar electrode is placed below the metal surface being treated on a bottom of the aforementioned tank; an electrolyte is placed in the tank to close the electrolytic oxidation circuit; a second electrode is placed sliding and spaced on the planar metal surface under treatment in an immersed position at the level of the electrolyte in the tank; and it has the second electrode constituted by a conductive roller placed so as to roll on the planar metal surface being treated, avoiding contact between the cylindrical surface of the roller electrode and the planar metal surface being treated by means of the interposition of a permeable spacer element; the permeable spacer element is made of material resistant to the electrolytic action of oxidation and at least placed on one of the two surfaces, the cylindrical one of the roller electrode or the planar metallic one being treated, neither of which must come into contact.

The invention relates to a method of processing of materials using a moving interface, the method comprising: providing a working material, the working material comprising a substrate with a metallic film on at least one side of the substrate; providing an energy source adjacent to the working material, where the energy source is electrical current between a cathode and the working material as an anode; providing for relative controlled movement between the working material and the energy source, where the relative controlled movement is a motor attached to the working material via a linkage; activating the energy source such that the energy processes the working material; moving the energy source and/or the working material relative to the other to control the amount of processing of the working material achieved by the energy, where the processing of the working material is anodization; immersing the working material at a controlled speed into an anodizing bath equipped with a cathode; starting anodization of the metallic film at the edge of the metallic film furthest from the anode connection and just below the anodization bath, and immersing the working material into the bath such that the anodization is moved up the metallic film towards the edge nearest the anode connection, resulting in a complete conversion to oxide, except for a non-anodized small metal or conductive edge where the anode voltage is connected to the workpiece.

An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.

Provided is an implant having a controlled generation rate of reactive oxygen species and a method of controlling generation of reactive oxygen species using the same. The implant having a controlled generation rate of reactive oxygen species according to the present invention includes a body formed of a metallic material and having a groove, a first filling metal filling one region of the groove, and a second filling metal filling the groove on the first filling metal, wherein the second filling metal has an ionization tendency different from that of the first filling metal.

Provided is an implant having a controlled generation rate of reactive oxygen species and a method of controlling generation of reactive oxygen species using the same. The implant having a controlled generation rate of reactive oxygen species according to the present invention includes a body formed of a metallic material and having a groove, a first filling metal filling one region of the groove, and a second filling metal filling the groove on the first filling metal, wherein the second filling metal has an ionization tendency different from that of the first filling metal.