C25D15/00

FORMATION OF A BARRIER COATING USING ELECTROPHORETIC DEPOSITION OF A SLURRY
20230220580 · 2023-07-13 ·

Methods are provided for forming a coating on a surface of a substrate. The method may include: applying a negative charge to the surface of the substrate; electrophoretically depositing a slurry layer onto the surface of the substrate; and densifying the slurry layer on the surface of the substrate at a sintering temperature to form a sintered layer of the coating. The slurry layer may include a plurality of EBC material particles, a cationic polyelectrolyte, a plurality of polymeric binder particles, and a solvent. The plurality of EBC material particles may comprise barium strontium aluminosilicate (BSAS), mullite, silicon, rare earth compounds, or combinations thereof.

FORMATION OF A BARRIER COATING USING ELECTROPHORETIC DEPOSITION OF A SLURRY
20230220580 · 2023-07-13 ·

Methods are provided for forming a coating on a surface of a substrate. The method may include: applying a negative charge to the surface of the substrate; electrophoretically depositing a slurry layer onto the surface of the substrate; and densifying the slurry layer on the surface of the substrate at a sintering temperature to form a sintered layer of the coating. The slurry layer may include a plurality of EBC material particles, a cationic polyelectrolyte, a plurality of polymeric binder particles, and a solvent. The plurality of EBC material particles may comprise barium strontium aluminosilicate (BSAS), mullite, silicon, rare earth compounds, or combinations thereof.

Coatings and coated surfaces including low-surface energy inorganic particles
11542621 · 2023-01-03 · ·

Articles comprising a substrate and a coating are described. In some examples, the coating is disposed on at least one region of the surface and comprises at least one hydrophobic layer. In some instances, the hydrophobic layer comprises a composite comprising a single metallic element or metallic compound and at least one type of surface-modified inorganic particles to provide a metal-based matrix. In certain examples, the at least one type of surface-modified inorganic particles within the metal-based matrix is embedded within the metal-based matrix and is separate from the single metallic element or metallic compound in the metal-based matrix. Processes for producing the coatings and articles are also described.

Coatings and coated surfaces including low-surface energy inorganic particles
11542621 · 2023-01-03 · ·

Articles comprising a substrate and a coating are described. In some examples, the coating is disposed on at least one region of the surface and comprises at least one hydrophobic layer. In some instances, the hydrophobic layer comprises a composite comprising a single metallic element or metallic compound and at least one type of surface-modified inorganic particles to provide a metal-based matrix. In certain examples, the at least one type of surface-modified inorganic particles within the metal-based matrix is embedded within the metal-based matrix and is separate from the single metallic element or metallic compound in the metal-based matrix. Processes for producing the coatings and articles are also described.

Bathless metal-composite electroplating

A bathless plating for a conductive material with composite particles or with high surface coverage. The setup for the bathless electro-plating includes a cathode, a composite mixture, a membrane, and an anode. The cathode is a conductive material. The composite mixture comprises a metal salt, an acid, and a composite material. The composite mixture is applied to the cathode. A hydrophilic membrane is applied to the composite mixture. An anode, with oxidizing properties, is applied to the membrane. A current is applied to the bathless setup. Upon removing the current and composite mixture from the cathode, a metal-based composite coating remains on the cathode.

Bathless metal-composite electroplating

A bathless plating for a conductive material with composite particles or with high surface coverage. The setup for the bathless electro-plating includes a cathode, a composite mixture, a membrane, and an anode. The cathode is a conductive material. The composite mixture comprises a metal salt, an acid, and a composite material. The composite mixture is applied to the cathode. A hydrophilic membrane is applied to the composite mixture. An anode, with oxidizing properties, is applied to the membrane. A current is applied to the bathless setup. Upon removing the current and composite mixture from the cathode, a metal-based composite coating remains on the cathode.

Composite sheet for shielding electromagnetic and radiating heat including graphene sheet
11515055 · 2022-11-29 · ·

A composite sheet for shielding electromagnetic and radiating heat includes: a first layer formed of metal; and a second layer that is a graphene layer formed on one surface of the first layer and including charged chemically modified graphene such that thermal conductivity and electromagnetic shielding ability are improved while securing economic efficiency by using the second layer including the charged chemically modified graphene and the graphene flakes.

Composite sheet for shielding electromagnetic and radiating heat including graphene sheet
11515055 · 2022-11-29 · ·

A composite sheet for shielding electromagnetic and radiating heat includes: a first layer formed of metal; and a second layer that is a graphene layer formed on one surface of the first layer and including charged chemically modified graphene such that thermal conductivity and electromagnetic shielding ability are improved while securing economic efficiency by using the second layer including the charged chemically modified graphene and the graphene flakes.

Method for doping using electric field

A doping method using an electric field includes stacking a sacrificial layer on a doped layer, disposing a doping material on the sacrificial layer, disposing electrodes on the doping material and the doped layer, respectively, and doping the doping material into the doped layer through oxidation, diffusion, and reduction of the doping material by the electric field.

Method for doping using electric field

A doping method using an electric field includes stacking a sacrificial layer on a doped layer, disposing a doping material on the sacrificial layer, disposing electrodes on the doping material and the doped layer, respectively, and doping the doping material into the doped layer through oxidation, diffusion, and reduction of the doping material by the electric field.