An electrochemical deposition system having two or more electrochemical deposition modules arranged on a common platform and configured for depositing one or more metals on a substrate is described. Each electrochemical deposition module includes an anode compartment configured to contain a volume of anolyte fluid, a cathode compartment configured to contain a volume of catholyte fluid, and a membrane separating the anode compartment from the cathode compartment. Each electrochemical deposition module further includes a workpiece holder configured to hold opposing edges of a flexible workpiece between first and second leg members via a clamping mechanism, and a loader module configured to position the flexible workpiece in the workpiece holder while holding the flexible workpiece using an air cushion on each opposing planar surface of the flexible workpiece.

An electrochemical deposition system having two or more electrochemical deposition modules arranged on a common platform and configured for depositing one or more metals on a substrate is described. Each electrochemical deposition module includes an anode compartment configured to contain a volume of anolyte fluid, a cathode compartment configured to contain a volume of catholyte fluid, and a membrane separating the anode compartment from the cathode compartment. Each electrochemical deposition module further includes a workpiece holder configured to hold opposing edges of a flexible workpiece between first and second leg members via a clamping mechanism, and a loader module configured to position the flexible workpiece in the workpiece holder while holding the flexible workpiece using an air cushion on each opposing planar surface of the flexible workpiece.

Techniques herein provide a workpiece handling and loading apparatus for loading, unloading, and handling relatively flexible and thin substrates for transport and electrochemical deposition. Such a system assists with workpiece holder exchange between a delivery cartridge or magazine, and a workpiece holder. Embodiments include a workpiece handler configured to provide an air cushion to a given workpiece, and maneuvering to a given workpiece holder that can edge clamp the workpiece.

Techniques herein provide a workpiece holder that can hold relatively flexible and thin workpieces for transport and electrochemical deposition while avoiding electroplating fluid wetting contacts or contact regions of a given workpiece. A workpiece holder frame holds a workpiece by gripping the workpiece on opposing sides of the workpiece. A flexure structure is used for clamping a given workpiece and for providing an electrical path for supplying a current to the workpiece. An elastomer covering provides sealing and insulation of the electrical flexure structure. The workpiece holder also provides tension to the workpiece to help hold the workpiece flat during processing. Each flexure structure can provide an independent electrical path to the workpiece surface.

A cleaning apparatus is provided. This cleaning apparatus includes an inlet, an outlet, a first conveyance path, a second conveyance path, a cleaning unit disposed on the first conveyance path and configured to clean the target object in a non-contacting manner, and a drying unit disposed on the first conveyance path and configured to dry the target object in a non-contacting manner. The first conveyance path and the second conveyance path are vertically arranged side by side. The second conveyance path is positioned above the first conveyance path and connected with the outlet at an end point. The second conveyance path functions as a stocker configured to temporarily store the target object.

To manufacture a chamber component for a processing chamber, an aluminum coating is formed on an article comprising impurities, the aluminum coating being substantially free from impurities.

To partially or locally control a plating film thickness on a polygonal substrate. There is provided a regulation plate for adjusting a current between an anode and the polygonal substrate. This regulation plate includes a main body that has an edge forming a polygonal opening through which the current passes and an attachable/detachable shielding member to shield at least a part of the polygonal opening.

A leak check method includes: performing a first inspection of measuring a pressure in an internal space formed by a seal of the substrate holder, while evacuating the internal space, and detecting that the pressure reaches a first pressure threshold value within a predetermined first inspection time; performing a second inspection of closing the internal space that has been evacuated, measuring the pressure in the closed internal space, and detecting that the pressure in the closed internal space does not exceed a second pressure threshold value within a predetermined second inspection time; and performing a third inspection of measuring a pressure difference between the pressure in the closed internal space and a vacuum pressure in a master container, and detecting that an amount of increase in the pressure difference within a predetermined third inspection time is kept equal to or below a pressure difference threshold value.

Various embodiments herein relate to methods and apparatus for electroplating metal onto substrates. In various cases, a reference electrode may be modified to promote improved electroplating results. The modifications may relate to one or more of the reference electrode's shape, position, relative conductivity compared to the electrolyte, or other design feature. In some particular examples the reference electrode may be dynamically changeable, for example having a changeable shape and/or position. In a particular example the reference electrode may be made of multiple segments. The techniques described herein may be combined as desired for individual applications.

An electroplating apparatus including an anode and a cathode, a power supply, and a regulating plate is provided. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate includes an insulating grid plate and a plurality of magnetic components. The plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate. An electroplating method is also provided.